Conferences related to Dielectric Coolant

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE 21st International Conference on Vacuum Electronics (IVEC)

Technical presentations will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, theory and computational tool development, active and passive components, systems, and supporting technologies.System developers will find that IVEC provides a unique snapshot of the current state-of-the-art in vacuum electron devices. These devices continue to provide unmatched power and performance for advanced electromagnetic systems, particularly in the challenging frequency regimes of millimeter-wave and THz electronics.Plenary talks will provide insights into the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current directions in vacuum electronics research.


2020 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2020 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


2020 IEEE International Power Modulator and High Voltage Conference (IPMHVC)

This conference provides an exchange of technical topics in the fields of Solid State Modulators and Switches, Breakdown and Insulation, Compact Pulsed Power Systems, High Voltage Design, High Power Microwaves, Biological Applications, Analytical Methods and Modeling, and Accelerators.


2020 IEEE Power & Energy Society General Meeting (PESGM)

The Annual IEEE PES General Meeting will bring together over 2900 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more


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Periodicals related to Dielectric Coolant

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electrical Insulation Magazine, IEEE

The magazine covers theory, analysis, design (computer-aided design), and practical implementation of circuits, and the application of circuit theoretic techniques to systems and to signal processing. Content is written for the spectrum of activities from basic scientific theory to industrial applications.


Industry Applications Magazine, IEEE

This magazine publishes articles concerning technical subjects and professional activities that are within the scope of IAS and are of interest to society members. The information includes but is not limited to articles, product reviews, book reviews, new standards, education information, announcements of conferences, workshops, new publications, committee meetings and reports of IAS activities.


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Most published Xplore authors for Dielectric Coolant

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Xplore Articles related to Dielectric Coolant

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Retrofilling aging transformers with natural ester based dielectric coolant for safety and life extension

Cement Industry Technical Conference, 2003. Conference Record. IEEE-IAS/PCA 2003, 2003

The number of mineral oil filled distribution and substation transformers at cement and mineral extraction plants that are approaching the end of their normal life expectancy is increasing. A proposed method of extending their remaining life is possible by retrofilling with a natural ester dielectric coolant. Additional benefits include reduced fire and environmental risks if the unit fails or when ...


Design and Parametric Study of Microfluidic Cooling Manifold for 2.5D-SICs with Dielectric Coolant

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018

2.5 dimensional stacked integrated circuits (2.5D-SICs) with through-silicon vias (TSVs), as next generation silicon technologies, are promising to go beyond Moore's law for compact, high-performance, energy-efficient microsystems. 2.5D-SICs with closely placed heterogeneous dies are considered a first step towards full 3D integration. In this paper, a novel micro-channel dielectric coolant manifold for 2.5D-SICs with multiple high-power dies, has been investigated. ...


Design and Fabrication of PCB Embedded Power Module with Integrated Heat Exchanger for Dielectric Coolant

CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, 2018

Due to an increasing demand in miniaturization of power converter, power loss densities increase significantly, which makes their thermal management difficult. One way to face this challenge is PCB embedding of semiconductors. This approach provides a much shorter thermal path from semiconductor to a coolant, than with a usual DBC-based power module. Still, a typically liquid cooling heat exchanger, which ...


Investigations on dielectric behaviour of a new ecofriendly dielectric coolant for transformers

2015 International Conference on Emerging Research in Electronics, Computer Science and Technology (ICERECT), 2015

Electrical transformers are very widely used in the Electrical Power sector at frequencies of 50Hz/60Hz. The liquid dielectric used in power transformers for many decades [1] has been mineral oil. Special applications such as Defence and Airborne equipments use silicone fluid as a dielectric coolant because of its higher operating temperatures of about 150°C- 200°C. Of late, natural vegetable seed ...


Suitability of natural vegetable seed oil as liquid dielectric coolant in an insulation system

2015 International Conference on Emerging Research in Electronics, Computer Science and Technology (ICERECT), 2015

The liquid dielectric used along with solid insulation in transformers and other equipments is the mineral oil and is in wide use for several decades particularly for power frequency applications. The active parts of electrical power transformers are normally immersed in mineral oil which acts as an insulating medium between energised parts of electrical equipment [1,2]. Silicone fluid is used ...


