Conferences related to CMOS digital integrated circuits

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE Frontiers in Education Conference (FIE)

The Frontiers in Education (FIE) Conference is a major international conference focusing on educational innovations and research in engineering and computing education. FIE 2019 continues a long tradition of disseminating results in engineering and computing education. It is an ideal forum for sharing ideas, learning about developments and interacting with colleagues inthese fields.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


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Periodicals related to CMOS digital integrated circuits

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Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for CMOS digital integrated circuits

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Xplore Articles related to CMOS digital integrated circuits

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IC design for a digital wireless endoscope capsule system

2004 Asia-Pacific Radio Science Conference, 2004. Proceedings., 2004

The requirement of an IC for a biomedical application is introduced. An analog-digital mixed-mode IC for a digital wireless endoscope capsule is designed using the CMOS process. The presented system has some characterized features, such as real time endoscopy image monitoring, adjustment of the view angle and focus, 3-dimensional range image acquisition, and controllability of capsule movement. The architecture, specification ...


0.5-/spl mu/m CMOS circuits for demodulation and decoding of an OFDM-based digital TV signal conforming to the European DVB-T standard

IEEE Journal of Solid-State Circuits, 1998

In the context of digital terrestrial TV based on the DVB-T standard, four 0.5-/spl mu/m CMOS IC's (IC1-IC4) are presented. IC1 integrates an 8-K fast Fourier transform for orthogonal frequency division multiplexing demodulation, IC2 performs channel estimation/correction, and IC3 is a forward error corrector implementing a Viterbi and a Reed-Solomon decoder. IC4, which is based on a digital signal-processing core, ...


Integrated filters for telecommunications

1979 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1979

None


A 25 Ms/s 8-b-10 Ms/s 10-b CMOS data acquisition IC for digital storage oscilloscopes

IEEE Journal of Solid-State Circuits, 1998

A data acquisition IC has been developed for digital storage oscilloscopes (DSOs). The entire DSO front-end except an input attenuator was integrated using 1-/spl mu/m double-poly, double-metal (DPDM) CMOS process technology. In the analog-to-digital conversion, a time-interleaved successive approximation architecture effectively enables both 25 Ms/s 8-b and 10 Ms/s 10-b operation. The input signal conditioner consists of a variable gain ...


An analog CMOS IC for template matching

1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278), 1999

A 3 V 0.5 /spl mu/m CMOS analog IC correlates each 9/spl times/9 pixel window in an input image with 8 stored 9/spl times/9 templates at rates up to 5 MHz and outputs the best match. Core multiply-accumulators (MACs) use 5 pJ/multiply at 320/spl times/10/sup 6/ MAC/s for a 10/spl times/ energy improvement over digital ASIC MACs and 10/spl times/ ...


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Educational Resources on CMOS digital integrated circuits

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IEEE.tv Videos

1.04 - 4V Digital-Intensive Dual-Mode BLE5.0/IEEE802.15.4 Transceiver SOC - N.S. Kim - RFIC 2019 Showcase
A Direct-Conversion Transmitter for Small-Cell Cellular Base Stations with Integrated Digital Predistortion in 65nm CMOS: RFIC Industry Showcase
R. Jacob Baker - SSCS Chip Chat Podcast, Episode 4
ON-CHIP VOLTAGE AND TIMING DIAGNOSTIC CIRCUITS
Brooklyn 5G Summit: Going the Distance with CMOs: mm-Waves and Beyond
Superconductive Energy-Efficient Computing - ASC-2014 Plenary-series - 6 of 13 - Wednesday 2014/8/13
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
IEEE Custom Integrated Circuits Conference
A High Efficiency 39GHz CMOS Cascode Amplifier for 5G Applications - H.C. Park - RFIC 2019 Showcase
Interview with Takao Nishitani - IEEE Donald O. Pederson Award in Solid-State Circuits Co-Recipient 2017
A 39GHz 64-Element Phased-Array CMOS Transceiver - Yun Wang - RFIC 2019 Showcase
R. Jacob Baker: CMOS & DRAM Circuit Design
X-band NMOS & CMOS Cross-Coupled DCO’s with “Folded” Common Mode Resonators - Run Levinger - RFIC 2019 Showcase
The Evolution and Future of RF Silicon Technologies for THz Applications
Towards Logic-in-Memory circuits using 3D-integrated Nanomagnetic Logic - Fabrizio Riente: 2016 International Conference on Rebooting Computing
Noise-Shaped Active SAR Analog-to-Digital Converter - IEEE Circuits and Systems Society (CAS) Distinguished Lecture
Reconfigurable 60-GHz Radar Transmitter SoC - Wooram Lee - RFIC 2019 Showcase
A 4mW-RX 7mW-TX IEEE 802.11ah Fully-Integrated RF Transceiver: RFIC Industry Showcase 2017
Multi-Level Optical Weights in Integrated Circuits - IEEE Rebooting Computing 2017
Joint TX and Feedback RX IQ Mismatch Compensation for Integrated Direct Conversion Transmitters: RFIC Interactive Forum 2017

IEEE-USA E-Books

  • IC design for a digital wireless endoscope capsule system

    The requirement of an IC for a biomedical application is introduced. An analog-digital mixed-mode IC for a digital wireless endoscope capsule is designed using the CMOS process. The presented system has some characterized features, such as real time endoscopy image monitoring, adjustment of the view angle and focus, 3-dimensional range image acquisition, and controllability of capsule movement. The architecture, specification and characteristics of the IC are demonstrated.

