IEEE Organizations related to Boundary Conditions

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Conferences related to Boundary Conditions

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)

ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.


2020 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


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Periodicals related to Boundary Conditions

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Most published Xplore authors for Boundary Conditions

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Xplore Articles related to Boundary Conditions

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Higher-order modes for broadside-coupled striplines in a shield

Radio Science, 2010

A mode-matching method is applied to broadside-coupled striplines in a shield to obtain a dispersion relation. Higher-order mode analyses are performed, and their cutoff frequencies are evaluated. Good agreement with existing solutions is demonstrated. Higher-order field characteristics are illustrated. The mode- matching model provides an efficient and stable means of analyzing broadside- coupled striplines in a shield.


The Finite Difference Method

Introduction to Numerical Electrostatics Using MATLAB, None

This chapter discusses the finite difference (FD) method, and begins by discussing a two-dimensional rectangular structure. It discusses Gauss-Seidel equation solution technique, which is the most efficient technique in terms of computer memory utilization because only the voltages themselves (the desired solution) are stored. The chapter shows the relationship between capacitance and resolution parameter; as the resolution increases, the capacitance ...


Erratum [to "A revised boundary condition for the numerical analysis of Schottky barrier diodes"]

IEEE Electron Device Letters, 1986

A correction is noted for equation (2) in the letter "A Revised Boundary Condition for the Numerical Analysis of Schottky Barrier Diodes," by J. Adams and Ting-Wei Tang, in IEEE Electron Device Letters, vol. EDL-7, no. 9, pp. 525-527, Sept. 1986.


Electromagnetic diffraction at skew incidence by a wedge with anisotropic impedance faces

Radio Science, 2005

The asymptotic expressions for the total field excited by a plane wave obliquely incident on a wedge with anisotropic impedance faces are represented in the framework of the uniform geometrical theory of diffraction. The problem of decoupling the functional difference equations is solved by applying the perturbation technique on the basis of two analytical solutions: normal incidence and grazing to ...


Analysis of inconsistent data in power planning

IEEE Power Engineering Review, 1991

None


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Educational Resources on Boundary Conditions

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Panel: We Succeed by Working in Concert - Internet Inclusion: Global Connect Stakeholders Advancing Solutions, Washington DC, 2016
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IEEE Entrepreneurship @ #HWCup2017: Penta Medical

IEEE-USA E-Books

  • Higher-order modes for broadside-coupled striplines in a shield

    A mode-matching method is applied to broadside-coupled striplines in a shield to obtain a dispersion relation. Higher-order mode analyses are performed, and their cutoff frequencies are evaluated. Good agreement with existing solutions is demonstrated. Higher-order field characteristics are illustrated. The mode- matching model provides an efficient and stable means of analyzing broadside- coupled striplines in a shield.

  • The Finite Difference Method

    This chapter discusses the finite difference (FD) method, and begins by discussing a two-dimensional rectangular structure. It discusses Gauss-Seidel equation solution technique, which is the most efficient technique in terms of computer memory utilization because only the voltages themselves (the desired solution) are stored. The chapter shows the relationship between capacitance and resolution parameter; as the resolution increases, the capacitance falls. The FD solution can provide the voltages at the nodes. The chapter shows the creation of a simple approximation to know the voltage at any point in space using linear interpolation. An approach for calculating the capacitance of a structure is to calculate the energy stored in the electric field and then calculate the capacitance.

  • Erratum [to "A revised boundary condition for the numerical analysis of Schottky barrier diodes"]

    A correction is noted for equation (2) in the letter "A Revised Boundary Condition for the Numerical Analysis of Schottky Barrier Diodes," by J. Adams and Ting-Wei Tang, in IEEE Electron Device Letters, vol. EDL-7, no. 9, pp. 525-527, Sept. 1986.

