Conferences related to Mixed-signal Integrated Circuits

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


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Periodicals related to Mixed-signal Integrated Circuits

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Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for Mixed-signal Integrated Circuits

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Xplore Articles related to Mixed-signal Integrated Circuits

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Test program generation for mixed-signal integrated circuits based on automata network

2015 IEEE East-West Design & Test Symposium (EWDTS), 2015

Testing and diagnosis of mixed-signal integrated circuits are very important and complex tasks, which require selection the most relevant test methods for analog and digital subcircuits and subsequent their matching for comprehensive testing of a circuit on the whole. Two basic models for description the test process of mixed-signal IC based on the algebraic automata theory are proposed. The method ...


ATPRG: an automatic test program generator using HDL-A for fault diagnosis of analog/mixed-signal integrated circuits

IEEE Transactions on Instrumentation and Measurement, 1998

HDL-A is an analog version of the Hardware Description Language which is suitable for structural and behavioral descriptions and simulations of digital, analog, and mixed-signal circuits and systems. This paper presents an automatic test program generator (ATPRG) for fault diagnosis of analog/mixed- signal integrated circuits. The ATPRG is developed under the Mentor Graphics Design system environment, where the units under ...


Experimental results and modeling techniques for switching noise in mixed-signal integrated circuits

1992 Symposium on VLSI Circuits Digest of Technical Papers, 1992

In mixed-signal integrated circuits, fast transients in digital circuits can perturb other circuits on the same die through both direct capacitive coupling between circuit nodes and interaction via the common substrate. The effects of substrate excitation by fast switching digital circuits are reported. Experimental results and modeling techniques presented apply to CMOS technologies with heavily doped substrates and the experimental ...


Voltage-comparator-based measurement of equivalently sampled substrate noise waveforms in mixed-signal integrated circuits

IEEE Journal of Solid-State Circuits, 1996

This paper describes measurement of substrate noise waveforms in mixed-signal integrated circuits. This method uses wide-band chopper-type single-ended voltage comparators as on-chip noise detectors. By analyzing equivalently sampled comparator outputs in synchronized operation, the noise voltage in the auto-zero and compare modes can be measured separately, and noise waveforms were experimentally reconstructed to within 0.5-ns accuracy. The noise transmission path ...


Mixed signal integrated circuits based on GaAs HEMTs

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1998

During the past five years numerous mixed signal integrated circuits (ICs) have been designed, processed, and characterized based on our 0.2 /spl mu/m gate length AlGaAs/GaAs quantum well HEMT technology. Utilizing the inherent advantages of the AlGaAs/GaAs material system, optical, analog, microwave, and digital functions have been integrated monolithically. Examples are a chip set for 40 Gb/s optoelectronic data transmission ...


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Educational Resources on Mixed-signal Integrated Circuits

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IEEE.tv Videos

Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
IMS 2011 Microapps - Mixed-Signal Active Load Pull - The Fast Track to 3G/4G Amplifier Design
IEEE Custom Integrated Circuits Conference
Brooklyn 5G Summit: Going the Distance with CMOs: mm-Waves and Beyond
Interview with Takao Nishitani - IEEE Donald O. Pederson Award in Solid-State Circuits Co-Recipient 2017
An Energy-Efficient Mixed-Signal Neuron for Inherently Error Resilient Neuromorphic Systems - IEEE Rebooting Computing 2017
ENERGY HARVESTERS AND ENERGY PROCESSING CIRCUITS
Multi-Level Optical Weights in Integrated Circuits - IEEE Rebooting Computing 2017
Noise-Shaped Active SAR Analog-to-Digital Converter - IEEE Circuits and Systems Society (CAS) Distinguished Lecture
IEEE PELS Webinar Series-Galvanic Isolation for Power Supply Applications
Ultrafast Photonics Time Frequency Signal Processing Using Integrated Photonics: An IPC Keynote with Andrew M. Weiner
CIRCUIT DESIGN USING FINFETS
Education for Analog ICs
IEEE Photonics Conference 2017 Recap
Multi-Level Optimization for Large Fan-In Optical Logic Circuits - Takumi Egawa - ICRC 2018
R. Jacob Baker - SSCS Chip Chat Podcast, Episode 4
IMS 2014:Active 600GHz Frequency Multiplier-by-Six S-MMICs for Submillimeter-Wave Generation
2017 IEEE Donald O. Pederson Award in Solid-State Circuits: Takao Nishitani and John S. Thompson
Q&A with Dillon Graham: IEEE Rebooting Computing Podcast, Episode 18

