Conferences related to Conductor Hardware

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Power Modulator and High Voltage Conference (IPMHVC)

This conference provides an exchange of technical topics in the fields of Solid State Modulators and Switches, Breakdown and Insulation, Compact Pulsed Power Systems, High Voltage Design, High Power Microwaves, Biological Applications, Analytical Methods and Modeling, and Accelerators.


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Periodicals related to Conductor Hardware

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


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Most published Xplore authors for Conductor Hardware

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Xplore Articles related to Conductor Hardware

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Corrosion of insulator and conductor hardware

Electrical Engineering, 1956

WET-PROCESS PORCELAIN as used for high voltage insulators is well known for its ability to resist atmospheric corrosion. Insulator assemblies and associated fittings usually include hot-dip galvanized ferrous metal parts which have satisfactory corrosion resistance for normal service requirements. In industrial and certain coastal areas, however, the contaminated atmosphere increases the corrosive attack and shortens hardware life.


Corrosion as It Affects Insulator and Conductor Hardware [includes discussion]

Transactions of the American Institute of Electrical Engineers. Part III: Power Apparatus and Systems, 1956

None


High temperature tests of ACSR conductor hardware

IEEE Transactions on Power Delivery, 1989

Hardware temperature data obtained by laboratory tests of four common ACSR conductors are reported. A summary of the temperature data and linear equations and graphs relating conductor and hardware temperatures are included. Some conductor loss of strength data from laboratory tests are also reported. This study indicates that the line hardware can operate safely up to conductor temperatures of 200 ...


IEEE Guide for Determining the Effects of High Temperature Operation on Conductors, Connectors, and Accessories

IEEE Std 1283-2004, 2005

The purpose of this guide is to provide general recommendations for consideration when designing new overhead transmission lines that will be operated at high temperatures. It may also evaluate existing transmission lines for operation at higher temperatures. Although this guide is intended for overhead transmission lines, most of the discussion will also be applicable to distribution lines.


Organ dosimetry for human exposure to non-uniform 60-Hz magnetic fields

IEEE Transactions on Power Delivery, 1999

This work presents a realistic numerical evaluation of the currents induced by strong 60-Hz magnetic fields in the body of a power-utility worker in three configurations representative of live-line conductor/hardware maintenance tasks. Two postures involve a single-phase two-wire transmission line bundle. The third involves a more complicated three-phase conductor system in an underground vault. A current of 500 A is ...


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Educational Resources on Conductor Hardware

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IEEE.tv Videos

IMS 2011 Microapps - A Multi-Level Conductor Surface Roughness Model
IMS MicroApp: Unexpected effects of conductor profile on the propagation constant
From Edge To Core: Memory-Driven Hardware and Software Co-Design - IEEE Rebooting Computing Industry Summit 2017
IEEE Entrepreneurship @ The 2017 AlphaLab Gear Hardware Cup International Finals
A Unified Hardware/Software Co-Design Framework for Neuromorphic Computing Devices and Applications - IEEE Rebooting Computing 2017
Towards Higher Scalability of Quantum Hardware Emulation - Naveed Mahmud - ICRC 2018
The 2018 AlphaLab Gear Hardware Cup International Finals
Co-Design of Algorithms & Hardware for DNNs - Vivienne Sze - LPIRC 2019
Hardware Detection in Implantable Media Devices Using Adiabatic Computing - S. Dinesh Kumar - ICRC 2018
Cafe: Cloud Appliances for Enterprises
Bug Labs: How an Open Source Gadget Works
IEEE Entrepreneurship @ #HWCup2017: Rubitection
CES 2009: One OS Per Hard Drive
Conversion of Artificial Recurrent Neural Networks to Spiking Neural Networks for Low-power Neuromorphic Hardware - Emre Neftci: 2016 International Conference on Rebooting Computing
Improved Deep Neural Network Hardware Accelerators Based on Non-Volatile-Memory: the Local Gains Technique: IEEE Rebooting Computing 2017
Superconductors for the Future from the Perspective of the Past
Hardware-Software Co-Design for an Analog-Digital Accelerator for Machine Learning - Dejan Milojicic - ICRC 2018
2011 IEEE Medal for Innovations in Healthcare Technology - Harrison H. Barrett
The Era of AI Hardware - 2018 IEEE Industry Summit on the Future of Computing
30 Years to High Temperature Superconductivity (HTS): Status and Perspectives

IEEE-USA E-Books

  • Corrosion of insulator and conductor hardware

    WET-PROCESS PORCELAIN as used for high voltage insulators is well known for its ability to resist atmospheric corrosion. Insulator assemblies and associated fittings usually include hot-dip galvanized ferrous metal parts which have satisfactory corrosion resistance for normal service requirements. In industrial and certain coastal areas, however, the contaminated atmosphere increases the corrosive attack and shortens hardware life.

