961 resources related to Mechanical Reliability
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The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.
ICC 2021 - IEEE International Conference on Communications
IEEE ICC is one of the two flagship IEEE conferences in the field of communications; Montreal is to host this conference in 2021. Each annual IEEE ICC conference typically attracts approximately 1,500-2,000 attendees, and will present over 1,000 research works over its duration. As well as being an opportunity to share pioneering research ideas and developments, the conference is also an excellent networking and publicity event, giving the opportunity for businesses and clients to link together, and presenting the scope for companies to publicize themselves and their products among the leaders of communications industries from all over the world.
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.
Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.
The Proceedings of 2011 9th International Conference on Reliability, Maintainability and Safety, 2011
This article provides a numerical method to simulate the reliability of a complicated mechanical system with multiple input random parameters. The method bases on the theory of mechanical reliability and uses a commercial FEM software, ANSYS. The quantitative reliability of the mechanical system is obtained by Monte Carlo simulation. The method is verified by theoretical analysis and is applied to ...
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009
With each advancing generation of process technology, the CPU power continues to rise, creating additional issues for thermal/mechanical packaging design. A common theme in next-generation CPU offerings will be the use of dynamic voltage and frequency scaling (DVFS) to manage the chip power during operation. With a DVFS policy, it becomes all the more important to study the potential impacts ...
2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017
Thermal wind sensor has been used to measure wind speed and direction in high temperature due to its principle. In this paper, a novel structure is proposed. It consists of a silicon sensing substrate and a ceramic chip for packaging, in which the sensing chip with through silicon vias (TSV) is Cu-Sn eutectic bonded to the ceramic. This paper focuses ...
2015 3rd International Conference on Electric Power Equipment – Switching Technology (ICEPE-ST), 2015
The objective of this paper is to investigate mechanical reliability of a permanent magnetic actuator (PMA) for a 126kV vacuum circuit breaker. Impact characteristics and fatigue life of the collision components in actuator were analyzed by experiment and simulation. 3D finite element model of impact components were built up. Dynamic impact force between armature and static magnetic conductive yoke were ...
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2013
This paper describes a failure analysis on a commercial MEMS microphone after a test according to the standard of Mil-Std-883. With the help of test and a finite element simulation, we find that the studied MEMS part of the microphone can survive a stress limit above 20000g normal to the diaphragm plane. Under a constant acceleration high to 30000g, the ...
The Design of Wearable Robots for Lower-Extremity Human Augmentation
Arizona Reliability Society - May 1 2015
Heuristics for Design for Reliability in Electrical and Electronic Products
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Utkan Demirci
APEC 2015: KeyTalks - How to Optimize Performance and Reliability of GaN Power Devices
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Mehmet R. Dokmeci
EMBC 2011-Workshop-Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Michelle Khine
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Ali Khademhosseini
APEC 2015: KeyTalks - US DOE perspective on Microgrids
The Long Term Reliability of Gallium Nitride
Robotics History: Narratives and Networks Oral Histories:Mark Yim
Maker Faire 2008: Babbage's Difference Engine No. 2 Replica
APEC 2013 MicroMouse Competition
Inventor C++ Bjarne Stroustrup (high resolution)
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
Part One: Interview with Grant Imahara—IEEE VIC Summit 2018
Analog Devices SP4T RF MEMS Switch with Integrated Driver Circuitry for RF Instrumentation: MicroApps 2015 - Analog Devices
Sustainable Energy Explored At Solar Splash
Young Engineering Innovators Emerge at Solar Splash
This article provides a numerical method to simulate the reliability of a complicated mechanical system with multiple input random parameters. The method bases on the theory of mechanical reliability and uses a commercial FEM software, ANSYS. The quantitative reliability of the mechanical system is obtained by Monte Carlo simulation. The method is verified by theoretical analysis and is applied to a real structure. This method has prevented the tedious mathematical calculation and is more economical than experimental methods. It can be used as a complement of traditional experimental methods.
With each advancing generation of process technology, the CPU power continues to rise, creating additional issues for thermal/mechanical packaging design. A common theme in next-generation CPU offerings will be the use of dynamic voltage and frequency scaling (DVFS) to manage the chip power during operation. With a DVFS policy, it becomes all the more important to study the potential impacts of imposed temporal variation in power on the thermo- mechanical reliability. In this study, we demonstrate a system identification approach for a practical CPU application and exemplify the trade-offs involved in creating a DVFS policy that is satisfactory to both thermal/mechanical reliability engineers and CPU design teams.
Thermal wind sensor has been used to measure wind speed and direction in high temperature due to its principle. In this paper, a novel structure is proposed. It consists of a silicon sensing substrate and a ceramic chip for packaging, in which the sensing chip with through silicon vias (TSV) is Cu-Sn eutectic bonded to the ceramic. This paper focuses on the thermal-mechanical reliability of the novel structure. In order to reduce the thermal stress generated by the package, four approaches of bonding ring between the silicon substrate and ceramic are taken into consideration. In addition, different grooves designed in silicon substrate are simulated and optimized to release the thermal stress generated by the package. It turns out that right angle shape of bonding ring decreases the shear stress by at most 61 % compared with any other shape. There is a reduction in shear stress of the structure with the depth of 150um by about 6% than without groove.