IEEE-USA E-Books

  • Test program generation for mixed-signal integrated circuits based on automata network

    Testing and diagnosis of mixed-signal integrated circuits are very important and complex tasks, which require selection the most relevant test methods for analog and digital subcircuits and subsequent their matching for comprehensive testing of a circuit on the whole. Two basic models for description the test process of mixed-signal IC based on the algebraic automata theory are proposed. The method of test program generation for mixed-signal IC in the form of automata network is presented in the paper. Generated test programs take into account the features of CUT and used test equipment and also ensure matching of applied test methods for hierarchical testing of mixed-signal IC. The method provides the feasibility to the automated test program generation for mixed-signal IC testing with various resolving ability using the state-of- the-art ATE. Experimental results of the method application for the mixed- signal circuit are presented.

  • ATPRG: an automatic test program generator using HDL-A for fault diagnosis of analog/mixed-signal integrated circuits

    HDL-A is an analog version of the Hardware Description Language which is suitable for structural and behavioral descriptions and simulations of digital, analog, and mixed-signal circuits and systems. This paper presents an automatic test program generator (ATPRG) for fault diagnosis of analog/mixed- signal integrated circuits. The ATPRG is developed under the Mentor Graphics Design system environment, where the units under test (UUT's) are modeled in HDL-A and simulated by Accusim, and AMPLE (Advanced Multi-Purpose Language) in Mentor Graphics Design system environment is used to define and execute the generation process automatically. To increase the reliability and quality, the generated test programs will be verified and validated. A verification process checks if the test programs are generated correctly and if the generated test programs can effectively locate fault(s). The test programs are validated by emulating the UUT's. The actual test can be run in a fully automatic mode, or interactively.

  • Experimental results and modeling techniques for switching noise in mixed-signal integrated circuits

    In mixed-signal integrated circuits, fast transients in digital circuits can perturb other circuits on the same die through both direct capacitive coupling between circuit nodes and interaction via the common substrate. The effects of substrate excitation by fast switching digital circuits are reported. Experimental results and modeling techniques presented apply to CMOS technologies with heavily doped substrates and the experimental method can also be used to study switching noise when the substrate is lightly doped.<<ETX>>

  • Voltage-comparator-based measurement of equivalently sampled substrate noise waveforms in mixed-signal integrated circuits

    This paper describes measurement of substrate noise waveforms in mixed-signal integrated circuits. This method uses wide-band chopper-type single-ended voltage comparators as on-chip noise detectors. By analyzing equivalently sampled comparator outputs in synchronized operation, the noise voltage in the auto-zero and compare modes can be measured separately, and noise waveforms were experimentally reconstructed to within 0.5-ns accuracy. The noise transmission path was analyzed, and this showed that the noise sampled at the auto-zero mode of the comparator can be used to reconstruct substrate noise waveforms with high resolution. The results also explain the influence of noise coupling on analog circuits widely used in on-chip analog-to-digital converters.

  • Mixed signal integrated circuits based on GaAs HEMTs

    During the past five years numerous mixed signal integrated circuits (ICs) have been designed, processed, and characterized based on our 0.2 /spl mu/m gate length AlGaAs/GaAs quantum well HEMT technology. Utilizing the inherent advantages of the AlGaAs/GaAs material system, optical, analog, microwave, and digital functions have been integrated monolithically. Examples are a chip set for 40 Gb/s optoelectronic data transmission systems, 15 and 34 GHz PLLs, a 35 GHz phase shifter for phased array antenna applications, a 2-kb ROM with subnanosecond access time for direct digital signal synthesis, and a 6-k gate array.

