Conferences related to Contamination Control

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2020 IEEE International Power Modulator and High Voltage Conference (IPMHVC)

This conference provides an exchange of technical topics in the fields of Solid State Modulators and Switches, Breakdown and Insulation, Compact Pulsed Power Systems, High Voltage Design, High Power Microwaves, Biological Applications, Analytical Methods and Modeling, and Accelerators.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)

The scope of the 2020 IEEE/ASME AIM includes the following topics: Actuators, Automotive Systems, Bioengineering, Data Storage Systems, Electronic Packaging, Fault Diagnosis, Human-Machine Interfaces, Industry Applications, Information Technology, Intelligent Systems, Machine Vision, Manufacturing, Micro-Electro-Mechanical Systems, Micro/Nano Technology, Modeling and Design, System Identification and Adaptive Control, Motion Control, Vibration and Noise Control, Neural and Fuzzy Control, Opto-Electronic Systems, Optomechatronics, Prototyping, Real-Time and Hardware-in-the-Loop Simulation, Robotics, Sensors, System Integration, Transportation Systems, Smart Materials and Structures, Energy Harvesting and other frontier fields.


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Periodicals related to Contamination Control

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Control Systems Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Control Systems Technology, IEEE Transactions on

Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.


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Most published Xplore authors for Contamination Control

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Xplore Articles related to Contamination Control

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Contamination Control Strategy based on Particle Flow Behavior near Fast Moving Devices in Flat Panel Display Fabrication Cleanroom

2006 SICE-ICASE International Joint Conference, 2006

In flat panel display (FPD) fields, the defect rate of the final products yields the rate of particle deposition on FPD panels. Every best endeavor has been made to maintain a clean fabrication environment. However, contamination by airborne particles is still significant. Moreover, contamination by particles near fast moving devices such as a lift or loader has been reported as ...


Advanced contamination control methods for yield enhancement

2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2015

Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control during and after the processes. Methods for detection of airborne and surface molecular contaminants were developed to meet the challenging requirements for More Moore and More than Moore applications. Qualitative and quantitative contamination analysis of organic and ...


Particle contamination control technology in electron beam mask writing system for next-generation mask fabrication

Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468), 2001

Electron beam mask writing is one of the most promising technologies for reliable fine mask patterning in present and future optical lithography. To establish a high performance mask writing system, not only the development of breakthrough technologies for improvement in mask accuracy of CD and image placement of the mask pattern but also the development of contamination control technologies should ...


Study on Contamination Control for Yield Enhancement in the Manufacturing Line of Cellular Phone Modules

IEEE Transactions on Electronics Packaging Manufacturing, 2008

Practical studies on the method of contamination control for yield enhancement in the cellular phone modules production line were carried out. A contamination control method was proposed, consisting of data collection, data analysis, improvement action, verification, and implementation of control. The partition check method and the composition analysis for data collection and data analysis were respectively used in the cellular ...


Contamination control in food supply chain

Proceedings of the 2010 Winter Simulation Conference, 2010

In this paper, we study a contamination control problem in food supply chain. We formulate the problem as a dynamic programming problem and then study the structure of the optimal control which turns out to be very similar to the hedging-point type of policy. Under the environment in which there is uncertainty associated with contamination control, we propose a stochastic ...


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Educational Resources on Contamination Control

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IEEE-USA E-Books

  • Contamination Control Strategy based on Particle Flow Behavior near Fast Moving Devices in Flat Panel Display Fabrication Cleanroom

    In flat panel display (FPD) fields, the defect rate of the final products yields the rate of particle deposition on FPD panels. Every best endeavor has been made to maintain a clean fabrication environment. However, contamination by airborne particles is still significant. Moreover, contamination by particles near fast moving devices such as a lift or loader has been reported as being serious. Existing well-known treatments for contamination control never worked near fast moving devices. Thus, at this stage, devising a new contamination control strategy based on the analysis of particle flow behavior upon device movement is inevitable to increase FPD productivity. In this study, the particle flow behavior near a fast moving lift is analyzed based upon the results of two and three dimensional transient flow simulations. The simulation results show consistency, insisting that the proposed approach is proper and reliable. Based on our experience associated with FPD cleanrooms and equipment, a new contamination control strategy for the moving lift system in a FPD cleanroom is proposed

  • Advanced contamination control methods for yield enhancement

    Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control during and after the processes. Methods for detection of airborne and surface molecular contaminants were developed to meet the challenging requirements for More Moore and More than Moore applications. Qualitative and quantitative contamination analysis of organic and inorganic compounds allows monitoring of contamination in front- as well as back-end processes. In this way, cross contaminations including precious metals, e.g. Au, Ag, Pd, organic and inorganic compounds e.g. sulfur, fluorine can be avoided. By the use of state-of-the-art analytical systems, a contamination control for any cleanroom and all wafer sizes could be implemented.

