IEEE Organizations related to Scanning Thermal Microscopy

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Periodicals related to Scanning Thermal Microscopy

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Most published Xplore authors for Scanning Thermal Microscopy

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Xplore Articles related to Scanning Thermal Microscopy

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Reliable and accurate temperature measurement using scanning thermal microscopy with double lock-in amplification

2009 IEEE International Reliability Physics Symposium, 2009

A scanning thermal microscopy (SThM) technique incorporating double lock-in amplification is developed to minimize temperature drift and artifacts due to probe-sample contact area. The localized temperature change of an interconnect biased with a switching current supply is measured with improved signal level and a significant reduction of topographic artifacts.


CTE-matched Cantilevers for Improved Heated Atomic Force Microscopy and Passive-mode Scanning Thermal Microscopy

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018

Standard high-sensitivity Au-SiNxmetal-dielectric bi-morph probes suffer from large thermally-induced deflections (≥2μm) at elevated temperature, making measurements difficult or impossible. This study describes the design, fabrication, and testing of CTE-matched AFM probes aimed to eliminate probe bending during thermal loading. After a brief introduction to the problem, 15 metal-dielectric combinations are modeled to determine the most favorable combinations. Following this analysis, ...


New Methods for Calibrated Scanning Thermal Microscopy (SThM)

SENSORS, 2007 IEEE, 2007

A batch microfabricated scanning thermal microscopy (SThM) probe is presented. The sensor, based on a Pd resistance thermometer is shown to be suitable for calibration and stable for very long periods (> 700 hours). A technique for achieving transformer isolation of the SThM probe is described and shown to be a highly effective route to obtaining calibrated SThM scans of ...


Thermal conductivity measurements with the 3ω method and scanning thermal microscopy

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2013

Various techniques allow measuring the thermal conductivity of materials ranging from bulk to thin-film sizes. Among them, one can find the 3ω method, scanning thermal microscopy or Raman thermometry. The standard 3ω method is not spatially-resolved since it requires a long deposited metallic wire. It is also intrusive. In contrast, the two other techniques have spatial resolution ranging from few ...


A novel scanning Thermal Microscopy System

2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS), 2007

This paper describes a concept, fabrication and evaluation of a novel nano- meter scale scanning thermal microscopy (SThM) system. The purpose of this research is a realization of a non contact type SThM system. A measurement probe in our system consists of a pyroelectoric detector and an infrared ray shielding film with an aperture for high lateral resolution. It is ...


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Educational Resources on Scanning Thermal Microscopy

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IEEE.tv Videos

Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Ultrafast Lasers for Multi-photon Microscopy - Plenary Speaker: Jim Kafka - IPC 2018
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
Real-time Spectrogram Analysis of Continuous Optical Wavefields - José Azaña - Closing Ceremony, IPC 2018
3D Body-Mapping for Severely Burned Patients - Julia Loegering - IEEE EMBS at NIH, 2019
Nanoscale Magnetism with Picosecond Time Resolution and High Sensitivity - Hendrik Ohldag - IEEE Magnetics Distinguished Lecture
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
ITRI: Technology Advances in Flexible Displays and Substrates
Hertz-Class Brillouin Lasing with Nanokelvin Thermal Sensing - William Loh - Closing Ceremony, IPC 2018
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
APEC 2011 Exhibitor Overview
A 200um x 200um x 100um, 63nW, 2.4GHz Injectable Fully-Monolithic Wireless BioSensing System: RFIC Industry Showcase 2017
Heterogeneous Photonic Packaging - John Osenbach - IPC 2018
Microstructure-Property Correlations in Superconducting Wires - Applied Superconductivity Conference 2018
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
Implantable, Insertable and Wearable Micro-optical Devices for Early Detection of Cancer - Plenary Speaker, Christopher Contag - IPC 2018

IEEE-USA E-Books

  • Reliable and accurate temperature measurement using scanning thermal microscopy with double lock-in amplification

    A scanning thermal microscopy (SThM) technique incorporating double lock-in amplification is developed to minimize temperature drift and artifacts due to probe-sample contact area. The localized temperature change of an interconnect biased with a switching current supply is measured with improved signal level and a significant reduction of topographic artifacts.

  • CTE-matched Cantilevers for Improved Heated Atomic Force Microscopy and Passive-mode Scanning Thermal Microscopy

    Standard high-sensitivity Au-SiNxmetal-dielectric bi-morph probes suffer from large thermally-induced deflections (≥2μm) at elevated temperature, making measurements difficult or impossible. This study describes the design, fabrication, and testing of CTE-matched AFM probes aimed to eliminate probe bending during thermal loading. After a brief introduction to the problem, 15 metal-dielectric combinations are modeled to determine the most favorable combinations. Following this analysis, Ti-coated, Cr-coated, and Ti-Ge-coated SiNxprobes are fabricated and thermally tested using a confocal microscope. The Ti-Ge-coated samples demonstrated minimal thermal deflection at temperatures as high as 100°C.