  • Corrosion as It Affects Insulator and Conductor Hardware [includes discussion]

    None

  • High temperature tests of ACSR conductor hardware

    Hardware temperature data obtained by laboratory tests of four common ACSR conductors are reported. A summary of the temperature data and linear equations and graphs relating conductor and hardware temperatures are included. Some conductor loss of strength data from laboratory tests are also reported. This study indicates that the line hardware can operate safely up to conductor temperatures of 200 degrees C.<<ETX>>

  • IEEE Guide for Determining the Effects of High Temperature Operation on Conductors, Connectors, and Accessories

    The purpose of this guide is to provide general recommendations for consideration when designing new overhead transmission lines that will be operated at high temperatures. It may also evaluate existing transmission lines for operation at higher temperatures. Although this guide is intended for overhead transmission lines, most of the discussion will also be applicable to distribution lines.

  • Organ dosimetry for human exposure to non-uniform 60-Hz magnetic fields

    This work presents a realistic numerical evaluation of the currents induced by strong 60-Hz magnetic fields in the body of a power-utility worker in three configurations representative of live-line conductor/hardware maintenance tasks. Two postures involve a single-phase two-wire transmission line bundle. The third involves a more complicated three-phase conductor system in an underground vault. A current of 500 A is assumed in each conductor. The calculations employ a well-verified computer code applied to an anatomically derived heterogeneous conductivity model of the human body. The model voxel size (3.6-mm edges) is sufficiently high to resolve all major body components, as well as many smaller organs. The electric field and current density vectors associated with every voxel are calculated, permitting the computation of organ-specific dosimetric quantities such as spatial and temporal maximum and average values. For the two transmission line configurations, it is found that local peak values of the induced current density can exceed the commonly used standard threshold of 10 mAm/sup -2/ by a factor of up to 3-4, but the associated spatial averages do not exceed this threshold for any tissue. For the underground vault case, the spatial maxima in all tissues are below the threshold.

  • Technical Development of the IEEE Guide for Visual Corona Testing of Insulator Assemblies and Line Hardware and its Application in the Testing of 765-kV Transmission Line Insulator Assemblies

    Traditionally corona testing has been performed in laboratories by mounting a single phase mock-up of the conductor/hardware/insulator assembly at a given height above the ground and applying 110% of the rated line-to-ground operating voltage. If the test setup is shown to be free of corona by this test, then it is considered that the assembly will be free of corona under operating conditions. This method does not appear in any standards, but is used as a generally accepted test method. In spite of its general acceptance, this test method can give erroneous results. This is due to the fact that the inception of corona occurs at a given electric field gradient rather than a given absolute voltage. Under actual operating conditions, the electric field gradient at the conductor/hardware/insulator assembly is a function of phase spacing, the local geometry, and the applied 3-phase voltage. In order to correctly perform such a test in a laboratory, it is essential that the maximum gradients occurring on the conductors in the field be reproduced in the laboratory test. To address this shortcoming in test procedures, the IEEE PES Transmission and Distribution Committee's Lightning and insulator and corona and field effects working groups are engaged in the development of a guide for the performance of visual corona and RIV testing on insulator assemblies and line hardware.This paper describes the theoretical and experimental background upon which the technical development of the guide is based, and the application of the procedures in the guide as used in testing insulator assemblies and hardware for a new design 6-conductor bundle 765 kV transmission system.

