Conferences related to Microelectronic Circuits

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

EDSSC provides as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid state circuits and systems. The technical program includes invited talks by famous scientists and contributed papers.


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Periodicals related to Microelectronic Circuits

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


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Most published Xplore authors for Microelectronic Circuits

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Xplore Articles related to Microelectronic Circuits

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Integration of micromachined devices and microelectronic circuits: techniques and challenges

Proceedings of the 43rd IEEE Midwest Symposium on Circuits and Systems (Cat.No.CH37144), 2000

Successful implementation of low-cost, reliable, integrated microsystems requires the integration of planar two-dimensional microelectronic circuits with three-dimensional microelectromechanical structures. Over the past several years, many methods for the integration of microcircuits with micromechanical structures have been developed. This review paper will present an overview of these techniques for integrating microelectromechanical structures with microelectronic circuits. The state-of-the-art, limitations and challenges in ...


Need for undergraduate and graduate-level education in testing of microelectronic circuits and systems

Proceedings 2003 IEEE International Conference on Microelectronic Systems Education. MSE'03, 2003

As deep-sub-micron and beyond technology emerges, quality assurance of microelectronic circuits and systems becomes more important than ever. Consequentially, (1) a strong need for well-educated microelectronic circuits and systems test engineers is desired by the industry, (2) graduate-level research efforts are also called to overcome numerous microelectronic circuits and systems test issues. This paper is to address issues related to ...


High electric stress and insulation challenges in integrated microelectronic circuits

IEEE Electrical Insulation Magazine, 2002

The insulating layer in the transistor has decreased from 100 nm in the early 1970s to only a few nanometers today. This thin insulating layer gives rise to very high electric fields approaching 1000 kV/mm for an operating voltage of 1 V. Degradation of the insulation during ageing takes place due to the high field and may eventually lead to ...


Platform for integrated vacuum microelectronic circuits

IEEE International Vacuum Electronics Conference, 2014

Vacuum devices are preferred to solid-state for applications requiring radiation stability, a wide range in operating temperature, or high power at high frequency. However, difficulties associated with integrating these devices on the microscale have limited their development. We describe a monolithic vacuum microelectronic integration platform based on freestanding polysilicon MEMS devices with integrated carbon nanotube (CNT) field emitters. A four ...


Elimination of Freon and methylchloroform from the manufacturing process for hybrid microelectronic circuits

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium, 1991

Recognizing the harmful effects of Freon and methylchloroform solvents on the environment, Westinghouse embarked on an extensive elimination/reduction program in connection with the manufacturing of hybrid microelectronic circuits. Experiments were performed in the following five key areas: thick film substrate fabrication, component attachment, substrate mounting, wirebonding, and package sealing. In each area, it was possible to eliminate or to find ...


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Educational Resources on Microelectronic Circuits

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IEEE-USA E-Books

  • Integration of micromachined devices and microelectronic circuits: techniques and challenges

    Successful implementation of low-cost, reliable, integrated microsystems requires the integration of planar two-dimensional microelectronic circuits with three-dimensional microelectromechanical structures. Over the past several years, many methods for the integration of microcircuits with micromechanical structures have been developed. This review paper will present an overview of these techniques for integrating microelectromechanical structures with microelectronic circuits. The state-of-the-art, limitations and challenges in the realization of such integrated microsystems are discussed.

  • Need for undergraduate and graduate-level education in testing of microelectronic circuits and systems

    As deep-sub-micron and beyond technology emerges, quality assurance of microelectronic circuits and systems becomes more important than ever. Consequentially, (1) a strong need for well-educated microelectronic circuits and systems test engineers is desired by the industry, (2) graduate-level research efforts are also called to overcome numerous microelectronic circuits and systems test issues. This paper is to address issues related to increasing impact of the electronic circuits and systems test field on education in electrical and computer engineering and to propose suitable educational topics for undergraduate and graduate-level electrical and computer engineering courses.

  • High electric stress and insulation challenges in integrated microelectronic circuits

    The insulating layer in the transistor has decreased from 100 nm in the early 1970s to only a few nanometers today. This thin insulating layer gives rise to very high electric fields approaching 1000 kV/mm for an operating voltage of 1 V. Degradation of the insulation during ageing takes place due to the high field and may eventually lead to a breakdown. Currently it seems that the reliability of the insulating layer is one of the factors that may limit a further scaling of the transistor technology. Another threat to the thin insulating layer is electrostatic discharges (ESD) caused by human or machine handling. ESD can generate voltage and current pulses far outside the normal operating regime, and cause breakdown of the insulating layer. This article intends to give a brief introduction to the above-mentioned insulation challenges in integrated microelectronic circuits.

