Conferences related to Laser Fuse

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS '96

  • OCEANS '97

  • OCEANS '98

  • OCEANS '99

  • OCEANS 2000

  • OCEANS 2001

  • OCEANS 2002

  • OCEANS 2003

  • OCEANS 2004

  • OCEANS 2005

  • OCEANS 2006

  • OCEANS 2007

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2009

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


2020 Optical Fiber Communications Conference and Exhibition (OFC)

The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals. For over 40 years, OFC has drawn attendees from all corners of the globe to meet and greet, teach and learn, make connections and move business forward.OFC attracts the biggest names in the field, offers key networking and partnering opportunities, and provides insights and inspiration on the major trends and technology advances affecting the industry. From technical presentations to the latest market trends and predictions, OFC is a one-stop-shop.



Periodicals related to Laser Fuse

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...



Most published Xplore authors for Laser Fuse

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Xplore Articles related to Laser Fuse

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Copper dendrite formation on laser fuse structures of flip chip die

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2015

Copper dendrites on a flip chip die was analysed by SEM/EDX, FIB and TEM. The dendrites were found to consist of two layers. The upper layer visible under optical and SEM inspection consist of a carbon rich copper compound. TEM analysis revealed another layer under this carbon rich layer that consist of copper, tin and lead compounds. A possible mechanism ...


Target reflectance study for the laser-fuse redundancy

IEEE Transactions on Electron Devices, 1983

A powerful and versatile program was written to study the target reflectance in connection with laser-fuse redundancy. The target is a piece of polysilicon sandwiched by SiO<inf>2</inf>and is used for the alignment of the laser on the wafer. In order to be detected consistently, the target should not change its reflectance with respect to the background in spite of process ...


Micro programmable built-in self repair for SRAMs

Records of the 2004 International Workshop on Memory Technology, Design and Testing, 2004., 2004

A built-in self-repair (BISR) machine is herewith proposed, able to test at speed and repair embedded static random access memories. Unlike the common approach to blow laser-fuse registers, here the repair operation is completely accomplished by the BISR machine, with no external intervene. The information related to the repair operation is stored into an on-chip FLASH memory. The machine is ...


Highly relaible reference bitline bias designs for 64Mb and 128Mb chain FeRAMs

2010 IEEE Asian Solid-State Circuits Conference, 2010

This paper presents highly reliable reference bitline bias designs for 64Mb and 128Mb chain FeRAM™. In order to compensate cell signal level shift of both "1" and "0" data inherent to ferroelectric material, the band-gap reference circuit with temperature coefficient trimmer and voltage generator with voltage trimmer using laser-fuses has been installed in 64Mb. This enhances tail-to-tail cell signal windows ...


Polarization Effect in Laser Processing of Fine Pitch Link Structures for Advanced Memory Designs

IEEE Transactions on Semiconductor Manufacturing, 2009

Metal fuses for laser redundant links have been widely used for years in laser repair application to enhance yield. Shrinking design rules in IC fabrication have necessitated decreased fuse pitches in the redundancy circuitry. Current infrared lasers are facing the 2 mum pitch barrier due to the diffraction limited spot size and depth of focus capabilities. In this paper, we ...



Educational Resources on Laser Fuse

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IEEE-USA E-Books

  • Copper dendrite formation on laser fuse structures of flip chip die

    Copper dendrites on a flip chip die was analysed by SEM/EDX, FIB and TEM. The dendrites were found to consist of two layers. The upper layer visible under optical and SEM inspection consist of a carbon rich copper compound. TEM analysis revealed another layer under this carbon rich layer that consist of copper, tin and lead compounds. A possible mechanism of dendrite formation due to an electrochemical cell consisting of C4 bumps, copper at laser fuse structures and a moisture or flux electrolyte is proposed.

  • Target reflectance study for the laser-fuse redundancy

    A powerful and versatile program was written to study the target reflectance in connection with laser-fuse redundancy. The target is a piece of polysilicon sandwiched by SiO<inf>2</inf>and is used for the alignment of the laser on the wafer. In order to be detected consistently, the target should not change its reflectance with respect to the background in spite of process variations. The theory was verified against experiments that involved SEM cross sections, oxide etchings, and laser target scannings. A new target is described that is always reflective throughout the process specifications.

  • Micro programmable built-in self repair for SRAMs

    A built-in self-repair (BISR) machine is herewith proposed, able to test at speed and repair embedded static random access memories. Unlike the common approach to blow laser-fuse registers, here the repair operation is completely accomplished by the BISR machine, with no external intervene. The information related to the repair operation is stored into an on-chip FLASH memory. The machine is user programmable, since it can test memories of different capacity, architecture and aspect ratio, with up to four test algorithms and two test flows. An "industrial" test flow is intended for production; while, in case of failure, a more complex "screening flow" allows to distinguish whether the unsuccessful repair operation is due to exceeded redundancy capacity or to faulty FLASH programming. This system is aimed to enhance test diagnostic capability and to improve production yield of devices which it is connected to, by-passing the actual losses in time and resources of currently used laser-fuse approach.