  • Use of Factory-Formed Dead-Ends On High Temperature Conductors

    Factory-formed dead-ends have been utilized to terminate conductors on distribution lines for decades. Conductor dead-ends on transmission lines have traditionally been of a bolted or compression design. The advent of high temperature conductors and the desire by utilities to operate lines at higher temperatures (increased power flow) has spurred the development of appropriate conductor hardware. Specially designed factory-formed dead-ends for high temperature conductors have been developed, tested in the laboratory and on field test lines, and installed on operating transmission lines

  • Application of the NRL high-impedance radiography diode to a 2.3-MV generator

    Summary form only given. A high-impedance, small spot size diode for flash radiography has been successfully tested on a 2.3-MV generator. The generator is an L-3 Communications, Pulse Sciences Division, Pulserad 43703B, the largest in a series of generators originally called Febetron. These generators are normally used with long-life, larger diameter anodes in a sealed glass envelope. Previous work with the 1-MV Pulserad 43710A generator has demonstrated that the sealed tube can be replaced with a stacked ring insulator and the large anode replaced with a small, 1-mm diameter anode in order to achieve a much smaller spot size for single shot use. Recently, the cathode design for this retrofitted diode has been improved for optimal performance. With only small changes, this vacuum stack and diode have been retrofitted to the 43703B 2.3-MV generator. Because of the higher voltage, extra rings were added to the insulator stack, and the outer conductor hardware was rearranged to provide a smooth surface. This new diode hardware has been successfully tested at the full, 35-kV charge voltage and preliminary results show the spot size reduced by about a factor of 5 to about 1 mm with only a modest decrease in dose. If a figure of merit for the radiography source is defined as the dose divided by the spot size squared, this retrofitted diode improves the figure of merit by more than a factor of 10. Future work will be to optimize the hardware design for field use and to optimize the performance of the diode with the aid of computer models.

  • High reliability/supply chain risks

    Reliability issues associated with the Hubble Space Telescope and current supply chain risks provide a snapshot in to the challenges the government currently faces. As the open literature provides more in sight into the techniques of creating functional devices with undetectable defects, reliability evaluations provide insight into this threat space. The demand for cheaper electronics continues to grow and validation for these devices is being minimized due to resource limitations within the government. There are technologies available to solve some of the supply chain problems but each has its own limitations. The presentation will provide an overview of the security complexity and emerging issues in semi conductor hardware which look to leverage the exciting work this community provides.

  • Radio-Influence Testing on 70 Miles of 345-Kv Horizontal Bundle Conductor

    Radio-influence (RI) test results on 70 miles of 345-kv transmission line are presented. The design of the 345-kv transmission line using 954-MCM (thousand circular mils) ACSR (aluminum cable, steel reinforced) conductor bundled at 18-inch spacing, the use of standard suspension clamps, triangular space plates, and a horizontal phase spacing of 27 feet resulted in satisfactory RI level without control rings at the conductor hardware assemblies. Attenuation tests show that RI readings at one site are not materially affected by precipitation on the line a few miles away.



Standards related to Conductor Hardware

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IEEE Guide for Determining the Effects of High Temperature Operation on Conductors, Connectors, and Accessories

Prepare an IEEE guide describing the effects of high temperature operation on conductors, connectors, and conductor hardware. The guide will no only identify what constitutes elevated temperature operation and its effects on the above overhead line components, but will also suggest some mitigation techniques for consideration.


IEEE Guide for Determining the Effects of High Temperature Operation on Conductors, Connectors, and Accessories

Prepare an IEEE guide describing the effects of high temperature operation on conductors, connectors, and conductor hardware. The guide will no only identify what constitutes elevated temperature operation and its effects on the above overhead line components, but will also suggest some mitigation techniques for consideration.


IEEE Guide to the Assembly and Erection of Concrete Pole Structures


IEEE Guide to the Assembly and Erection of Metal Transmission Structures

This guide presents various approaches of good practice which will improve the ability to assemble and erect self-supporting and guyed steel or aluminum lattice and tubular steel structures. This guide covers construction aspects after foundation installation and up to the conductor stringing operation.


IEEE Guide to the Installation of Overhead Transmission Line Conductors

This guide provides general recommendations for the selection of methods, equipment, and tools that have been found to be practical for the stringing and grounding of overhead transmission line conductors, overhead groundwires and fiber optic cables. The guide also includes a comprehensive list of definitions for equipment and tools used in stringing and for stringing terms commonly employed. This guide ...



Jobs related to Conductor Hardware

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