Conferences related to Wiring

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2021 IEEE Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


2020 IEEE Power & Energy Society General Meeting (PESGM)

The Annual IEEE PES General Meeting will bring together over 2900 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more


2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation



Periodicals related to Wiring

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...




Xplore Articles related to Wiring

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A Novel Method for the Fabrication of 3D-wiring within a Nanoporous Membrane for High-density Circuit Substrates

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2007

The authors have developed a new wiring method to obtain high-density wiring and fine vias for ultra-thin package substrates. Nanoporous substrates and photoinduced selective plating consisting of photo-exposure and metal plating processes were used. However, when miniaturization of wiring pitch and via diameter advanced, deformation of patterns and irregular deposition of metal between wiring became obvious. In order to solve ...


The new primer with copper foil corresponding to semi-additive process for package substrates

2013 IEEE 63rd Electronic Components and Technology Conference, 2013

The demand for downsized and light-weighted electronic parts has become stronger to realize the higher electrical performance and smaller size of electronic equipment. Thus, the package substrate used in electronics is demanded to be thinner and higher in wiring density. Generally, semi-additive process using insulating film is used to form lines finer than line/space: L/S=20/20 μm in the package. The ...


300MM wiring enabling 28Gbps transmission on LCP board (PALAP)

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014

Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over ...


Optimization of the wiring in the sequence control circuit

2016 International Conference on Electronics, Information, and Communications (ICEIC), 2016

The sequence control circuit is widely used in 3 phase induction motor control circuit in the industry. There is a problem in the wiring process of the conventional sequence control circuit. Within a limited time it occurs often is missing wiring or wiring mistakes or repeated mistakes. Up to the conduction test from wiring in the control circuit, there is ...


Self-healing stretchable wiring using conductive magnetic powder

2016 International Conference on Electronics Packaging (ICEP), 2016

We report a novel stretchable wiring that has self-healing property. The wiring was fabricated by filling conductive magnetic powder into a hollow tube of silicone material. This stretchable wiring has good performance, which is conductivity of 1715 S/cm under nonstretch status and stretchability of 150% with conductivity. In addition, this wiring has good credibility, i.e. enduring 1000 cycles tensile test ...



Educational Resources on Wiring

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IEEE-USA E-Books

  • A Novel Method for the Fabrication of 3D-wiring within a Nanoporous Membrane for High-density Circuit Substrates

    The authors have developed a new wiring method to obtain high-density wiring and fine vias for ultra-thin package substrates. Nanoporous substrates and photoinduced selective plating consisting of photo-exposure and metal plating processes were used. However, when miniaturization of wiring pitch and via diameter advanced, deformation of patterns and irregular deposition of metal between wiring became obvious. In order to solve these problems, alkali resistance of the photosensitizers after photoirradiation was increased by crosslinking the photosensitizer molecules. Consequently, in the case of use of diazido chalcone as a crosslinking agent, the crosslinking reaction advanced effectively without changing a process and it was found to be possible to fabricate wiring or via patterns with the designed width or diameter. So far, we have fabricated penetrated copper via patterns with 30 μm diameters and surface copper wiring patterns with 10 μm widths simultaneously within substrates.

  • The new primer with copper foil corresponding to semi-additive process for package substrates

    The demand for downsized and light-weighted electronic parts has become stronger to realize the higher electrical performance and smaller size of electronic equipment. Thus, the package substrate used in electronics is demanded to be thinner and higher in wiring density. Generally, semi-additive process using insulating film is used to form lines finer than line/space: L/S=20/20 μm in the package. The problem is that the thinner insulating film is likely to cause the higher warpage due to the higher coefficient of thermal expansion (CTE) and lower modulus. The applying glass-fabric prepreg to outer- layer of the package may result in the lower warpage, but it is difficult to make finer lines less than L/S=20/20 μm [1]. We started to develop the new primer with a copper foil (PF-EL) having high adhesion property with electrolessly plated copper and glass-fabric prepreg. After laminating the PF- EL with glass-fabric prepreg, the copper foil is etched out. Then, the surface of appropriate roughness made by replica of the copper foil profile is remained on the primer. The primer with appropriate roughness is applicable to semi-additive process, resulting in the higher wiring density and lower warpage for package substrate. In addition, PF-EL can be also applicable to the conventional press process without the laminator process. The peel strength of PF-EL for electrolessly plated copper is equivalent to that of the chemically roughened insulating film (0.7 kN/m or more), the sufficiently enough value for the excellent reliability. This higher peel strength is achieved by chemical functional groups and the optimization of curing degree of primer resin. The line/space of the fine line obtained with the primer is L/S=10/10 μm.

  • 300MM wiring enabling 28Gbps transmission on LCP board (PALAP)

    Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length is therefore needed in each layer. We have developed an LCP board with 28Gbps bandwidth along with a 300mm wiring length, 100um width and 380um pitch, to be described in detail. The board can be produced using DENSO's PALAP process, which is useful for high-density solutions involving more than 100 layers.

