IEEE Organizations related to Creep

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Conferences related to Creep

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

The Conference focuses on all aspects of instrumentation and measurement science andtechnology research development and applications. The list of program topics includes but isnot limited to: Measurement Science & Education, Measurement Systems, Measurement DataAcquisition, Measurements of Physical Quantities, and Measurement Applications.


2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

The world's premiere conference in MEMS sensors, actuators and integrated micro and nano systems welcomes you to attend this four-day event showcasing major technological, scientific and commercial breakthroughs in mechanical, optical, chemical and biological devices and systems using micro and nanotechnology.The major areas of activity in the development of Transducers solicited and expected at this conference include but are not limited to: Bio, Medical, Chemical, and Micro Total Analysis Systems Fabrication and Packaging Mechanical and Physical Sensors Materials and Characterization Design, Simulation and Theory Actuators Optical MEMS RF MEMS Nanotechnology Energy and Power


2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

electronic components, materials, packaging, integration, microfluidics, mems, sensors


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Xplore Articles related to Creep

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Creep properties of Sn-rich solder joints

53rd Electronic Components and Technology Conference, 2003. Proceedings., 2003

None


Simulation of three-dimensional wirebond deformation during transfer molding

1995 Proceedings. 45th Electronic Components and Technology Conference, 1995

During the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a ...


General model for sag-tension calculation of composite conductors

2001 IEEE Porto Power Tech Proceedings (Cat. No.01EX502), 2001

A new computer model is presented for precise calculation of sag and tensions of composite conductors for overhead lines. All the effects known to increase the sag are accounted for: residual deformations, evolution of creep with time, compression in aluminum layer of ACSR conductors at high temperature, etc. This general model can also be applied for the simpler cases of ...


Research on high-speed railway PC continuous girder bridge creep and shrinkage

2011 International Conference on Electric Technology and Civil Engineering (ICETCE), 2011

To ensure passenger comfort and safety of train operation, high-speed rail on track for Comfort demanding, and concrete shrinkage and creep is the impact on passenger line prestressed concrete continuous bridge of track an important factor, so construction control post creep of concrete proposals to decrease the method is very necessary. The article taking the high-speed railway for engineering background, ...


Fatigue life predictions of solder joint under thermal cyclic loading

2007 International Microsystems, Packaging, Assembly and Circuits Technology, 2007

The main failure of the solder joint in the electronic components is related with the thermal cyclic loading and the coefficient of thermal expansion (CTE) mismatched between the chip and the substrate. Therefore, this study will focus on the reliability assessed by using finite element analysis to simulate the PBGA-256 slice models with both lead-free (95.5Sn-3.9Ag-0.6Cu) and tin- lead (62Sn-36Pb-2Ag) ...


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Educational Resources on Creep

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IEEE-USA E-Books

  • Creep properties of Sn-rich solder joints

    None

  • Simulation of three-dimensional wirebond deformation during transfer molding

    During the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a 25-leaded IC package.

  • General model for sag-tension calculation of composite conductors

    A new computer model is presented for precise calculation of sag and tensions of composite conductors for overhead lines. All the effects known to increase the sag are accounted for: residual deformations, evolution of creep with time, compression in aluminum layer of ACSR conductors at high temperature, etc. This general model can also be applied for the simpler cases of one- material conductors and messengers supporting multiples or telecommunication cables.

  • Research on high-speed railway PC continuous girder bridge creep and shrinkage

    To ensure passenger comfort and safety of train operation, high-speed rail on track for Comfort demanding, and concrete shrinkage and creep is the impact on passenger line prestressed concrete continuous bridge of track an important factor, so construction control post creep of concrete proposals to decrease the method is very necessary. The article taking the high-speed railway for engineering background, the finite element model of the bridge, analysis and without considering the effects of shrinkage and creep deflection of the bridge.In the construction process and construction process and puts forward some solutions design aspects of creep deformation. For the future of the railway bridge creep deflection control provides some technical method.

