Conferences related to Signal Integrity

Back to Top

2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

This symposium pertains to the field of electromagnetic compatibility.


2020 IEEE Symposium on Security and Privacy (SP)

Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2021 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2019 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2018 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2017 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for the presentation of developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.Papers offer novel research contributions in any aspect of computer security or electronic privacy. Papers may represent advances in the theory, design, implementation, analysis, or empirical evaluation of secure systems, either for general use or for specific application domains.

  • 2016 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for the presentation of developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.Papers offer novel research contributions in any aspect of computer security or electronic privacy. Papers may represent advances in the theory, design, implementation, analysis, or empirical evaluation of secure systems, either for general use or for specific application domains.

  • 2015 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for the presentation of developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.Papers offer novel research contributions in any aspect of computer security or electronic privacy. Papers may represent advances in the theory, design, implementation, analysis, or empirical evaluation of secure systems, either for general use or for specific application domains.

  • 2014 IEEE Symposium on Security and Privacy (SP)

    IEEE Symposium on Security and Privacy has been the premier forum for computer security research, presenting the latest developments and bringing together researchers and practitioners.

  • 2013 IEEE Symposium on Security and Privacy (SP) Conference dates subject to change

    IEEE Symposium on Security and Privacy has been the premier forum for computer security research, presenting the latest developments and bringing together researchers and practitioners.

  • 2012 IEEE Symposium on Security and Privacy (SP) Conference dates subject to change

    IEEE Symposium on Security and Privacy has been the premier forum for computer security research, presenting the latest developments and bringing together researchers and practitioners.

  • 2011 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2010 IEEE Symposium on Security and Privacy (SP)

    S&P is interested in all aspects of computer security and privacy.

  • 2009 IEEE Symposium on Security and Privacy (SP)

    The IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2008 IEEE Symposium on Security and Privacy (SP)

    Since 1980, the IEEE Symposium on Security and Privacy has been the premier forum for presenting developments in computer security and electronic privacy, and for bringing together researchers and practitioners in the field.

  • 2007 IEEE Symposium on Security and Privacy (SP)

    Research contributions in any aspect of computer security and electronic privacy including advances in the theory, design, implementation, analysis of empirical evaluation of secure systems.

  • 2006 IEEE Symposium on Security and Privacy (SP)

  • 2005 IEEE Symposium on Security and Privacy (SRSP)


More Conferences

Periodicals related to Signal Integrity

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Audio, Speech, and Language Processing, IEEE Transactions on

Speech analysis, synthesis, coding speech recognition, speaker recognition, language modeling, speech production and perception, speech enhancement. In audio, transducers, room acoustics, active sound control, human audition, analysis/synthesis/coding of music, and consumer audio. (8) (IEEE Guide for Authors) The scope for the proposed transactions includes SPEECH PROCESSING - Transmission and storage of Speech signals; speech coding; speech enhancement and noise reduction; ...


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


More Periodicals

Most published Xplore authors for Signal Integrity

Back to Top

Xplore Articles related to Signal Integrity

Back to Top

Non-Target DRAM Termination in High Speed LPDDR System for Improved Signal Integrity

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018

Impact of non-target ODT (On-Die Termination) in dual-rank DRAM is investigated on SoC-DRAM SI (signal integrity). Analysis at data rate of 4266Mbps was performed. It shows that terminating non-target DRAM improves SI of the target DRAM by ~3-5% of unit interval due to mitigation of reflections. This added timing margin is significant at high data rates.


Transmission Lines and Basic Signal Integrity

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018

This article discusse the signal integrity is increasingly challenging as data rate increases the form factor and the cost. some critical aspects of signal integrity are discussed and mitigation strategies presented the loss, impedance matching, crosstalk, etc. non-ideal effects of interconnect need to be taken into account in high speed interconnect design. equalization, jitter, eye-diagram are critical signal integrity fundamental ...


Power and Signal Integrity Findings in a FPGA Layout for an Aerospace Application

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018

Design principles concerning the use of FPGA are of particular importance in aerospace applications since the neglect of such design principles can cause catastrophic effects in aerospace system, as it will be explainedin this paper. FPGA design rules such as power conditioning and signal integrity for properly interfacing high speed FPGA with its interface circuits are discussed in this paper ...