  • Electromagnetic diffraction at skew incidence by a wedge with anisotropic impedance faces

    The asymptotic expressions for the total field excited by a plane wave obliquely incident on a wedge with anisotropic impedance faces are represented in the framework of the uniform geometrical theory of diffraction. The problem of decoupling the functional difference equations is solved by applying the perturbation technique on the basis of two analytical solutions: normal incidence and grazing to the edge incidence. The numerical results agree well with those presented in published papers and provide a uniform and continuous behavior of the field dependent upon the skewness of the incident wave outside the wedge region.

  • Analysis of inconsistent data in power planning

    None

  • Diffraction by a right-angled impedance wedge

    A plane electromagnetic wave is incident at an oblique (skew) angle on a wedge of open angle 3π/2 with scalar face impedances, the same on both faces. When the theory previously developed for wedges of arbitrary angle with tensor face impedances is specialized to this case, the analysis simplifies, and the resulting expressions for the geometrical optics, surface wave and diffracted fields are presented. Because of the practical importance of this geometry, a large set of figures is included showing the behavior of the diffracted field for a variety of face impedances.

  • Fluid flow in continuous casting mold with a configured nozzle

    The influence of a configured nozzle on the turbulent fluid flow in a continuous casting mold was investigated using the simulation program Visual Cast, which used the finite difference method and the SIMPLER algorithm. CAD software was used to construct the complicated nozzle in the calculational region. The simulation accuracy was validated by comparison with the classic driven cavity flow problem. The simulation results agree well with water modeling experiments. The simulations show that the velocity distribution at the nozzle port is uneven and the jet faces downward more than the nozzle outlet. Simulations with a configured nozzle and the inlet velocity at the nozzle entrance give precise results and overcome the traditional difficulty in determining the nozzle outlet velocity.

  • Some FEM Topics

    This chapter begins with a discussion on symmetries. The finite element method (FEM) formulation algorithm for a structure with a symmetry axis is to create the matrices for only one side of the symmetry axis (including the nodes on the symmetry axis itself), leaving the nodes on the symmetry axis as variables. The chapter provides a symmetry example including a two-sided capacitance estimate. Modifying the MATLAB code to study axisymmetric problems is very simple. A situation often encountered in electrostatic analysis is an axisymmetric structure where the outer boundary is a potential that is graded (typically linearly) between two defined points. An example of such a structure is shown in the chapter. Many structures are not well described as a layout with an enclosing boundary.

  • The Finite Element Method (FEM)

    Historically, much of the formal development of the finite element method (FEM) occurred in the mechanical engineering community. While electrostatics problems typically have fairly simple boundary conditions, they can have very complex structures, so the applicability and popularity of the FEM is well deserved. This chapter shows solving of Laplace's equation by minimizing the stored energy. It demonstrates a very simple finite element approximation. The next step in the process of improving the approximate solution to the concentric circle problem is to break the region down into a large number of line segments. One attribute of the FEM equation organization is the ease with which mixed dielectric regions are handled. Improved voltage approximation can be found by defining a function that itself has one or more adjustable parameters. The chapter also discusses a simple two-dimensional FEM program.

  • Derivation of magnetic fields on a metal cylinder excited by longitudinal and transverse magnetic dipole transmitters: I. Cylinder in unbounded dissipative dielectric medium

    We derive new and exact analytical and convergent integral representations for the frequency-dependent complex magnetic fields Hz(a, φ, z) and Hφ(a, φ, z) excited by oscillating point magnetic dipole transmitters on the surface of an infinitely long metal cylinder of radius a in an unbounded dissipative dielectric medium. Hz(a,φ, z) is calculated for a longitudinally oriented magnetic dipole parallel to the cylinder axis and Hφ(a,φ, z) for a transversely oriented magnetic dipole perpendicular to the axis. The solutions are relevant to the computation of phase shifts and attenuations measured by electromagnetic propagation logging tools, which have oscillating longitudinal and transverse magnetic dipole transmitters either on a metal drill collar or on a cylindrical antenna pad. The integral representations can be readily evaluated using simple numerical integration algorithms, e.g., Simpson's rule, to accurately compute the complex magnetic fields on the cylinder surface. A second paper will address the two-layer cylindrical media problem.



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