  • Design of High-Order Sigma-Delta Modulator for BIST of Mixed-Signal Integrated Circuits

    A method for design of high-order sigma-delta modulator is proposed to generate high-precision analog signals for Built-In-Self-Test (BIST) of mixed- signal integrated circuits. The noise transfer function of the sigma-delta modulator is achieved by the sigma-delta toolbox. Using Determination Decision Diagram (DDD), symbolic transfer functions of the sigma-delta modulator are represented exactly and efficiently, and are applied to its coefficient quantization. The experiment on 4th-order sigma-delta modulator demonstrates that the in-band noise attenuation can also be kept to a maximum after quantization.

  • Voltage-comparator-based measurement of equivalently sampled substrate noise waveform in mixed-signal integrated circuits

    A method is proposed for measuring substrate noise waveforms in mixed-signal integrated circuits. This method uses wideband chopper-type single-ended voltage comparators as on-chip noise detectors. By analyzing the equivalently sampled comparator outputs from synchronized operation, the noise voltages in auto-zero and compare modes can be separately detected and the noise waveforms can be reconstructed within 2-nsec accuracy. The measured results also explain the influence of noise coupling on analog circuits widely used in on-chip analog to digital converters.

  • Fast and reliable top-level simulation strategy for mixed-signal integrated circuits and its application to DC-DC converters

    Top-level, transient, transistor-based simulations are a critical step in the product-development cycle of mixed-signal integrated circuits. These simulations are normally performed just before fabrication and unfortunately impose cumbersome bottlenecks in the design flow. Verification is an iterative process by nature, whereby each problem found requires another simulation to ensure a proper fix is in place, and because of the complexity of a large system, minor errors can cost days, increasing design time and time-to-market. A top-level transistor-based simulation strategy is proposed with minimal time overhead. The strategy is to start with a quick, all macro-model system simulation and gradually substitute one transistor-level sub-block at a time for each additional run. For optimal results, less computationally intensive blocks, which can be determined from a proposed set of screening simulations, are replaced first. The proposed strategy was tested and applied to a buck, current-mode switching regulator, and the results show that simulation overhead is least for linear analogue functions (e.g. op-amps) and worst for high-speed nonlinear circuits (e.g. signal generators). Nonlinear and bi- stable analogue blocks such as bandgap references take more time to simulate than op-amps and less than low frequency digital functions such as power-on- reset, which in turn are less intensive than ramp and pulse generators

  • Substrate noise measurement by using noise-selective voltage comparators in analog and digital mixed-signal integrated circuits

    In mixed-signal integrated circuits (IC's), substrate noise produced by high- speed digital circuits passes to the on-chip analog circuits through the substrate and seriously degrades their performance. We have developed a method for measuring the substrate noise by using noise-selective chopper-type voltage comparators as noise detectors. This method can detect the wide-band substrate noise so we can analyze and further reduce its effect. A switched capacitance is selectively loaded on the output of the inverter amplifier of the comparator during the comparison period in order to reduce the noise detected at the transition from compare to auto-zero. In contrast, the noise at the transition from auto-zero to compare can be selectively detected. Waveforms of high-frequency substrate noise were reconstructed by using this on-chip-noise detector incorporating the noise-selective comparators implemented using a 0.5-/spl mu/m CMOS bulk process.

  • A GA-based method for efficient interconnect capacitance computation in mixed-signal integrated circuits using sets of linear charges

    The problem of interconnect capacitance computation in mixed-signal integrated circuits is studied in this work. The proposed method is based on the method of images utilizing sets of linear charges and a Genetic Algorithm (GA). The proposed method is general and applicable to an arbitrary geometry configuration of interconnection lines. Comparative simulation results are presented for several practical case studies with a commercial tool employing the Finite Element Method (FEM). The results show that the computed capacitance value by our proposed method is in close agreement to the value obtained by the commercial tool with the average difference ranging between 2%-5%.



Standards related to Mixed-signal Integrated Circuits

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Jobs related to Mixed-signal Integrated Circuits

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