Impact of Via Stub Position on High Speed Serial Links

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2018

While designing any interface, the impact of channel components like vias, trace, materials, stack-up, connectors, cables, transmitter/receiver packages, and other parasitic effects need to be considered. This paper discusses the impact of via and more importantly the impact of via stub position and length on high speed serial links. Via stub resonance impacts high speed signals but in this paper ...


Power and Signal Integrity Analysis of High-speed Mixed-signal Backplanes Based on VPX

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018

In this paper, the problem of simultaneous switching noise (SSN) in the design of high-speed mixed-signal backplane is analyzed from the aspect of power integrity. How to suppress SSN of high-speed mixed-signal backplane becomes an important research direction at present. Based on the analysis of the traditional decoupling capacitor noise reduction method and the latest noise reduction principle of the ...


More Xplore Articles

Educational Resources on Signal Integrity

Back to Top

IEEE-USA E-Books

  • Non-Target DRAM Termination in High Speed LPDDR System for Improved Signal Integrity

    Impact of non-target ODT (On-Die Termination) in dual-rank DRAM is investigated on SoC-DRAM SI (signal integrity). Analysis at data rate of 4266Mbps was performed. It shows that terminating non-target DRAM improves SI of the target DRAM by ~3-5% of unit interval due to mitigation of reflections. This added timing margin is significant at high data rates.

  • Transmission Lines and Basic Signal Integrity

    This article discusse the signal integrity is increasingly challenging as data rate increases the form factor and the cost. some critical aspects of signal integrity are discussed and mitigation strategies presented the loss, impedance matching, crosstalk, etc. non-ideal effects of interconnect need to be taken into account in high speed interconnect design. equalization, jitter, eye-diagram are critical signal integrity fundamental concepts.

  • Power and Signal Integrity Findings in a FPGA Layout for an Aerospace Application

    Design principles concerning the use of FPGA are of particular importance in aerospace applications since the neglect of such design principles can cause catastrophic effects in aerospace system, as it will be explainedin this paper. FPGA design rules such as power conditioning and signal integrity for properly interfacing high speed FPGA with its interface circuits are discussed in this paper as it relates to aerospace systems. Signal integrity to avoid crosstalk within a FPGA has not been a great concern because most of the attention over the years had been on signal integrity at the PCB level. However, this paper shows a real example of crosstalk within a FPGA in an aerospace application.

  • Impact of Via Stub Position on High Speed Serial Links

    While designing any interface, the impact of channel components like vias, trace, materials, stack-up, connectors, cables, transmitter/receiver packages, and other parasitic effects need to be considered. This paper discusses the impact of via and more importantly the impact of via stub position and length on high speed serial links. Via stub resonance impacts high speed signals but in this paper it is shown that their position also has an impact. Depending on where the via stubs are located on a high speed channel, sometimes their effect could be insignificant (no eye degradation) and sometimes their impact could be significant (major eye degradation). High speed analysis is performed at 16Gbps and 20Gbps to demonstrate the margin loss due to various positions of via stubs.

  • Power and Signal Integrity Analysis of High-speed Mixed-signal Backplanes Based on VPX

    In this paper, the problem of simultaneous switching noise (SSN) in the design of high-speed mixed-signal backplane is analyzed from the aspect of power integrity. How to suppress SSN of high-speed mixed-signal backplane becomes an important research direction at present. Based on the analysis of the traditional decoupling capacitor noise reduction method and the latest noise reduction principle of the electromagnetic band gap (EBG) structures, a novel type of EBG structures is proposed to suppress the noise on the printed circuit board (PCB). The simulation and measurement results show that the noise isolation depth reaches -40dB in the frequency band from 0.4 to 20GHz, which achieves the effect of ultra-wideband high isolation and meets the power and signal integrity requirements of high-speed mixed-signal backplane based on VPX(VITA 46). It provides an experimental reference for the application of the EBG structure on other high-speed mixed-signal backplane and other projects.

  • Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation

    3D XPoint memory is one of the new memory using phase change memory (PCM) and ovonic threshold switch (OTS) with 20 nm 3-dimensional cross array structure. This memory is non-volatile and has better performance in terms of memory process speed than NAND flash memory and memory density than DRAM. The space between interconnections are close so, the voltage coupling affects to the adjacent interconnections during read operation. In this paper, we analyzed the 3D XPoint memory with memory size variation during read operation considering signal integrity (SI). For the analysis, we assumed the overall structure of the 3D XPoint memory and modeled the memory cell that consist of PCM and OTS as behavior model and the interconnections as RC model with 3D electromagnetic (EM) simulator. We fully simulated the 3D XPoint memory including memory behavior model, RC model of interconnections and peripheral circuits such as the addressor and current sense amplifier. With variation of the memory size during read operation, there are SI issues such as voltage coupling and drop trends through the interconnections.

  • Investigation of signal integrity issues in multi-path electrostatic discharge protection device

    This paper studies signal integrity issues in a multi-path electrostatic discharge (ESD) protection device. A commercial four-path ESD protection device is investigated as a case study. The insertion loss, mode conversion and crosstalk of the test circuit are measured. Besides, a circuit model is proposed which has the ability to explain the behavior of the ESD protection device in insertion loss, mode conversion and crosstalk up to 10 GHz. The model is SPICE-compatible and can be used in SPICE-like simulator. Comparison between simulation by ADS and measurement results are also shown. By investigating the model, mechanisms for those non-ideal effects are discussed in this paper as well.

  • Signal integrity and EMI evaluations of an RFID-Sensor tag for internet-of-things applications

    An RFID (radio frequency identification) -Sensor tag for internet of things applications is evaluated for various signal integrity and electromagnetic radiation measures in this paper. It is found that the placement of digital circuit with respect to the radiating element has to be optimized and the entire system layout, digital and RF parts has to be co-simulated to be able to capture the detuning of operating frequency. Port impedance plots are generated via full-wave simulations to show this impact. The coupling between ports is also inspected by monitoring transmission coefficient (S<sub>21</sub>). One possible application of this sensor device is for on- body temperature measurements; therefore, back radiation of the tag and specific absorption rate (SAR) plots are reported as well.

  • High-Speed Signal Integrity Design for HDCA Systems

    This paper presents a reliable design method through signal integrity (SI) analysis, procedure, and debugging in high speed PCB production. Especially, it deals with high speed SI analysis process in computer system expansion board HDCA system PCB design. Pre PCB simulation and post PCB TDR measurement, results and analysis are described.

  • Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

    Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit- based analysis can not meet the accuracy demand. Three-dimensional (3D) full- wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. However it is prohibitively expensive to simulate the practical large board cases and the resultant tabulated S-parameter cannot be directly used to quantify the crosstalk level. This paper introduces a novel hybrid solver techniques with improved speed and accuracy. The new crosstalk metrics to quantify the crosstalk level are also developed by post-processing S-parameter. Combining these two techniques allows designers to achieve full board crosstalk in a few hours as planned intended with using the tool, which significantly reduces the post-layout review time, allows layout optimization and ensures a timely sign-off.



Standards related to Signal Integrity

Back to Top

IEEE Standard for Broadband over Power Line Networks: Medium Access Control and Physical Layer Specifications

The project defines a standard for high-speed (>100 Mbps at the physical layer) communication devices via electric power lines, so-called broadband over power line (BPL) devices. This standard uses transmission frequencies below 100 MHz. It is usable by all classes of BPL devices, including BPL devices used for the first-mile/last-mile connection (<1500 m to the premise) to broadband services as ...


IEEE Standard for Information Technology - POSIX Ada Language Interfaces - Part 1: Binding for System Application Program Interface (API)

This document is part of the POSIX series of standards for applications and user interfaces to open systems. It defines the Ada language bindings as package specifications and accompanying textual descriptions of the applications program interface (API). This standard supports application portability at the source code level through the binding between ISO 8652:1995 (Ada) and ISO/IEC 9945-1:1990 (IEEE Std 1003.1-1990 ...


Standard for Validation of Computational Electromagnetics Computer Modeling and Simulations

This standard defines a method to validate computational electromagnetics (CEM) computer modeling and simulation (M&S) techniques, codes, and models. It is applicable to a wide variety of electromagnetic (EM) applications including but not limited to the fields of electromagnetic compatibility (EMC), radar cross section (RCS), signal integrity (SI), and antennas. Validation of a particular solution data set can be achieved ...