  • Optimization of the wiring in the sequence control circuit

    The sequence control circuit is widely used in 3 phase induction motor control circuit in the industry. There is a problem in the wiring process of the conventional sequence control circuit. Within a limited time it occurs often is missing wiring or wiring mistakes or repeated mistakes. Up to the conduction test from wiring in the control circuit, there is a problem that could not often be perform perfectly. In other words, it means that multiple wiring modifications are required. In this paper, written as a result of the efforts of a lot of trial and error and process improvement experience in the field, in the meantime to overcome the problems of general wiring methods and proposes a new optimal wiring method. Optimal Wiring method is the objective to minimize the problem caused by the wiring part of the wiring between the sequence control circuits. Using the optimal method of wiring to 3 phase induction motor control circuit used in many industries have attempted virtual wiring. This method is possible to identify in advance the path problem analysis on wiring. This method also improves wiring and could reduce the manufacturing cost. Optimum wiring method is also easy to debug by wiring. In addition, in the event of a missing or incorrect wiring, this method can be relatively simple circuit conduction test.

  • Self-healing stretchable wiring using conductive magnetic powder

    We report a novel stretchable wiring that has self-healing property. The wiring was fabricated by filling conductive magnetic powder into a hollow tube of silicone material. This stretchable wiring has good performance, which is conductivity of 1715 S/cm under nonstretch status and stretchability of 150% with conductivity. In addition, this wiring has good credibility, i.e. enduring 1000 cycles tensile test under strain of 100%. Furthermore, to confirm self-healing property, we applied excessive strain of 250% intentionally. The experiment result shows a fine self-healing property, that the wiring retrieved conductivity at any time by releasing wiring.

  • Poster Abstract: E-Loc: Indoor Localization through Building Electric Wiring

    E-Loc is an indoor localization system, which, through using existing indoor electric wiring, detects occupants' location. While many indoor localization technologies require intensive infrastructural supports, E-Loc obtain locations by injecting a signal into the protected earth line of existing residential power network. Caused by human body inside a room, the electromagnetic character changes can be detected to deduce a resident's location. We evaluate our system through experiments inside multiple rooms and our system is able to reach meter-level accuracy.

  • Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board

    Special attention has been paid to introduction of “Optical wiring” in place of conventional “Metallic wiring” in Printed Wiring Board level. High efficiency and alignment-free coupling between optical wirings and optical devices is a key in this field. This paper introduces a new optical interface applying “Optical pin” which has an analogy to electrical pins widely used in present electronics boards. Concept of optical pin enabling 90-deg optical path conversion is proposed and a preliminary experiment using a fiber optical pin is introduced. Then a micro optical pin fabricated by Self-Written Waveguide Technology using UV-curable resin is shown.

  • IEEE Standard for Requirements for Conduit and Cable Seals for Field Connected Wiring to Equipment in Petroleum and Chemical Industry Exposed to Pressures above Atmospheric (1.5 kPa, 0.22 psi)

    Provided in this document are specific requirements for field installed sealing between a pressurized system (stream) containing flammable or combustible process fluids which is connected directly or indirectly to an electrical system where a failure could allow the migration of process fluids directly into the electrical system. Not addressed in this document are the basic requirements for electrical safety and the effects of the loss of containment of the process system in terms of risk to the environment and/or personnel health and safety.

  • Signal slope modulation method for high data transfer rates and reducing wiring density in high-speed digital systems

    This paper presents a novel method of transferring data using a signal slope modulation method in high-speed digital systems. For the first time, this paper demonstrates that this signal slope modulation technique can be used for transferring high data per trace as well as for reducing wiring density in packages significantly. The unique combination of serial bus and parallel bus attributes of this method allows higher bit transfer rates, lower clock speeds, and lower trace and wiring counts.

  • Selection criteria for usage of aluminum wires in automobile wiring harness

    In the automobile industry, high fuel prices and growing environmental concerns have continuously driven up the demand for fuel efficient vehicles. Improved transmission and engine design, aerodynamics, fuel quality improvement and weight reduction are some of the various methods which can contribute to increase in fuel efficiency. Reduction in the weight of wiring harness can lead to decrease in overall vehicle weight, which was a key motivation that led us to explore a light weight, cost effective alternate conductor in the form of aluminum. This paper explains the methodology used for adoption of aluminum conductor in wiring harness.



Standards related to Wiring

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Graphic Symbols for Electrical Wiring and Layout Diagrams Used in Architecture and Building Construction


IEEE Recommended Practice for Cement Plant Electric Drives and Related Electrical Equipment

This recommended practice applies to all electric drives including motors, control, and control wiring associated with machinery or equipment commonly used in the manufacturing areas of cement plants. The recommendations made here are intended as a guide and may be supplemented where special needs exist. They are not intended to apply to power distribution circuits. These recommendations apply to electrical ...


IEEE Recommended Practice for Electric Power Distribution for Industrial Plants


IEEE Recommended Practice for Electric Power Systems in Commercial Buildings


IEEE Recommended Practice for Maintenance of DC Overhead Contact Systems for Transit Systems

This recommended practice provides overhead contact system maintenance practices and procedures including maintenance techniques, site inspection and test procedures, and maintenance tolerances, for heavy rail, light rail, and trolley bus systems.