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Educational Resources on Dielectric Coolant

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IEEE-USA E-Books

  • Retrofilling aging transformers with natural ester based dielectric coolant for safety and life extension

    The number of mineral oil filled distribution and substation transformers at cement and mineral extraction plants that are approaching the end of their normal life expectancy is increasing. A proposed method of extending their remaining life is possible by retrofilling with a natural ester dielectric coolant. Additional benefits include reduced fire and environmental risks if the unit fails or when it is decommissioned. This paper reports on tests of miscibility and compatibility of mixtures of the two types of dielectric coolants. The paper also discusses field experience with retrofilling mineral oil-filled distribution and power transformers with a natural ester. Finally, results of an accelerated paper aging retrofill study are presented. The data collected to date suggests that the aging rate of the paper is significantly improved. Other benefits indicated by data include an increase in the fire point by approximately 200/spl deg/C, a significant reduction in the moisture content of the insulation paper, the probable elimination of bubble formation due to sudden overload, and the elimination of oil sludge formation. The increase in the dielectric coolant fire point to over 300/spl deg/C essentially eliminates the risk of oil pool fires by arcing in the event of internal fault arcing.

  • Design and Parametric Study of Microfluidic Cooling Manifold for 2.5D-SICs with Dielectric Coolant

    2.5 dimensional stacked integrated circuits (2.5D-SICs) with through-silicon vias (TSVs), as next generation silicon technologies, are promising to go beyond Moore's law for compact, high-performance, energy-efficient microsystems. 2.5D-SICs with closely placed heterogeneous dies are considered a first step towards full 3D integration. In this paper, a novel micro-channel dielectric coolant manifold for 2.5D-SICs with multiple high-power dies, has been investigated. Five active dies are modeled with power maps of one 50 W, 25 mm×25 mm field programmable gate array (FPGA), and four high heat flux transceivers (30 W/each, 6 mm×6 mm/each). In order to provide thermal management to this heterogeneous chip system, micro-fin-bridges and micropins have been implemented in the manifold. In addition, all dies have been immersed in the micro-channel with dielectric coolant to isolate the thermal interaction between dies. Effects of chips' placement, dimensions of micro- fin-bridges and micro-pins, and dielectric coolant supply and removal locations within the manifold on pressure drop and heat transfer have been parametrically studied by full-scale computational fluid mechanics/heat transfer simulations.

  • Design and Fabrication of PCB Embedded Power Module with Integrated Heat Exchanger for Dielectric Coolant

    Due to an increasing demand in miniaturization of power converter, power loss densities increase significantly, which makes their thermal management difficult. One way to face this challenge is PCB embedding of semiconductors. This approach provides a much shorter thermal path from semiconductor to a coolant, than with a usual DBC-based power module. Still, a typically liquid cooling heat exchanger, which is connected to the power module forms a main part of the overall thermal resistance. This paper presents a novel design of a PCB embedded power module with a small size heat exchanger. To meet the requirements of the targeted application a dielectric coolant was used. A parametric study was performed to find out the most suitable cooling concept. Jet impingement on an optimized cooling surface with an increased area is persecuted. The heat exchanger design is described and the thermal performance is evaluated by CFD-simulations. The overall thermal resistance for the IGBT was calculated to Rth junction-coolant = 0.52 K/W. For comparison a reference DBC-based power module on a standard cold plate is considered. Its thermal resistance was Rth junction coolant = 1.03 K/W which is almost two times higher than the embedded version with direct cooling.

  • Investigations on dielectric behaviour of a new ecofriendly dielectric coolant for transformers