  • 0.5-/spl mu/m CMOS circuits for demodulation and decoding of an OFDM-based digital TV signal conforming to the European DVB-T standard

    In the context of digital terrestrial TV based on the DVB-T standard, four 0.5-/spl mu/m CMOS IC's (IC1-IC4) are presented. IC1 integrates an 8-K fast Fourier transform for orthogonal frequency division multiplexing demodulation, IC2 performs channel estimation/correction, and IC3 is a forward error corrector implementing a Viterbi and a Reed-Solomon decoder. IC4, which is based on a digital signal-processing core, performs the synchronization tasks of the complete receiver. These four chips have been designed and manufactured using a 0.5-/spl mu/m, 3,3-V, triple-metal CMOS process. Their global complexity is about 500 kgates of standard cells and 1.5 Mbits of memory, which represents a total die area of 435 mm/sup 2/ in 0.5 /spl mu/m. The total power dissipation is about 3.5 W when working at nominal frequency. More generally, these four IC's constitute the digital front-end part of a global chipset receiver (specified within the European project DVBird), also including an analog front end and a MPEG2 demultiplexer IC.

  • Integrated filters for telecommunications

    None

  • A 25 Ms/s 8-b-10 Ms/s 10-b CMOS data acquisition IC for digital storage oscilloscopes

    A data acquisition IC has been developed for digital storage oscilloscopes (DSOs). The entire DSO front-end except an input attenuator was integrated using 1-/spl mu/m double-poly, double-metal (DPDM) CMOS process technology. In the analog-to-digital conversion, a time-interleaved successive approximation architecture effectively enables both 25 Ms/s 8-b and 10 Ms/s 10-b operation. The input signal conditioner consists of a variable gain amplifier (VGA) and a second-order programmable low-pass filter (LPF) using folded-cascode structures with current feedback circuits. The overall gain is externally controllable from 12 dB to 38 dB, and the bandwidth is programmable at 500 kHz, 5 MHz, and 25 MHz. The chip consumes 340 mW at the 25 Ms/s operating condition and less than 8 mW in the power-down mode from a single 5 V supply.

  • An analog CMOS IC for template matching

    A 3 V 0.5 /spl mu/m CMOS analog IC correlates each 9/spl times/9 pixel window in an input image with 8 stored 9/spl times/9 templates at rates up to 5 MHz and outputs the best match. Core multiply-accumulators (MACs) use 5 pJ/multiply at 320/spl times/10/sup 6/ MAC/s for a 10/spl times/ energy improvement over digital ASIC MACs and 10/spl times/ over a general DSP. The overall IC performs data sequencing, 3.6/spl times/10/sup 9/ MAC/s, and max- finding, with 8 mV resolution, while consuming 420 mW.

  • Current sensor IC provides 9 bit+sign result without external sense resister

    This paper describes a mixed signal integrated circuit for current measurement. Fabricated on a 1 /spl mu/m CMOS process, the IC employs a delta sigma analog to digital converter to generate a pulse-width modulated (PWM) output proportional to current. A metal loop stamped into the lead frame acts as a current sense resistor, providing a 5 mV full scale signal at 1 amp sense current. The IC measures the sense voltage, corrects for the temperature coefficient in the metal loop, and creates a 9 bit accurate PWM output. This circuit consumes less than 120 /spl mu/A in operating mode and less than 3 /spl mu/A in sleep mode.

  • A base band processing IC for analogue cordless telephones

    We have designed an audio and data processing circuit for cordless telephone that contains a scrambler, a modem, and amplifiers for the microphone and receiver. The circuit can be fabricated into a single chip IC. The newly developed baseband signal processor is divided into two: an analog block made from a bipolar process and a digital block made from a CMOS process. The whole block can be fabricated using BiCMOS process technology.

  • Highlight of ISSCC 2008 papers in RF and wireless communication and the progress of R&D on IC Design community in Mainland China, Taiwan and Hong Kong

    This article consists of a collection of slides from the author's conference presentation.

  • Anatomy of a radio frequency integrated circuit design course

    The field of radio frequency integrated circuit (RFIC) design is currently enjoying a renaissance, driven by the explosive growth in wireless applications. Because of this sudden and unexpected growth, there has been a frenzied scramble to train RF engineers to meet the high demand. A major challenge in this task is that RF design is multidisciplinary in nature, requiring knowledge of communications and signal propagation theory, transceiver architectures, and circuit design. This paper describes an intensive first-year graduate course designed specifically to produce competent RFIC designers in one year.

  • An oversampling ADC macrocell with rail-to-rail input voltage capability

    A 14b fully differential oversampling analog-to-digital converter that has 0.01% harmonic distortion and samples at 1MHz and additionally has rail-to- rail input voltage capability, will be presented. The macrocell has been fabricated in 1.5μm CMOS technology: die size is 1.5×0.8mm.



Standards related to CMOS digital integrated circuits

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No standards are currently tagged "CMOS digital integrated circuits"


Jobs related to CMOS digital integrated circuits

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