The objective of this paper is to investigate mechanical reliability of a permanent magnetic actuator (PMA) for a 126kV vacuum circuit breaker. Impact characteristics and fatigue life of the collision components in actuator were analyzed by experiment and simulation. 3D finite element model of impact components were built up. Dynamic impact force between armature and static magnetic conductive yoke were calculated by explicit method. It was also verified by PVDF piezoelectric sensors in the experiments in opening operation. Based on the impact simulation and operating test results, failure mode and fatigue life of the static magnetic conductive yoke and armature were calculated. Experiment results showed that maximum impact force in opening and closing operations of PMA were 892kN and 198kN. Simulation results indicated that the maximum stress in impact process is 871kN, which is verified by experiments. In addition, fatigue mode of impact component was low-cycle crack fatigue. The outside part and inside part of opening static magnetic conductive yoke had appeared failure after 3990 and 3027 operations respectively by using oil damper. Their mechanical lives met the requirement of IEC standard. When the impact velocity was lower than 1.3m/s, the fatigue lives of impact components for opening could meet the IEC standard requirement of class M1.
This paper describes a failure analysis on a commercial MEMS microphone after a test according to the standard of Mil-Std-883. With the help of test and a finite element simulation, we find that the studied MEMS part of the microphone can survive a stress limit above 20000g normal to the diaphragm plane. Under a constant acceleration high to 30000g, the diaphragm breaks and the devices fail.
In this paper, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical reliability issues in 3-D integrated circuits (ICs). First, we analyze detailed thermomechanical stress induced by through-silicon vias in conjunction with various associated structures such as landing pad and dielectric liner. Then, we explore and validate the linear superposition principle of stress tensors and demonstrate the accuracy of this method against detailed finite element analysis simulations. Next, we apply this linear superposition method to full-chip stress simulation and a reliability metric named the von Mises yield criterion. Finally, we propose a design optimization methodology to mitigate the mechanical reliability problems in 3-D ICs. Our numerical experimental results demonstrate the effectiveness of the proposed methodology.
In this paper, a novel 3D stacked chip SiP structure based on cavity substrate is proposed. For the structure of cavity substrate is asymmetric, the thermo- mechanical reliability issues of the 3D SiP structure are very important and necessary to be studied. When molding compound is injected into the 3D SiP structure, it contacts with other parts of the structure. Because Young's modulus of the molding compound varies with temperature during cooling process from molding temperature to room temperature and CTEs of different materials are mismatched, the effect of molding compound cooling process on the reliability of 3D SiP is necessary to be investigated. The thermo-mechanical reliability FEM simulation of the molding compound cooling process from molding temperature 125 °C to room temperature 25 °C is performed to study the warpage issue of the 3D package SiP. In order to conduct the molding compound cooling simulation correctly, Young's modulus of molding compound dependent on time and temperature is tested by using DMA. The simulation result shows that the deformation won't bring the warpage for the 3D SiP. Besides, the thermo- mechanical reliability FEM simulation of the 3D package module under thermal cycling (-40/125 °C) is evaluated to find out the stress and strain distribution of the 3D package module, the BGA and to predict the warpage, delamination, die cracking, solder joint cracking, excessive substrate deformation and cracking of the 3D package module. The simulation results indicate that the 3D package module has higher thermo-mechanical reliability.
Package on Package (PoP) is a packaging technology that one package is placed on top of another package to integrate different functionalities while still maintain same foot print size. The advantages of PoP are evident, but there are also some challenges with respect to packaging and Surface Mounting Technology (SMT). Due to the complex architecture of PoP, some reliability issues have been raised, reliability related to thermo mechanical issues are major challenges in the design of PoP. In this paper, package warpage and solder joint reliability during lead free reflow temperature, high temperature storage test and steady state temperature humidity test were investigated. After test, all components were electrically measured for continuity. The samples and their cross-sections were examined by scanning electron microscope (SEM). The intermetallic compound (IMC) thickness of solder/PCB interface and two interfaces of solder/substrate of top solder joints were measured. The results showed steady state temperature humidity test have no significant impact on mechanical reliability of PoP package. After high temperature storage test, the package emerge larger warpage and the thickness of IMC was grow comparatively large. It can be found that the thermal stress play an important role on the mechanical reliability of PoP Package. Finally, 3D finite element analysis (FEA) was performed, and the stress distribution under reflow process reflow temperature warpage was investigated. The results of this study can be used as a reference by original equipment manufacturers (OEMs) to estimate mechanical reliability of PoP Package.
This paper focuses on the thermo-mechanical reliability of a 3D-TSV MEMS in which cap layer and MEMS micro-structure layer is vertically interconnected and bonded by TSVs/micro-bumps and a sear ring. Geometrical parameters of the TSV structure and the seal ring are optimized first before the global model simulation. Smaller thickness of bottom TSV Cu and smaller opening size of silicon oxide layer are preferred in terms of thermo-mechanical reliability and electrical reliability. Quarter circular arc corner turning of radius 50μm decreases shear stress by at most 43.7% and peeling stress by at most 55.4% when compared with any other corner turning. In the end, the optimized structure parameters are introduced into the global model reliability simulation to verify the feasibility of the 3D-TSV MEMS.
In this paper, thermo-mechanical reliability of four different low-silver SnAgCu (SAC) lead free alloys is investigated in a harsh thermal environment of -55 to 125°C. Four configuration of test boards were assembled all having identical 100 I/O, 0.8mm pitch chip array ball grid array (CABGA) packages. Previous researchers have demonstrated the superior performance of low-silver leadfree alloys in shock and vibration. The presented study focuses on understanding the low-silver alloys reliability and the effect of dopants for prolonged operation under thermo-mechanical stresses in harsh environments. A direct comparison has been made between the low-silver alloys with and without dopants, keeping the package architecture and board assembly construction identical amongst the board assemblies tested. Solder alloys studied include SAC105, Sn0307, SACX, and SACX+. Accelerated test data has been gathered under thermal cycling from -55 to 125°C with ten minute dwells at each extreme. Weibull distributions have been created for all four-alloys and failure modes studied with cross-sections.