    Electrical transformers are very widely used in the Electrical Power sector at frequencies of 50Hz/60Hz. The liquid dielectric used in power transformers for many decades [1] has been mineral oil. Special applications such as Defence and Airborne equipments use silicone fluid as a dielectric coolant because of its higher operating temperatures of about 150°C- 200°C. Of late, natural vegetable seed oils are also used in power transformers, mainly due to their bio-compatibility, bio-degradability and they are also from a `renewable source'. These have resulted in the increased usage of natural esters (vegetable oils) as dielectric fluids in electrical equipments. They have greater advantage of having a high flash point (above 300°C) which is an important property of a dielectric coolant. Therefore, the present work focuses on investigations on the dielectric behavior of a new indigenous vegetable seed oil codenamed as IO-18, particularly for use at high voltage and high frequencies. Though, a few indigenous vegetable oils were considered for initial study, IO-18 was selected for the present extensive investigations as some physical and thermal properties of IO-18 are more advantageous. Extensive investigations were carried out experimentally to study the important dielectric properties namely, breakdown voltage, dielectric dissipation factor and relative permittivity at 50Hz and over a temperature range from room temperature to 90°C in both `as received' condition and treated conditions. Behaviour of the oil under high frequencies and at higher temperatures was also investigated. The results of these investigations have been compared with those of mineral oil and silicone fluid to validate the dielectric behavior of vegetable oil.

  • Suitability of natural vegetable seed oil as liquid dielectric coolant in an insulation system

    The liquid dielectric used along with solid insulation in transformers and other equipments is the mineral oil and is in wide use for several decades particularly for power frequency applications. The active parts of electrical power transformers are normally immersed in mineral oil which acts as an insulating medium between energised parts of electrical equipment [1,2]. Silicone fluid is used as a liquid dielectric for high frequency applications to exploit its higher operating temperatures. In spite of many advantages, poor biodegradability of mineral oil and sensitivity of silicone fluid to corona, results in contamination of soil and water in the event of an accidental spill. In view of this, there have been strong efforts all over the world to find a suitable substitute for mineral oil based transformer oil. Also, replacement for silicone fluid, (mainly used for high voltage / high frequency transformer) has not been explored to a large extent in recent times. Last couple of decades has seen success in the development of natural esters as dielectric coolants for use in transformers. Envirotemp, Biotemp and Rapsol-T are examples which are based on Sunflower oil, Soya bean oil and Rape seed oil. The aim of the present work is to investigate suitability of natural vegetable seed oil as a liquid dielectric coolant for an insulation system, particularly transformers (both power transformers and high frequency and /or high voltage transformers). It is proposed to study and characterize the properties of natural vegetable seed oil to be used in an insulation system. Therefore, an indigenous oil (natural vegetable seed oil) codenamed as IO19 is considered for the study and is investigated for its dielectric behavior. The oil is initially studied for its dielectric properties in “as received” condition and later subjected to various treatments for improving the properties. After treatments, treated fresh sample of IO19 and thermally treated sample of IO19 with and without Nomex are also considered for study. The dielectric behavior of samples of IO19 oil under the influence of temperature and frequency is investigated to check for its suitability in an insulation system. The results are compared with that of silicone fluid.

  • Evaluation of the Long-Term Thermal Capability of a High-Temperature Insulation System Using Silicone Liquid as a Dielectric Coolant

    The functional thermal evaluation of test transformers insulated with silicon fluid is described. Studies have shown that polydimethylsiloxane fluids maintain good electrical properties at elevated temperatures, but system evaluation is required to determine their capability in a transformer. A transformer test facility meeting the requirements of IEEE Standard 262 is described and was used for the accelerated thermal testing of the transformer models. The test results are summarized and an indication is given of how silicone fluid can be used in the design of high-reliability industrial transformer systems.

  • Jet impingement boiling of a dielectric coolant in narrow gaps

    An experimental investigation into the effect of the chip-to-orifice gap was conducted for jet impingement boiling of FC-72 at the back surface of a 6.5 mm square thermal chip on a 28 mm square ceramic substrate. Four different types of jets were used, all of them employing a single 0.50 mm diameter orifice. A fixed position jet impingement pin with the orifice centered on a flat face measuring 7.62 mm on an edge was used as a base case. This jet supported a heat flux of about 120 W/cm/sup 2/ at a reasonable flowrate. Variable position jet impingement pistons were shown to perform as well as, but no better than the base case. Additional tests were conducted to investigate performance with variation in the chip-to-orifice gap. Thermal performance was found to be insensitive to the gap at large spacing, but below some specific gap it degraded with decreasing gap. A sudden jump in the chip temperature was discovered to occur at a specific gap. This gap length was found to vary with jet flowrate.<<ETX>>