  • Platform for integrated vacuum microelectronic circuits

    Vacuum devices are preferred to solid-state for applications requiring radiation stability, a wide range in operating temperature, or high power at high frequency. However, difficulties associated with integrating these devices on the microscale have limited their development. We describe a monolithic vacuum microelectronic integration platform based on freestanding polysilicon MEMS devices with integrated carbon nanotube (CNT) field emitters. A four panel vacuum microtriode consisting of a cathode, extraction grid, control grid, and anode is being developed as the key active circuit component of the platform. We also describe efforts to develop cathodes with sufficient emission stability and lifetime for practical circuit implementation. Lifetime of CNT-based cathodes is being optimized through use of multilayer catalysts and CNT coating processes. This platform has the potential to enable high performance, integrated vacuum microelectronic circuits including amplifiers, oscillators, and logic circuits.

  • Elimination of Freon and methylchloroform from the manufacturing process for hybrid microelectronic circuits

    Recognizing the harmful effects of Freon and methylchloroform solvents on the environment, Westinghouse embarked on an extensive elimination/reduction program in connection with the manufacturing of hybrid microelectronic circuits. Experiments were performed in the following five key areas: thick film substrate fabrication, component attachment, substrate mounting, wirebonding, and package sealing. In each area, it was possible to eliminate or to find a suitable alternative to Freon and methylchloroform. The following recommendations are made: (1) Rosstech 119ME should be used for wet and dry thick film paste removal; (2) PF degreaser, acetone, and isopropyl alcohol should be used for removal of leak test grease: and (3) isopropyl alcohol and/or plasma cleaning should be used for all other cleaning operations.<<ETX>>

  • Surface-based broadband electromagnetic-circuit simulation of lossy conducting structures in microelectronic circuits

    The rapid growth in the switching speed and packing density of integrated digital, analog, RF, and microwave circuits has increased the importance of accurate electromagnetic (EM) modeling. A seamless broadband method is presented to model the EM behaviour of conducting structures in microelectronic circuits through a unified matrix. The EM modeling, as well as the coupling scheme, is explained. Results are presented to validate the proposed broadband technique against an existing commercial solver. Further post-processing is performed in order to determine the volumetric current flow inside the conductor using a surface only formulation, and comparisons to skin effect models is also demonstrated. Continuing work includes low-frequency stabilization and fast multilevel solvers based on QR methods.

  • Speed considerations for LDPD based time-of-flight CMOS 3D image sensors

    Recently a 128×96 pixel range imager with a pitch of 40 μm and a fill factor of 38 % was presented for 3D range imaging measurements based on the pulse modulated (PM) time-of-flight (ToF) principle. This sensor employs a high- speed photodetector called lateral drift-field photodiode (LDPD). During the characterization insufficiencies in charge transfer were observed for low- light illumination. Here, characterization and analysis of the former imager is given and a redesign that circumvents the parasitic effects is demonstrated and verified by measurements on chip and on camera level.

  • A MOS Switched Capacitor Ladder Filter in SIMOX Technology for High Temperature Applications up to 300°C

    This paper describes techniques and methods used to realize a seventh order switched capacitor low pass filter in SIMOX technology. The filter has bessel characteristic and a 3dB-bandwidth of 20Hz at a clock frequency of 100kHz. Special design of transistors and transmission gates results in drastically reduced leakage currents. The power supply voltage is 10V. The temperature range is extended up to 300°C. Experimental results of this filter are presented.

  • Automating wafer-level test of uncooled infrared detectors using wafer-prober

    Fraunhofer IMS develops and fabricates far-infrared focal plane arrays (IRFPA) using microbolometers with a pixel pitch of 17μm technology realized on top of a 0.35 μm CMOS readout integrated circuit (ROIC). The microbolometers are encapsulated by a Chip-Scale-Package (CSP) to ensure a high quality vacuum level. The CSP is realized by placing an infrared transparent lid above a solder frame surrounding the microbolometer array. To concept a wafer-level test it is very challenging to implement highly accurate electrical stimuli and a far infrared radiation source (black body) while affecting the wafer- prober handling by a non-flat wafer surface, due to the infrared transparent lids of the CSP. Accordingly, wafer-level test has been developed based on a PC which controls, by using a test program, the wafer handling of a prober, the electrical stimuli of a test hardware, and the far-infrared radiation such as the optical stimuli. Thus, the most important electro-optical parameters of IRFPAs will be measured at wafer-level: Noise Equivalent Temperature Difference (NETD), responsivity, and the percentage of the defective pixels.

  • Integration of Vertical/Quasivertical DMOS, CMOS and Bipolar Transistors in a 50 V SIMOX Process

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Standards related to Microelectronic Circuits

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