Conferences related to CMOSFET circuits

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2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

This is a set of five conferences with a focus on wireless components, applications and systems that affect both now and our future lifestyle. The main niche of these conferences is to bring together technologists, circuit designers, system designers and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems. This is also an area where today's design compromises can trigger tomorrow's advanced technologies, where dreams can become a reality.


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Periodicals related to CMOSFET circuits

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Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Lightwave Technology, Journal of

All aspects of optical guided-wave science, technology, and engineering in the areas of fiber and cable technologies; active and passive guided-wave componentry (light sources, detectors, repeaters, switches, fiber sensors, etc.); integrated optics and optoelectronics; systems and subsystems; new applications; and unique field trials.


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Most published Xplore authors for CMOSFET circuits

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Xplore Articles related to CMOSFET circuits

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A novel W/WNx/dual-gate CMOS technology for future high-speed DRAM having enhanced retention time and reliability

IEEE International Electron Devices Meeting 2003, 2003

This work describes a new DRAM cell technology, W/WNx/P/sup +/-gate NMOS memory cell (MC) transistors, which has been integrated into a dual-gate CMOS process. Operation speed, data retention time (t/sub REF/), and reliability of high speed DRAMs are dramatically improved by the P/sup +/-gate NMOS cell, having a low-resistance polymetal word line (WL). Transistor performance in the periphery circuit is ...


Electrical characteristics and reliability of sub-3 nm gate oxides grown on nitrogen implanted silicon substrates

International Electron Devices Meeting. IEDM Technical Digest, 1997

We present a detailed study of electrical characteristics of sub-3 nm gate oxides grown on nitrogen implanted Si substrates (N/sub 2/ I/I oxides). The new results that advance the understanding of N/sub 2/ I/I oxides are the following: lower tunneling current, higher TDDB lifetime and reduced defect density are reported in N/sub 2/ I/I oxides for the first time. In ...


A Novel BJT Structure Implemented Using CMOS Processes for High-Performance Analog Circuit Applications

IEEE Transactions on Semiconductor Manufacturing, 2012

In this paper, a novel bipolar junction transistor (BJT) structure is proposed for high matching characteristics and its performance is compared with a conventional BJT structure. Although the proposed BJT matching structure indicates a decrease of collector current density $J_{C}$ and current gain $\beta$ of about 5.36% and 1.02% compared with those of the conventional BJT structure, the matching characteristics ...


Thermally robust dual-gate CMOS integration technologies for high-performance DRAM-embedded ASICs

International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318), 1999

We have demonstrated three key integration technologies of thermally stable dual-gate CMOSFETs for DRAM-embedded ASICs. These technologies include: (1) a thermally stable W-polycide gate for every MOSFET and CoSi/sub 2/ diffusion for logic CMOS to maintain low resistance, (2) nitrogen implantation into WSi/sub 2/ to prevent lateral dopant diffusion without gate depletion, and (3) a Si/sub 3/N/sub 4//TEOS-BPSG stacked interlayer ...


Asymmetry and mismatch in CMOSFETs with source/drain regions fabricated by various ion-implantation methods

Proceedings of International Conference on Microelectronic Test Structures, 1996

Experimental results on asymmetry and mismatch (A&M) characteristics are discussed for 0.5 /spl mu/m surface-channel n-MOSFETs and buried-channel p-MOSFETs fabricated by four ion-implantation methods and designed by a conventional and a side-by-side layout. The side-by-side layout is useful to improve A&M caused by source/drain asymmetry. There is not a single choice that simultaneously satisfies the minimum average and deviation values ...



Educational Resources on CMOSFET circuits

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IEEE-USA E-Books

  • A novel W/WNx/dual-gate CMOS technology for future high-speed DRAM having enhanced retention time and reliability

    This work describes a new DRAM cell technology, W/WNx/P/sup +/-gate NMOS memory cell (MC) transistors, which has been integrated into a dual-gate CMOS process. Operation speed, data retention time (t/sub REF/), and reliability of high speed DRAMs are dramatically improved by the P/sup +/-gate NMOS cell, having a low-resistance polymetal word line (WL). Transistor performance in the periphery circuit is enhanced by dual-gate CMOSFETs formed with a low temperature process. These technologies offer excellent scalability and fully operating DDR-II SDRAM test chips have been obtained.

  • Electrical characteristics and reliability of sub-3 nm gate oxides grown on nitrogen implanted silicon substrates

    We present a detailed study of electrical characteristics of sub-3 nm gate oxides grown on nitrogen implanted Si substrates (N/sub 2/ I/I oxides). The new results that advance the understanding of N/sub 2/ I/I oxides are the following: lower tunneling current, higher TDDB lifetime and reduced defect density are reported in N/sub 2/ I/I oxides for the first time. In addition, excellent device and circuit performance are demonstrated for dual-gate CMOSFETs with N/sub 2/ VI oxides down to channel lengths under 0.10 /spl mu/m.

  • A Novel BJT Structure Implemented Using CMOS Processes for High-Performance Analog Circuit Applications

    In this paper, a novel bipolar junction transistor (BJT) structure is proposed for high matching characteristics and its performance is compared with a conventional BJT structure. Although the proposed BJT matching structure indicates a decrease of collector current density $J_{C}$ and current gain $\beta$ of about 5.36% and 1.02% compared with those of the conventional BJT structure, the matching characteristics of the collector current $(A_{\rm IC})$ and the current gain $(A_{\beta})$ for the proposed structure are improved by about 31% and 24%. The improved matching characteristic of the proposed structure is believed to be due to the reduced effect of the deep n-well or the reduced current path from emitter to collector.

  • Thermally robust dual-gate CMOS integration technologies for high-performance DRAM-embedded ASICs

    We have demonstrated three key integration technologies of thermally stable dual-gate CMOSFETs for DRAM-embedded ASICs. These technologies include: (1) a thermally stable W-polycide gate for every MOSFET and CoSi/sub 2/ diffusion for logic CMOS to maintain low resistance, (2) nitrogen implantation into WSi/sub 2/ to prevent lateral dopant diffusion without gate depletion, and (3) a Si/sub 3/N/sub 4//TEOS-BPSG stacked interlayer for self-aligned contacts (SAC) without boron penetration in PMOSFETs. High-performance CMOSFETs using these technologies and 5 metal layers result in a flexible circuit design which can achieve 6.8 ns access speed in a 64 Mb DRAM-embedded macro with a 0.25 /spl mu/m design rule.

  • Asymmetry and mismatch in CMOSFETs with source/drain regions fabricated by various ion-implantation methods

    Experimental results on asymmetry and mismatch (A&M) characteristics are discussed for 0.5 /spl mu/m surface-channel n-MOSFETs and buried-channel p-MOSFETs fabricated by four ion-implantation methods and designed by a conventional and a side-by-side layout. The side-by-side layout is useful to improve A&M caused by source/drain asymmetry. There is not a single choice that simultaneously satisfies the minimum average and deviation values of A&M for all electrical parameters. For minimizing A&M in (I/sub D/ and /spl beta/), (V/sub T/ and S) and I/sub B/, n- and p-MOSFETs fabricated by 7/spl deg//spl times/4-implantation, n-MOSFETs with 0/spl deg/- and 7/spl deg//spl times/4-implantation, and n- and p-MOSFETs with 0/spl deg/- and 7/spl deg//spl times/4-implantation are recommended, respectively. However 0/spl deg/-implanted MOSFETs must not be used because of their inferior punchthrough characteristics.



Standards related to CMOSFET circuits

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No standards are currently tagged "CMOSFET circuits"


Jobs related to CMOSFET circuits

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