Conferences related to Boards

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


2020 IEEE Global Engineering Education Conference (EDUCON)

The IEEE Global Engineering Education Conference (EDUCON) 2020 is the eleventh in a series of conferences that rotate among central locations in IEEE Region 8 (Europe, Middle East and North Africa). EDUCON is one of the flagship conferences of the IEEE Education Society. It seeks to foster the area of Engineering Education under the leadership of the IEEE Education Society.


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


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Periodicals related to Boards

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


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Xplore Articles related to Boards

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OS-level power consumption estimator for multimedia mobile devices

2015 International Symposium on Consumer Electronics (ISCE), 2015

In this paper, an OS level power estimator based on monitored system events for multimedia mobile devices is presented. The OS level power estimator periodically obtains significant-events count values and calculates power- consumption estimations through mathematical models. We have implemented this power estimator in a Linux kernel and evaluated it while running a video decoder application on an embedded development ...


Investigation of off-board DPI method

2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015

An off-board direct RF power injection (DPI) method using a probe is proposed to investigate the IC immunity. The details of the measurement setup are outlined in this works. We also reviewed the conventional DPI method in addition to a discussion on the limitation of the test printed circuit board. The 3 dB bandwidth of this proposed probe is confirmed. ...


A practical approach to EMC education at the undergraduate level

IEEE Transactions on Education, 2004

In view of the importance of electromagnetic compatibility (EMC), universities worldwide are paying more attention to training electronic engineers with good EMC design knowledge. As part of the EMC training, a practical printed circuit board (PCB) layout project has been offered as an elective to the undergraduates in the authors' universities. The project requires the students to design the PCB ...


Face Recognition HW/SW IP implementation and validation for high reliability using a Virtual Platform

2015 International Symposium on Consumer Electronics (ISCE), 2015

This paper presents design details of a Virtual Platform (VP) which is used for developing real time hardwired face recognition system. VP is promising technology to develop complex HW/SW system because it enables the simultaneous development of hardware and software. We have implemented a Virtual Platform and we used it for developing FPGA based face recognition system. The hardware portion ...


IoT Based Airport Parking System

2015 International Conference on Innovations in Information, Embedded and Communication Systems (ICIIECS), 2015

The proliferation of technology paves way to new kind of devices that can communicate with other devices to produce output mostly on wireless communication. Wirelessly communicating embedded devices are brought to one another in a single link over Internet called IoT (Internet of Things). If all objects and people in daily life were equipped with identifiers, computers could manage and ...


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Educational Resources on Boards

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IEEE-USA E-Books

  • OS-level power consumption estimator for multimedia mobile devices

    In this paper, an OS level power estimator based on monitored system events for multimedia mobile devices is presented. The OS level power estimator periodically obtains significant-events count values and calculates power- consumption estimations through mathematical models. We have implemented this power estimator in a Linux kernel and evaluated it while running a video decoder application on an embedded development platform. Experiments results show that the accuracy of power estimations is high with regard to the real measured power consumption, i.e., the error between them is less than 1% in average.

  • Investigation of off-board DPI method

    An off-board direct RF power injection (DPI) method using a probe is proposed to investigate the IC immunity. The details of the measurement setup are outlined in this works. We also reviewed the conventional DPI method in addition to a discussion on the limitation of the test printed circuit board. The 3 dB bandwidth of this proposed probe is confirmed. A low dropout regulator (LDO) is used to compare the performance of the on-board injection network and the proposed scheme. The experimental result shows that the maximum deviation of the immunity level is less than 1 dB between the conventional and the proposed method.

  • A practical approach to EMC education at the undergraduate level

    In view of the importance of electromagnetic compatibility (EMC), universities worldwide are paying more attention to training electronic engineers with good EMC design knowledge. As part of the EMC training, a practical printed circuit board (PCB) layout project has been offered as an elective to the undergraduates in the authors' universities. The project requires the students to design the PCB layout of a standard digital circuit twice, the first time with no EMC consideration at all, and the second time with careful EMC consideration. The significant difference in the levels of radiated emissions of the two layouts allows the students to appreciate the importance of EMC design at an early stage of product development.

  • Face Recognition HW/SW IP implementation and validation for high reliability using a Virtual Platform

    This paper presents design details of a Virtual Platform (VP) which is used for developing real time hardwired face recognition system. VP is promising technology to develop complex HW/SW system because it enables the simultaneous development of hardware and software. We have implemented a Virtual Platform and we used it for developing FPGA based face recognition system. The hardware portion is modeled with Transaction Level Model (TLM) in early phase of development. After hardware have been implemented, TLM model is substituted with real hardware system. The software is simultaneously developed with TLM hardware model and SW/HW integrity verification is seamlessly done by substituting TLM model with FPGA based real hardware. TLM model was efficient because it was much faster than RTL model and it can be seamlessly interfaced with SW development environment of virtual platform. FPGA based face recognition system was fully verified using application software running on virtual platform.

