Conferences related to Microwave Integrated Circuits

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2020 IEEE Radio and Wireless Symposium (RWS)

RWW2020 will be an international conference covering all aspects of radio and wireless. RWW2020's multidisciplinary events will bring together innovations that are happening across the broad wireless spectrum. RWS2020, this conference application, acts as the main conference for the entire RWW of events that includes the following conferences: PAWR2020, SiRF2020, WiSNet2020, and TWiOS2020 (IEEE Topical Conference on RF/microwave Power Amplifiers, IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, IEEE Topical Conference on Wireless Sensors and Sensor Networks, and IEEE Topical Workshop on the Internet of Space IoS, respectively). In addition to traditional podium presentations and poster sessions, tracks for IEEE Distinguished Lectures, Sunday half-day workshops, Monday panels, and a demo session are planned. A RWW2020 plenary talk are a parallel IoT Summit are planned. A student competition is also planned.

  • 2019 IEEE Radio and Wireless Symposium (RWS)

    This is a conference with a focus on wireless components, applications, and systems that impact both our current and future life style. The conference's main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today's design compromises can trigger tomorrow's advanced technologies. Where dreams can become a reality. RWS is the cornerstone conference for Radio Wireless Week.

  • 2018 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today’s design compromises can trigger tomorrow’s advanced technologies. Where dreams can become a reality.

  • 2017 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today’s design compromises can trigger tomorrow’s advanced technologies. Where dreams can become a reality.

  • 2016 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be bench-marked against the needs of circuit designers at the bleeding edge of RF systems, where today

  • 2015 IEEE Radio and Wireless Symposium (RWS)

    This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today

  • 2014 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state -of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.

  • 2013 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state-of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.

  • 2012 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss hardware design and system performance of the state-of-the-art wireless systems. Includes an expanded program on the latest information on wireless communications and networking, and associated enabling technologies as new services and applications emerge.

  • 2011 IEEE Radio and Wireless Symposium (RWS)

    All aspects of components and systems related to radio and wireless networks.

  • 2010 IEEE Radio and Wireless Symposium (RWS)

    RWS focuses on the intersection between radio systems and wireless technology, which creates a unique forum for engineers to discuss various aspects of wireless communication systems and the state-of-the-art in both fields by exploring the connections between hardware design and system performance.

  • 2009 IEEE Radio and Wireless Symposium (RWS)

    This symposium highlights the state of the art of hardware and systems of radio and wireless

  • 2008 IEEE Radio and Wireless Symposium (RWS)

  • 2007 IEEE Radio and Wireless Symposium (RWS)

  • 2006 IEEE Radio and Wireless Symposium (RWS)

  • 2004 IEEE Radio and Wireless Conference - (RAWCON 2004)

  • 2003 IEEE Radio and Wireless Conference - (RAWCON 2003)

  • 2002 IEEE Radio and Wireless Conference - (RAWCON 2002)

  • 2001 IEEE Radio and Wireless Conference - (RAWCON 2001)

  • 2000 IEEE Radio and Wireless Conference - (RAWCON 2000)

  • 1999 IEEE Radio and Wireless Conference - (RAWCON '99)

  • 1998 IEEE Radio and Wireless Conference - (RAWCON '98)


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Periodicals related to Microwave Integrated Circuits

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication (maximum of 6column lengths, including all diagrams and tables.)


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Most published Xplore authors for Microwave Integrated Circuits

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Xplore Articles related to Microwave Integrated Circuits

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Historical aspects on the development of Microwave Integrated Circuits in Brazil

2009 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC), 2009

This paper recalls some markers in the history of Microwave Integrated Circuits (MIC) in Brazil over the last 35 years, showing some typical examples of this development.


High-performance RF/microwave integrated circuits in advanced logic CMOS technology: the coming of age for RF/digital mixed-signal system-on-a-package

16th Symposium on Integrated Circuits and Systems Design, 2003. SBCCI 2003. Proceedings., 2003

Summary form only given. This tutorial presents recent developments in CMOS device and circuit technology, which enable the disruptive ascent of CMOS logic technology to the forefront of high performance RF/microwave communication circuit and system designs, fully integrated with high performance digital processors on the same die. Device level characteristics of CMOS and bipolar are compared vis-a-vis, and their meaning ...


