Conferences related to Backplanes

Back to Top

2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Consumer Electronics (ICCE)

The International Conference on Consumer Electronics (ICCE) is soliciting technical papersfor oral and poster presentation at ICCE 2018. ICCE has a strong conference history coupledwith a tradition of attracting leading authors and delegates from around the world.Papers reporting new developments in all areas of consumer electronics are invited. Topics around the major theme will be the content ofspecial sessions and tutorials.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


More Conferences

Periodicals related to Backplanes

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


More Periodicals

Most published Xplore authors for Backplanes

Back to Top

Xplore Articles related to Backplanes

Back to Top

A framework for scaling future backplanes

IEEE Communications Magazine, 2012

As line interfaces in communications chassis transition to 100 Gb/s and higher per port, many in the industry question when electrical backplanes inside these chassis will give way to optical ones. Provided that the maximum card- to-card distance over a backplane remains at one meter, two observations point to an electrical-to-optical transition near the end of this decade: commercial links ...


Practical Cache Design Techniques For Today's RISC And CISC CPUS

Electro International, 1991, 1991

Cache memories are moving into the forefront of popularity. Most microprocessor system designers can now expect to be called upon to design or implement a cache at some time in their carreers. It is somewhat difficult deciding where to start when first confronted with the task of designing a cache from scratch. This paper will focus on techniques which can ...


Status And Trends In Optical Interconnects

LEOS '92 Conference Proceedings, 1992

None


Technology '88: industrial electronics

IEEE Spectrum, 1988

The industrial electronics scene during 1987 is highlighted. Among the important trends are standard backplanes for programmable controllers; sensors with greater ruggedness and sensitivity; expert systems suitable for online application; and self-protecting power switches. An expert opinion is offered by Richard C. Born, a professor of electrical engineering and computer science at the Milwaukee School of Engineering, who focuses on ...


Optical, optomechanical, and optoelectronic design and operational testing of a multi-stage optical backplane demonstration system

Proceedings of Massively Parallel Processing Using Optical Interconnections, 1996

In this paper, we describe the optical, optomechanical, and optoelectronic design of a multistage optical backplane demonstration system. In addition, operational testing and performance is discussed.


More Xplore Articles

Educational Resources on Backplanes

Back to Top

IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Backplanes"

IEEE-USA E-Books

  • A framework for scaling future backplanes

    As line interfaces in communications chassis transition to 100 Gb/s and higher per port, many in the industry question when electrical backplanes inside these chassis will give way to optical ones. Provided that the maximum card- to-card distance over a backplane remains at one meter, two observations point to an electrical-to-optical transition near the end of this decade: commercial links transition from electrical to optical at the bandwidth-distance product of 100 Gb/s .m [1], and backplane line rates double every two process nodes and will reach 100 Gb/s in four process nodes. But optical solutions will need to overcome incumbency, or economics will call for electrical backplane solutions. To set up a framework for comparing backplane solutions, this article first defines a canonical backplane model to enumerate possible backplane implementations. Using this model, this article identifies 10 practical future backplane implementations, of which four are electrical and six optical. This article further describes how electrical solutions could be viable beyond this decade. It then outlines three necessary conditions for optical solutions to unseat the incumbent. Finally, it argues that optical solutions have an inherent advantage to scale systems with inter-chassis links, an advantage that could tip the balance in favor of optics in future backplanes.

  • Practical Cache Design Techniques For Today's RISC And CISC CPUS

    Cache memories are moving into the forefront of popularity. Most microprocessor system designers can now expect to be called upon to design or implement a cache at some time in their carreers. It is somewhat difficult deciding where to start when first confronted with the task of designing a cache from scratch. This paper will focus on techniques which can be used in microprocessor cache designs to improve system throughput. Examples are shown using Intel's i486 processor, and the P3000 RISC processor.