  • New Methods for Calibrated Scanning Thermal Microscopy (SThM)

    A batch microfabricated scanning thermal microscopy (SThM) probe is presented. The sensor, based on a Pd resistance thermometer is shown to be suitable for calibration and stable for very long periods (> 700 hours). A technique for achieving transformer isolation of the SThM probe is described and shown to be a highly effective route to obtaining calibrated SThM scans of electrically sensitive samples as well as those subject to large bias voltages.

  • Thermal conductivity measurements with the 3ω method and scanning thermal microscopy

    Various techniques allow measuring the thermal conductivity of materials ranging from bulk to thin-film sizes. Among them, one can find the 3ω method, scanning thermal microscopy or Raman thermometry. The standard 3ω method is not spatially-resolved since it requires a long deposited metallic wire. It is also intrusive. In contrast, the two other techniques have spatial resolution ranging from few microns to submicronic one, depending on the conditions of operation. However, their sensitivity is altered by various parameters. For instance, scanning thermal microscopy signals depend strongly on the surface state. Here, by gathering results obtained with these techniques, we report on the comparison of the experimental determination of the thermal conductivity of various silicon-based and thermoelectric materials of strong interest for microelectronics. In particular, we highlight the evolution of the thermal conductivity with the temperature, which is customarily determined by the 3ω method. While it requires lithography, which can be considered as a drawback at first, the 3ω method is easier to use when varying the temperature. We conclude on the advantages and drawbacks of these techniques and provide a matrix of choices depending on the materials and conditions.

  • A novel scanning Thermal Microscopy System

    This paper describes a concept, fabrication and evaluation of a novel nano- meter scale scanning thermal microscopy (SThM) system. The purpose of this research is a realization of a non contact type SThM system. A measurement probe in our system consists of a pyroelectoric detector and an infrared ray shielding film with an aperture for high lateral resolution. It is shown that the first results of the pyroelectric detector (PZT) and the shielding film with an aperture were successfully fabricated.

  • Calibration methodologies for scanning thermal microscopy

    This work analyses the heat transfer between various scanning thermal microscopy (SThM) probes and samples. In order to perform quantitative measurements with SThM techniques, we have developed well-established and reproducible calibration methodologies. We present here two approaches of the SThM measurement: one to measure thermal conductivity of solid materials with a Wollaston SThM microprobe and a second one to evaluate phase transition temperatures of polymeric materials with a silicon low-doped nanoprobe. Based on the comparison of experimental data and modeling results, we have estimated the local resolution of the microprobe to be associated to a radius of 300 nm. Concerning the nanoprobe, we have demonstrated the strong dependence of measurement on sample topography and roughness.

  • Direct observation of electromagnetic near field in silicon nanophotonics devices using scanning thermal microscopy (SThM) technique

    We observe directly for the first time optical near field in silicon nanophotonics devices with nanoscale resolution using near field scanning thermal microscopy and demonstrated its advantage over the NSOM technique.

  • Measurement of thermal contact resistance between CVD-grown graphene and SiO2by null point scanning thermal microscopy

    For graphene-based electronic devices, it is crucial to measure and analyze the thermal contact resistance between the graphene and the insulating layer. Herein, we measure the thermal contact resistance between CVD-grown graphene and a SiO2layer using null point scanning thermal microscopy (NP SThM), which can profile the temperature distribution quantitatively with nanoscale spatial resolution by preventing the influence of both the heat flux through the air gap and the variation of sample surface properties such as hydrophilicity. Through the comparison of the temperature jump across the interface of the electrically heated graphene and SiO2layer with the temperature profile without the thermal contact resistance modelled with finite element method, the thermal contact resistance between the graphene and SiO2is obtained as 10 × 10-8~ 45 × 10-8m2K/W.

  • Probing thermal transport and layering in disk media using scanning thermal microscopy

    With the advent of heat-assisted magnetic recording (HAMR) [1] the thermal transport properties of magnetic recording media have become a key performance characteristic. In this study we explore the potential of scanning thermal microscopy (SThM) [2] to resolve thermal transport on the nanoscale and use a multilayered, grain segregated conventional disk with the structure reported in [3].

  • Heat transfer mechanisms quantified at submicron scales in scanning thermal microscopy

    This work investigates the heat transfer between scanning thermal microscopy (SThM) probes and samples. It presents a detailed study of the heat transfer mechanisms that operate between the probe and the sample. Two SThM resistive probes of different sizes were used in active mode. Depending on the experimental conditions, the heat transferred to the sample through water meniscus, solid-solid contact and air is quantified. The methodology established to estimate the heat conduction through water meniscus shows that this mechanism is not dominant in the tip-sample heat exchange. Based on experimental results of measurements performed under vacuum conditions, the thermal boundary resistance at different contacts is estimated and in accordance with literature values. Through measurements performed under ambient conditions, the heat conduction through air appears to be strongly dependent on the sample thermal conductivity.



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