Silicon Integrated Circuits Incorporating Antennas

IEEE Custom Integrated Circuits Conference 2006, 2006

The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip ...


Hybrid Microwave Integrated Circuits for Millimeter Wavelengths

1972 IEEE GMTT International Microwave Symposium, 1972

This paper discusses some initial results which demonstrate the feasibility of hybrid M.I.C. designed for frequencies in the range 26 to 90 GHz. Practical single ended and balanced mixer circuits are described.


General electromagnetic compatibility analysis for nonlinear microwave integrated circuits

2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535), 2004

The paper proposes a new solution to the standard electromagnetic compatibility problem for nonlinear RF/microwave integrated circuits. Radiation from the given circuit is first numerically analysed by means of electromagnetic simulation. Under the assumption of a uniform plane wave incident on the circuit, the reciprocity theorem is then used to characterize the linear subnetwork by a Norton equivalent circuit. Finally, ...


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Educational Resources on Microwave Integrated Circuits

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IEEE.tv Videos

IEEE Custom Integrated Circuits Conference
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Multi-Level Optical Weights in Integrated Circuits - IEEE Rebooting Computing 2017
26th Annual MTT-AP Symposium and Mini Show - Dr. AnhVu Pham
IMS 2011 Microapps - STAN Tool: A New Method for Linear and Nonlinear Stability Analysis of Microwave Circuits
Education for Analog ICs
IEEE Photonics Conference 2017 Recap
Multi-Level Optimization for Large Fan-In Optical Logic Circuits - Takumi Egawa - ICRC 2018
R. Jacob Baker - SSCS Chip Chat Podcast, Episode 4
IMS 2014:Active 600GHz Frequency Multiplier-by-Six S-MMICs for Submillimeter-Wave Generation
IMS 2011 Microapps - Memory Effects in RF Circuits: Definition, Manifestations and Fast, Accurate Simulation
"Towards Monolithic Quantum Computing Processors In Production FDSOI CMOS Technology"
Co-design of Power Amplifier and Dynamic Power Supplies for Radar and Communications Transmitters
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Interview with Takao Nishitani - IEEE Donald O. Pederson Award in Solid-State Circuits Co-Recipient 2017
IMS 2011-100 Years of Superconductivity (1911-2011) - Existing and Emerging RF Applications of Superconductivity
2011 IEEE Medal of Honor: Morris Chang
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
Pt. 2: Electronic & Photonic (Co)Packaging Technologies - Bill Bottoms - Industry Panel 2, IEEE Globecom, 2019
MicroApps: NI-AWR Integrated Framework for WLAN 802.11ac (AWR)

IEEE-USA E-Books

  • Historical aspects on the development of Microwave Integrated Circuits in Brazil

    This paper recalls some markers in the history of Microwave Integrated Circuits (MIC) in Brazil over the last 35 years, showing some typical examples of this development.

  • High-performance RF/microwave integrated circuits in advanced logic CMOS technology: the coming of age for RF/digital mixed-signal system-on-a-package

    Summary form only given. This tutorial presents recent developments in CMOS device and circuit technology, which enable the disruptive ascent of CMOS logic technology to the forefront of high performance RF/microwave communication circuit and system designs, fully integrated with high performance digital processors on the same die. Device level characteristics of CMOS and bipolar are compared vis-a-vis, and their meaning to circuit design and system performance are analyzed. Circuit level solutions to compensate for intrinsic drawbacks on logic CMOS technology are introduced and their adequacy to RF/microwave wireless integrated system stressed. New CMOS- compatible structures, already available as deep Nwell implants, are shown to be the only required device level addition to advanced CMOS processes to enable mixed-signal integration. The tutorial concludes with a prelude of what is ahead and where very promising research and product developments are likely to come from.