  • Status And Trends In Optical Interconnects

    None

  • Technology '88: industrial electronics

    The industrial electronics scene during 1987 is highlighted. Among the important trends are standard backplanes for programmable controllers; sensors with greater ruggedness and sensitivity; expert systems suitable for online application; and self-protecting power switches. An expert opinion is offered by Richard C. Born, a professor of electrical engineering and computer science at the Milwaukee School of Engineering, who focuses on developments in sensors.<<ETX>>

  • Optical, optomechanical, and optoelectronic design and operational testing of a multi-stage optical backplane demonstration system

    In this paper, we describe the optical, optomechanical, and optoelectronic design of a multistage optical backplane demonstration system. In addition, operational testing and performance is discussed.

  • The Airplane Information Management System: an integrated real-time flight-deck control system

    Honeywell is completing design and will build hardware for the new Boeing 777 integrated Airplane Information Management System (AIMS). AIMS functions have time constraints from hard real-time to non-real-time, and criticality levels from flight critical to nonessential. The challenge is that these functions share time, memory, and input/output (I/O) on a redundant, distributed multiprocessor. An innovative offline scheduling tool and table driven bus protocol control data transfers and Ada process synchronization with verifiable resource allocation, latency control, and performance.<<ETX>>

  • The Proposed IEEE 896 Futurebus - A Solution to the Bus Driving Problem

    The Futurebus solves, for the first time, the fundamental problems associated with driving a densely populated backplane-as a result, it provides significant improvements in both speed and data integrity.

  • Progressive avionics packaging technologies

    The author describes technologies that address the packaging, cooling, and interconnect concerns for avionics that are applicable to current aircraft and future weapon platforms, as well as retrofit systems. To meet added functional requirements, electronic devices must shrink to allow more devices on a module and to allow processing/interconnection speeds to increase. This however, produces a tremendous power density. This intensified heat load must be removed so that the components will remain reliable. The various device technologies are creating coefficient-of-thermal-expansion mismatch, thus creating failures. The number of interconnections at the chip and system level must also decrease to increase system reliability. Current and future device technologies are discussed.<<ETX>>

  • Programming connections for a flexible test system

    An important feature of a test system is the ability to make programmed connections between the UUT and test instruments. This paper describes a part of the ENCOMPASS software package that provides user-friendly support for defining, validating, and executing programmed connections within a flexible VXIbus-based test system.<<ETX>>

  • Security features in Ethernet switches for access networks

    Service providers in the Asia Pacific region are increasingly using xDSL in access networks. In addition to cost advantage, thanks to technologies like PoVDSL0 and 10BaseS0, Ethernet is fast replacing ATM as the technology for last mile access, backplanes and metro area networks. Intelligent, wire-speed Ethernet switches plays a vital role to ensure that last mile xDSL technologies can be administered cost effectively. There has been an ever- increasing demand for new security features to be incorporated in Ethernet switches in access networks. Traditionally, the focus of security in Ethernet switches had been to protect the office LAN from the outside world. But with the advent of Ethernet in access networks, the switch has to police all users and applications, to ensure secure and risk-free access of services by genuine users. Infineon's PLB2800 not only incorporates some of the standard security features, but also allows customers to implement proprietary features essential for access networks. These include VLAN based security, port locking, address locking, port authentication, stacked VLAN support (similar to MPLS tunnel concept0), broadcast storm control and packet filtering/monitoring based on layer 2/3 or higher information.



Standards related to Backplanes

Back to Top

IEEE Standard for Backplane Electrical Performance


IEEE Standard for Electrical Characteristics of Backplane Transceiver Logic (BTL) Interface Circuits


IEEE Standard for Space Applications Module, Extended Height Format E Form Factor

This standard establishes the design requirements for a module designated for use in spacecraft, boosters, and other highly rugged, conductively cooled environments. The requirements herein serve to specify the mechanical design of the module.


Standard for a Simple 32-Bit Backplane Bus: NuBus



Jobs related to Backplanes

Back to Top