  • IoT Based Airport Parking System

    The proliferation of technology paves way to new kind of devices that can communicate with other devices to produce output mostly on wireless communication. Wirelessly communicating embedded devices are brought to one another in a single link over Internet called IoT (Internet of Things). If all objects and people in daily life were equipped with identifiers, computers could manage and inventory them. Besides using RFID, the tagging of things may be achieved through such technologies as near field communication, barcodes, QR codes and digital watermarking. Here new method of using embedded technology to provide such application, Arduino is used as an embedded controller to interface Ethernet shield with a PC/Laptop to provide IoT over Ethernet. A user can use this parking service in the airport scenario provided by airport authority with user ID and password. Whenever a user need to check the vehicle in the parking lot, uses the ID and password to logon into the airport web link and view the status of the car in the parking lot using IoT. IoT Based Airport Parking System is discussed here to implement Arduino environment as IoT application.

  • A control scheme for eliminating garbage collection during highspeed analysis of big-graph data stored in NAND flash memory

    A new control scheme for eliminating garbage collection during high-speed analysis of big-graph data stored in NAND flash memory is proposed and evaluated. During big-graph analysis, intermediate results of the analysis stored in NAND flash memory are updated repeatedly. When a conventional control scheme is applied, excessive data copying, called “garbage collection,” occurs because overwriting data to NAND flash memory is prohibited. Such excessive data copying degrades the performance of big-graph analysis. When the proposed control scheme is applied, the controller of NAND flash memory writes the intermediate results which are updated at the same time to the same block of NAND flash memory, and the excessive data copying is eliminated completely because all the data in the block can be erased at the same time before the intermediate results are updated. As a result, the proposed control scheme shortens analysis time by 88% and increases analysis speed for big graphs 8.7 times. These results show that the proposed control scheme enables high-speed analysis of big graphs.

  • Hardware-in-loop simulation and application for high-power AC-DC-AC rolling mill driving system

    Hardware-in-loop (HIL) Simulation is an excellent verification tool for controllers operated under high voltage & power conditions. In this paper, aim to high-power AC-DC-AC rolling mill driving converter system, a HIL simulation platform based on dSPACE simulator was built. With the real-time simulator, a virtual field operation environment was constructed for converter controller debugging and test, which could completely satisfy the requirements of AC-DC-AC rolling mill driving system products functions and performances verifying, reducing the products development depending on test resource greatly. The simulation platform has applied in rolling mill converter development, shortening the products development cycle and decreasing the cost largely.

  • IEEE Approved Draft Standard for Boundary-Scan Testing of Advanced Digital Networks

    This standard augments IEEE Std 1149.1 to improve the ability for testing differential and/or ac-coupled interconnections between integrated circuits on circuit boards and systems.

  • Analytical solution of the electromagnetic radiation from coupled differential microstrip pairs

    Nowadays differential traces as interconnects are extensively used since the electromagnetic radiation can be ideally cancelled by the out-of-phase and same amplitude signals on the two tightly coupled differential traces. However, the ability of differential pair in mitigating EM interference (EMI) may be seriously jeopardized by possible unbalance of the excitation, since both the common mode and the differential mode current may introduced to the differential pair. In this work, based on the mode decomposition technique and the far-field Green's function, an analytical solution of the radiated electric field from coupled traces is formulated by taking both the common and differential-mode currents into consideration. Thus the radiated electric field from any arbitrary excitation can be easily calculated. The validity of the analytical formulation is verified by comparing the calculated results with the full-wave simulation results.

  • New measurement base De-embedded CPU load model for power delivery network design

    CPU load model including on-chip wiring and package interconnection has been required for printed circuit board (PCB) design of digital products according to the improvement in the speed of CPU operation in recent years. Especially, accurate power delivery network (PDN) information inside CPU is indispensable for PCB design according to requirement of low-impedance and the broadband (from DC to GHz) from the inside of CPU to DC-DC converter. While the detailed impedance information inside CPUs is not disclosed to PCB board designers with the complicated back-end and front-end production design for CPU chip and package. This paper aims to establish new methodology to extract CPU load model with combination of measurement and simulation. The method is simple yet powerful for high-end CPU board design.



Standards related to Boards

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IEEE Standard for a Metric Equipment Practice for Microcomputers - Coordination Document


Standard for 4.76 kV to 38 kV Rated Ground and Test Devices Used in Enclosures

This standard covers drawout type, indoor, medium-voltage ground and test (G&T) devices for use in drawout metal-clad switchgear rated 4.76 kV through 38 kV as described in IEEE Std C37.20.2. Four G&T device types are generally supplied for temporary circuit maintenance procedures for insertion in place of the circuit breaker as follows: a) Simple manual devices b) Complex manual devices ...