  • Silicon Integrated Circuits Incorporating Antennas

    The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing

  • Hybrid Microwave Integrated Circuits for Millimeter Wavelengths

    This paper discusses some initial results which demonstrate the feasibility of hybrid M.I.C. designed for frequencies in the range 26 to 90 GHz. Practical single ended and balanced mixer circuits are described.

  • General electromagnetic compatibility analysis for nonlinear microwave integrated circuits

    The paper proposes a new solution to the standard electromagnetic compatibility problem for nonlinear RF/microwave integrated circuits. Radiation from the given circuit is first numerically analysed by means of electromagnetic simulation. Under the assumption of a uniform plane wave incident on the circuit, the reciprocity theorem is then used to characterize the linear subnetwork by a Norton equivalent circuit. Finally, a multitone harmonic-balance analysis allows the effects of the incident wave on the circuit electrical regime to be exactly investigated.

  • Diamond MESFET technology development for microwave integrated circuits

    Submicron gate-length metal-semiconductor field effect transistors (MESFETs) were fabricated on hydrogen-terminated-large grain polycrystalline diamond. Devices showed high drain-source current (140 mA/mm) and large transconductance values (50 ms/mm), with a cut off frequency ft=10 GHz and a maximum oscillation frequency, fmax, up to 35 GHz. These values suggest device microwave operation in the k-band.

  • A generalized electromagnetic optimization procedure for the design of complex interacting structures in hybrid and monolithic microwave integrated circuits

    An adaptive electromagnetic optimization procedure to facilitate field- theoretic design of hybrid and monolithic integrated circuits is presented. This approach provides full-wave characterization of complex MIC and MMIC geometries by including various effects such as coupling, spurious radiation, surface wave modes, and interactions with package modes. Application of this procedure utilizing commercially available electromagnetic simulators is presented to demonstrate its versatility.<<ETX>>

  • Extending the three-dimensional spectral-domain approach to hybrid microwave integrated circuits with passive and active lumped elements

    This paper extends the spectral-domain approach (SDA) to rigorously analyze hybrid microwave integrated circuits (HMIC) with lumped elements such as resistors, inductors, capacitors, diodes and transistors. Via-holes and air- bridges are used to connect these elements and attach them to the planar metallization structures. Under this scheme, the electric field integral equations that include linear elements are derived and solved through the method of moments. In addition, an iterative technique for assistance in modeling nonlinear elements is described. Comparison of SDA results with MWSPICE and TOUCHSTONE calculations for several practical circuit configurations illustrates the accuracy of this extended SDA method.<<ETX>>

  • Thermal analysis of microwave integrated circuits using a high resolution infrared imaging system

    Summary form only given. A high-resolution infrared imaging system (IRIS) used to analyze the temperature within a microwave integrated circuit (MIC) is reported. The system is used to assess the accuracy of thermal analyses of MICs. Data taken from an MIC transmitter, consisting of several subassemblies and containing heat-generating and heat-dissipating components, were compared to predicted performance for both active devices and other power-dissipating components in the MIC. Performance of the IRIS was verified by measuring the temperature of the MIC's bipolar transistor in the voltage-controlled oscillator (VCO) and of the field-effect transistor (FET) in the small-signal amplifier. The data showed unexpected heat dissipation from varactor diodes mounted on an alumina substrate in the VCO.<<ETX>>

  • The features of chip resistors usage in hybrid microwave integrated circuits

    High frequency measurements from 3 to 15 GHz of chip-resistors are reported in this paper. The chip-resistors under test have been mounted in the gap of the microstrip line in two ways: with the resistive layer up (&lt;;&lt;;wrap around&gt;&gt;) and with the resistive layer down (&lt;;&lt;;flip chip&gt;&gt;). The impedance of chip-resistors depends on its mounting method. Flip chip mounting method reduces the imaginary part of impedance: reactance value of flip chip mounting can be a few tens of percents less than the same value obtained using the wrap around mounting. Therefore, the refined model of chip-resistors has been designed. These results can be used for improving design efficiency of the microwave devices made by the hybrid technology.



Standards related to Microwave Integrated Circuits

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Jobs related to Microwave Integrated Circuits

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