642 resources related to Bonding processes
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The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.
All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695), 2003
Three-dimensional (3-D) integrated circuits can be fabricated by bonding previously-processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnect test structures were created by thermocompression bonding, and the bond toughness was measured using a four-point bend test. The effects of bonding temperature, chamber ambient and copper thickness on bond quality were evaluated to optimize the ...
The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05., 2005
We present a three dimensional (3D) microfluidic device fabricated by multiple-stacking of electroplated Ni patterns using surface-activated bonding (SAB) at room temperature. We successfully fabricated a micro heat exchanger as a feasibility device, which is 800 /spl mu/m square by stacking nine layers of 25 /spl mu/m-thick Ni patterns at alignment accuracy less than 1/spl mu/m. 3D fluidic channels which ...
2008 International Interconnect Technology Conference, 2008
The simultaneous formation of Cu/Sn microconnects and an adhesive bond during wafer level thermal compression bonding was evaluated using a 3D enabled single metal level test die and wafer. The wafer level bond process relied on locally dispensed adhesive to fix the dice to the wafer prior to bonding and to become a permanent bond during the bonding process. The ...
IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference], 1997
IEEE Transactions on Nuclear Science, 2006
A new approach to photo detection using pixel Hybrid Photon Detectors (pixel- HPD's) has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high ...
Kurt Petersen: 2019 IEEE Medal of Honor Recipient
Electrically-Pumped 1.31 μm MQW Lasers by Direct Epitaxy on Wafer-Bonded InP-on-SOI Substrate - Yingtao Hu - Closing Ceremony, IPC 2018
Dr. Bernd Kosch on Industrie 4.0 and manufacturing - WF-IoT 2015
EDOC 2010 - Dragan Gasevic Keynote
Inspiring Brilliance: The Impact on Engineering of Maxwell's articles on Structural Mechanics
26 Years of Risk Management Standardisation - Kevin Knight - Closing Ceremony: Sections Congress 2017
Industry Connections: Oleg Logvinov - Why I Joined
Ian A. Young - 2018 Frederik Philips Award at IEEE ISSCC
Challenges in the Developing Smart Grid: Chuck Adams
Design of a 16-bit Adiabatic Microprocessor - Rene Celis-Cordova - ICRC San Mateo, 2019
EMBC 2012 Theme Speaker: Dr. James Bassingthwaighte
Lloyd Watts: Reverse-Engineering the Human Auditory Pathway -WCCI 2012 Plenary talk
Scalable and Reconfigurable Tap-Delay-Line for Multichannel Equalization - Ari Willner - Closing Ceremony, IPC 2018
Mining: A Changing Frontier - Emily Moore - WIE ILC 2018
IEEE Themes - Social Networks: Dynamic Social Interaction Data
Design and Comparison of Crosstalk Circuits at 7nm - Md Arif Iqbal - ICRC San Mateo, 2019
Stephen Welby: Distinguished Experts Panel - TTM 2018
Tech Super Stars Panelist - Vincent Chan: 2016 Technology Time Machine
Translating Research into Life-Saving Products - Keynote Rosalind Picard - IEEE EMBS at NIH, 2019
Three-dimensional (3-D) integrated circuits can be fabricated by bonding previously-processed device layers using metal-metal bonds that also serve as layer-to-layer interconnects. Bonded copper interconnect test structures were created by thermocompression bonding, and the bond toughness was measured using a four-point bend test. The effects of bonding temperature, chamber ambient and copper thickness on bond quality were evaluated to optimize the bonding process. A new copper surface cleaning method using glacial acetic acid was employed to obtain high toughness bonds(/spl sim/17 J/m/sup 2/) at low bonding temperatures (<300/spl deg/C).
We present a three dimensional (3D) microfluidic device fabricated by multiple-stacking of electroplated Ni patterns using surface-activated bonding (SAB) at room temperature. We successfully fabricated a micro heat exchanger as a feasibility device, which is 800 /spl mu/m square by stacking nine layers of 25 /spl mu/m-thick Ni patterns at alignment accuracy less than 1/spl mu/m. 3D fluidic channels which consist of vertical holes of 100 /spl mu/m diameter and horizontal paths 70 /spl mu/m wide and 100 /spl mu/m pitch were formed by simply stacking patterned Ni plates without any sacrificial layers.