  • Particle contamination control technology in electron beam mask writing system for next-generation mask fabrication

    Electron beam mask writing is one of the most promising technologies for reliable fine mask patterning in present and future optical lithography. To establish a high performance mask writing system, not only the development of breakthrough technologies for improvement in mask accuracy of CD and image placement of the mask pattern but also the development of contamination control technologies should be pursued. To meet these requirements, the mask blanks upper surface scatter meter for EB writer (MUSE) system has been newly developed. MUSE can evaluate and measure the particles on the mask in vacuum environments and can be attached to the EB system. By using MUSE, not only the investigation of the origin of dust production in the EB system but also productive control of the EB system can be accomplished. This paper describes the MUSE system and the results of particle measurement in the EB mask writing system. The performance of the EB system with respect to particles is presented and discussed.

  • Study on Contamination Control for Yield Enhancement in the Manufacturing Line of Cellular Phone Modules

    Practical studies on the method of contamination control for yield enhancement in the cellular phone modules production line were carried out. A contamination control method was proposed, consisting of data collection, data analysis, improvement action, verification, and implementation of control. The partition check method and the composition analysis for data collection and data analysis were respectively used in the cellular phone modules manufacturing process, and these methods were evaluated by the variation of yield loss before and after implementing the actions for improvement. In the partition check method, the critical process step was selected, and yield loss reduction through improvement actions was observed, whereas in the composition analysis, critical sources were selected, and yield loss reduction through improvement actions was investigated. From the results, it is concluded that the partition check and the composition analysis are effective solutions for contamination control in cleanroom production lines.

  • Contamination control in food supply chain

    In this paper, we study a contamination control problem in food supply chain. We formulate the problem as a dynamic programming problem and then study the structure of the optimal control which turns out to be very similar to the hedging-point type of policy. Under the environment in which there is uncertainty associated with contamination control, we propose a stochastic dynamic programming formulation with chance constraints, to which simulation based methods could be applied.

  • Enhanced contamination control methods in advanced wafer processing

    Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control. Methods for detection of airborne and surface molecular contaminants were enhanced to meet the increasing requirements for future More Moore and More than Moore applications. Improved qualitative and quantitative contamination analysis methods of organic and inorganic compounds allow exact monitoring of contamination in front- as well as back-end processes. By the use of state-of-the-art analytical systems combined with validated analytical procedures and advanced sample preparation techniques contamination analytical results with higher reproducibility and reliability are being ensured.

  • The application of fuzzy neural network for contamination control of hydraulic oil

    By organically combining fuzzy control with neural networks, a fuzzy neural network (FNN) for the contamination control of hydraulic oil is established. Using this FNN, the contamination degree of hydraulic oil can be effectively determined, and the contamination reasons can be found initially. Also, the corresponding control measurements are provided.

  • Contamination control in 300 mm foundry

    In the normal wafer process flow, the contamination problem must not happen except a little of RD research lots. In 300 mm fab, we put multiple lots in a carrier to improve the operation efficiency. This feature reduces the cost but increase the risk of contamination disaster very much. A lot coated with the photo resist must be prevented from entering a furnace. The mixed frond-end and back-end processed lots could have contamination issue after study. New research material, like copper, will affect the yield if they are not separated with aluminum. All of them are the scope of the contamination control.

  • Energy contamination control system in deceleration beam line

    Energy contamination should be controlled in deceleration implants below 5 keV to make shallow junctions. Surface SIMS profiles of B/sup +/ 0.2 keV and 0.5 keV were obtained under various experimental conditions to evaluate the quantity of energy contamination. It is consequently found that the quantity of energy contamination correlates strongly with efficiency of beam transmission from the flag faraday to the disk faraday, and from ion source to the flag faraday. Based on this result, an energy contamination control system is developed for the NV-GSDIII-LE and 90E. Energy purity in an operation of the decel mode can be kept higher than 99% on these machines. The effectiveness of the transmission-control system is shown in this paper, showing the experimental results.

  • Contamination control in Axcelis Purion platform ion implanters

    Industry consolidation in semiconductor manufacturing, driven by commoditization and decreasing margins, is placing ever increasing pressure on fab productivity. Concomitant technology innovation, shrinking device geometries, the transition to non-planar transistors and novel device structures (such as CIS or IGBT) make yield attainment increasingly challenging. The defect level performance of semiconductor manufacturing equipment, in particular in ion implantation, is one of the critical parameters contributing to overall yield performance. This is evidenced through recent large shifts in both particle and metals requirements from device manufacturers. Traditional implanter design approaches, focused on glitch reduction or beam current modulation, are necessary but insufficient to attain simultaneous compliance of availability, throughput and defect levels. In this paper, a holistic approach to defect control is detailed. Examples of contamination control best practices are described. These are combined into an overarching design for process cleanliness (DfPC) methodology, through identification and mitigation of defect opportunities (particulates, metals). Data from the Purion platform of ion implanters demonstrate that, through application of an integrated, common design method, required defect performance can be attained across multiple ion implant platforms.



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