  • Jet impingement boiling of a dielectric coolant in narrow gaps

    An experimental investigation into the effect of the chip-to-orifice gap was conducted for jet-impingement boiling of FC-72 at the back surface of a 6.5-mm square thermal chip on a 28-mm square ceramic substrate. Four different types of jets were used, all of them employing a single 0.50-mm diameter orifice. A fixed-position jet impingement pin with the orifice centered on a flat face measuring 7.62 mm on an edge was used as a base case. This jet supported a heat flux of about 120 W/cm/sup 2/ at a reasonable flowrate. Variable-position jet impingement pistons were shown to perform as well as, but no better than the base case. Additional tests were conducted to investigate performance with variation in the chip-to-orifice gap. Thermal performance was found to be insensitive to the gap at large spacing, but below some specific gap it degraded with decreasing gap. A sudden jump in the chip temperature was discovered to occur at a specific gap. This gap length was found to vary with jet flowrate.<<ETX>>

  • Nucleation characteristics of a structured surface in a dielectric coolant in the absence of spreading effects

    The demand for faster computing has propelled the development of faster and denser circuit technologies resulting in the increase in heat fluxes at the chip level. Chip heat fluxes are expected to exceed 250 W/cm/sup 2/. In a continuing effort to understand the capabilities of phase-change liquid immersion cooling, a square silicon heat sink featuring an etched cavity array (7.4 mm/spl times/7.4 mm) was anodically bonded to a Borofloat/sup /spl reg// glass substrate and thin-film aluminum heaters (6.9 mm/spl times/6.9 mm) were deposited on the rear side to simulate chip-sized heat sources and corresponding structured immersion-cooled heat sinks. The glass substrate was selected to minimize thermal spreading and symmetry to eliminate back heat loss, in order to yield one-dimensional heat transfer data. The pool boiling characteristics of pyramidal shaped re-entrant cavities (characteristic size 40 /spl mu/m) etched in silicon were evaluated in this study. The effect of cavity spacing of 0.5 mm, 0.75 mm and 1.0 mm on the heat dissipation is reported. The effect of convection plumes, on nucleate boiling parameters, from a heat source located below the test heater, with two different inter- module spacings, is also documented. High-speed photography was used to record and quantify the departure frequency, the bubble departure diameter and also to observe the effect of interaction between neighboring nucleation sites. All experiments were conducted in the dielectric fluid FC 72 at saturation temperature and at atmospheric pressure.

  • Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat Sink

    This paper presents an experimental study of flow boiling heat transfer in a microchannel heat sink. The dielectric fluid Fluorinert FC-77 is used as the boiling liquid after it is fully degassed. The experiments were performed at three flow rates ranging from 30-50ml/min. The heat transfer coefficients, as well as the critical heat flux (CHF), were found to increase with flow rate. Wall temperature measurements at three locations (near the inlet, near the exit, and in the middle of heat sink) reveal that wall dryout first occurs near the exit of the microchannels. The ratio of heat transfer rate under CHF conditions to the limiting evaporation rate was found to decrease with increasing flow rate, asymptotically approaching unity. Predictions from a number of correlations for nucleate boiling heat transfer in the literature are compared against the experimental results to identify those that provide a good match. The results of this work provide guidelines for the thermal design of microchannel heat sinks in two-phase flow



Standards related to Dielectric Coolant

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IEEE Guide for Acceptance and Maintenance of Natural Ester Fluids in Transformers

This guide recommends tests and evaluation procedures, as well as criteria and methods of maintenance, for natural ester-based transformer insulating fluids. These base fluids are also known as vegetable seed oils. Methods of reconditioning natural ester-based insulating fluids are also described. Where instructions given by the transformer or fluid manufacturer differ from those given in this guide, the manufacturerメs instructions ...


IEEE Guide for Acceptance and Maintenance of Natural Ester Fluids in Transformers

This guide recommends tests and evaluation procedures, as well as criteria and methods of maintenance, for natural ester-based transformer insulating fluids. These base fluids are also known as vegetable seed oils. Methods of reconditioning natural ester-based insulating fluids are also described. Where instructions given by the transformer or fluid manufacturer differ from those given in this guide, the manufacturer’s instructions ...



Jobs related to Dielectric Coolant

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