  • Highly relaible reference bitline bias designs for 64Mb and 128Mb chain FeRAMs

    This paper presents highly reliable reference bitline bias designs for 64Mb and 128Mb chain FeRAM™. In order to compensate cell signal level shift of both "1" and "0" data inherent to ferroelectric material, the band-gap reference circuit with temperature coefficient trimmer and voltage generator with voltage trimmer using laser-fuses has been installed in 64Mb. This enhances tail-to-tail cell signal windows by ±22mV. Furthermore, in order to realize low voltage operation and compensate array operating voltage fluctuation as well as signal level shift with temperature variation, a new reference circuit called "elevator circuit" with trimmer using ferroelectric-fuses has been installed in 128Mb. This controls the dependency of reference voltage on operating temperature at low voltage 1.8V VDD and improves cell signal window by ±40mV and varies reference bitline bias with ±0.2V variation of array operating voltage VAA of 1.5V and improves cell signal windows by ±44mV.

  • Polarization Effect in Laser Processing of Fine Pitch Link Structures for Advanced Memory Designs

    Metal fuses for laser redundant links have been widely used for years in laser repair application to enhance yield. Shrinking design rules in IC fabrication have necessitated decreased fuse pitches in the redundancy circuitry. Current infrared lasers are facing the 2 mum pitch barrier due to the diffraction limited spot size and depth of focus capabilities. In this paper, we present experimental results showing how we have achieved successful laser cut processes of future metal fuse structures down to 1.0 mum pitch using a combination of the small spot of short wavelength laser and the polarization effect to tightly pitched neighbor structures. Inline polarization with link length minimizes the adjacent link damages and thus improves the energy process window for robust cutting. Electrical measurement data of metal link structures with various pitches, metal width and top passivation thicknesses shows the importance of controlling of top oxide thickness on the fine pitch structure. This enabling technology provides a viable production solution for laser fuse processing down to 45-nm node technology and below.

  • Laser formed connections for programmable wiring

    Solid metallic connections have been successfully formed between two standard levels of metallization using a focused IR laser system. This new process of laser formed connections has been used to link chains with resistances of less than 0.8 /spl Omega/ per connection. Commercial laser repair systems used extensively by the memory industry were employed to perform over 100000 individual links over a wide set of laser parameters without failure. This technology has the potential to replace laser fuse cutting techniques to program wiring in silicon-on-silicon, wafer scale integration (WSI), and system-on-a-chip applications. Furthermore, because it is an additive process and the passivation remains completely intact, it lends itself to redundancy with perfect yield and exceptional reliability.

  • Laser formed metallic connections

    Solid metallic connections have been successfully formed between two standard levels of metallization using a focused infrared (IR) laser. This new process of laser formed connections has been used to link continuous chains and with resistances of less than 0.8 /spl Omega/ per connection. A commercial laser repair system used extensively by the memory industry was employed to perform approximately 50000 individual links without failure. The electromigration resistance is comparable to standard metal interconnect. This technology has the potential to replace laser fuse cutting techniques to implement repair schemes and it can be used to program wiring in multichip module-deposited (MCM-D) or wafer scale integration applications implemented on silicon substrates. Furthermore, because it is an additive process, it lends itself to redundancy for higher yield and reliability.

  • A 1.6 GB/s DDR2 128 Mb Chain FeRAM With Scalable Octal Bitline and Sensing Schemes

    An 87.7 mm<sup>2</sup> 1.6 GB/s 128 Mb chain FeRAM with 130 nm 4-metal CMOS process is demonstrated. In addition to small bitline capacitance inherent to chain FeRAM architecture, three new FeRAM scaling techniques - octal bitline architecture, small parasitic capacitance sensing scheme, and dual metal plateline scheme - reduce bitline capacitance from 100 fF to 60 fF. As a result, a cell signal of ±220 mV is achieved even with the small cell size of 0.252 ¿m<sup>2</sup>. An 800 Mb/s/pin read/write bandwidth at 400 MHz clock is realized by installing SDRAM compatible DDR2 interface, and performance is verified by simulation. The internal power-line bounce noise due to 400 MHz clock operation is suppressed to less than 50 mV by an event-driven current driver, which supplies several hundreds of mA of current within 2 ns response. The precise timing and voltage controls are achieved by using the data stored in a compact FeRAM-fuse, which consists of extra FeRAM memory cells placed in edge of normal array instead of conventional laser fuse links. This configuration minimizes area penalty to 0.2% without cell signal degradation.

  • A 4-Mbit CMOS EPROM

    A high-density (512K-word/spl times/8-b) erasable programmable read-only memory (EPROM) has been designed and fabricated by using 0.8-/spl mu/m n-well CMOS technology. A novel chip layout and a sense-amplifier circuit produce a 120-ns access time and a 4-mA operational supply current. The interpoly dielectric, composed of a triple-layer structure, realizes a 10-/spl mu/s/byte fast programming time, in spite of scaling the programming voltage V/SUB PP/ from 12.5 V for a 1-Mb EPROM to 10.5 V for this 4-Mb EPROM. To meet the increasing demand for a one-time programmable (OTP) ROM, a circuit is implemented to monitor the access time after the assembly. A novel redundancy scheme is incorporated to reduce additional tests after the laser fuse programming. Cell size and chip size are 3.1/spl times/2.9 /spl mu/m/SUP 2/ and 5.86/spl times/14.92 mm/SUP 2/, respectively.



Standards related to Laser Fuse

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No standards are currently tagged "Laser Fuse"