The simultaneous formation of Cu/Sn microconnects and an adhesive bond during wafer level thermal compression bonding was evaluated using a 3D enabled single metal level test die and wafer. The wafer level bond process relied on locally dispensed adhesive to fix the dice to the wafer prior to bonding and to become a permanent bond during the bonding process. The die-to-wafer microconnect resistance was measured for micropad pitches of 59, 64, and 69 μm. The robustness of the Cu/Sn and adhesive bond was demonstrated by thinning the bonded die to 50 BC;m. Package level reliability testing of parts that were wire bonded into a thermally enhanced plastic ball grid array (PBGA) package indicates good reliability behavior and the absence of any intrinsic reliability-related issues in the microconnects.
A new approach to photo detection using pixel Hybrid Photon Detectors (pixel- HPD's) has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high sensitivity, low noise and fast readout. A major technological challenge was the encapsulation of a hybrid pixel detector inside a photo detector tube. The fabrication of the HPD tube involves packaging of the pixel detector assembly onto a ceramic carrier to form the photo-anode and the subsequent bake out of the pixel anode under vacuum. Both processes involve high temperatures. A fine pitch solder bump- bonding technique, which is compatible with the manufacture of hybrid photo detectors, has been developed. The technology and the tests used for qualifying the new process for pixel-HPD production are described. More than 40 pixel detector assemblies have been produced with almost all showing <1% of missing pixels. A number of assemblies were baked out using temperature cycles identical to those used for pixel-HPD manufacture. None of the assemblies demonstrated any degradation. SEM photos clearly indicate the reliability of the process. 10 pixel-HPD tubes have been produced using this new bump-bonding process and those behave according to expectations. The pixel-HPD is the first of a new generation of photo detector tubes suitable for RICH and other visible photon sensing applications
Wafer bonding provides a high degree of flexibility in material integration. However, the major concerns of Si wafer bonding with dissimilar materials are their thermal mismatch and the bubble generation during the annealing process. The former requires the annealing temperature as low as possible to achieve a sufficiently high bond energy. The latter depends on the removal of hydrocarbon contaminants from the mating surfaces prior to bonding. We have employed the described low temperature bonding approach in realizing bulk quality ultrathin SOI by an ion-implanted carbon etch stop, single crystal ultrathin Si on quartz or on glass and Si/ZnS.
An Au-Si eutectic wafer-level bonding process was developed for low- temperature vacuum packaging of MEMS devices. Using Au-Si eutectic bonding, devices were encapsulated by bonding a silicon cap wafer to a device wafer. Micromachined Pirani vacuum sensors were encapsulated in order to characterize the packaged pressures. These packages had cavity dimensions of 2.3times2.3 mm with a depth of 90 mum. Yields of 84.6% and 94.1% were achieved in packages with bond ring widths of 100 and 150 mum. With the use of getters and a pre- bond outgassing step, pressures from <3.7 to 23.3 mTorr were achieved. Furthermore, pressures were shown to remain stable to within plusmn2.5 mTorr for over 4 years of testing.
An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected.<<ETX>>
The performance of a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by the finite element method. A simplified 1/8 model, considering silicon dioxide and nitride processes as well as stack-anodic bonding and adhesive bonding processes, was developed. The FEM results were found to be comparable to experimental data. Case studies suggested that a Pyrex stack induces a certain amount of non-linearity, while it isolates the hard epoxy nonlinear effect. Flexible epoxy bonding or soft adhesive bonding is preferred for the packaging process. The viscoelasticity and viscoplasticity of the bonding material will result in hysteresis and drift errors of the sensor output. However, the soft adhesive's influence on the sensor can be ignored under relatively stable environments. Moreover, detailed design and process information will help to improve the modeling application.
This paper reports on the design, fabrication and performance of a ferromagnetic shape memory alloy (FSMA) thin film actuator for two degrees of freedom (2D) control of a bulk micromirror. The actuation mechanism is based on a simultaneous ferromagnetic and martensitic transformation. A monolithic actuator design has been developed with two thermally and magnetically decoupled actuation units. The problem of FSMA thin film integration is solved by a novel transfer bonding process. First demonstrators of the FSMA actuator show a highly nonlinear response at low actuation voltage allowing large optical scanning angles up to 65 ° at tunable frequencies.
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