  • Fatigue life predictions of solder joint under thermal cyclic loading

    The main failure of the solder joint in the electronic components is related with the thermal cyclic loading and the coefficient of thermal expansion (CTE) mismatched between the chip and the substrate. Therefore, this study will focus on the reliability assessed by using finite element analysis to simulate the PBGA-256 slice models with both lead-free (95.5Sn-3.9Ag-0.6Cu) and tin- lead (62Sn-36Pb-2Ag) solder joints under thermal cyclic loading. The fatigue life prediction models based on the accumulated creep strain and the accumulated creep strain energy density for lead-free and tin-lead solder joints are to use the Schubert's equation and Dudek's equation to estimate the fatigue lives of the solder joint in the PBGA-256 package.

  • Numberical simulation of welding deformation under different conditions

    Finite element software ANSYS was employed to simulate the welding and heat treatment process of the Q345 plate with V-groove. A reasonable three- dimensional solid model was set up, element birth and death technology was used to simulate the formation of the weld. In the welding and cooling process, constraint was applied on both sides of the base metal. When the specimen was cooled to room temperature, constraint was removed. The deformation before and after removing constraint were compared. The results show that the removal of constraint makes the deformation increase. Then heat treatment was conducted on the plate of which the constraint was removed. The deformation results show that heat treatment reduces the angular distortion caused by removing constraint.

  • Transport and magnetic properties of Ag-sheathed Bi-2223 tapes

    Bi-2223 tapes were investigated by transport and magnetic measurements. Two different regimes concerning the field dependence of the critical current density J/sub c/ are obtained. At T/spl ges/6 K J/sub c/ follows an exponential law. From analysis of magnetic relaxation measurements by means of distributions of activation energies an explanation of the low temperature behaviour of J/sub c/, in terms of a change in pinning behaviour is possible.<>

  • Trapped field magnets of high-T/sub c/ superconductors

    To develop trapped field magnets with YBCO bulks at and below 77 K, a series of trapped field magnets have been developed and tested. With two /spl Phi/26 mm/spl times/10 mm YBCO bulks, a trapped field magnet of 7.09 T at 29.8 K with low creep has been achieved. Cracks occur when 10 T magnetic field is applied to charge this magnet. With two /spl Phi/16 mm/spl times/10 mm YBCO bulks, a trapped field magnet of 7.02 T at 12.8 K has been achieved. Creep behavior of trapped field magnets at low temperatures are also investigated. When the trapped field is much lower than critical field, almost no creep was observed in the authors' experiments.

  • Trapped field characteristics of Y-Ba-Cu-O bulk in time-varying external magnetic field

    It is very important to clarify characteristics of trapped field in HTS bulk exposed to an external AC magnetic field in application of high-temperature superconducting bulk to motors, magnetic levitation systems, bulk magnets and so on. We have experimentally investigated the transition of trapped field while applying external AC magnetic field to a disk-shaped YBCO bulk. The observed trapped-field attenuation is different from that by flux creep, i.e., zero external field. It may be considered that the trapped-field attenuation is affected by external AC magnetic field, particularly temperature rise due to AC loss. In this paper, electromagnetic behavior within the bulk exposed to external AC magnetic field, especially supercurrent distribution, are investigated numerically using a simulation code based on the finite element method (FEM) considering voltage-current (E-J) characteristic. We focus on the relationship between the transition of supercurrent distribution within the bulk while applying external AC magnetic field and both n-value of E-J characteristic and temperature rise by AC loss.

  • Creep corrosion test in flowers of sulfur chamber

    Creep corrosion is the corrosion of the copper (and sometimes silver) metallization on PCBs and the creeping of the corrosion product (mostly sulfides of copper and sometimes silver) on the board surfaces which may lead to the electrically shorting of neighboring features on PCBs. The problem of creep corrosion has been largely brought under control by selecting finishes, by trial and error, that have less propensity to creep corrosion. But the challenge of a reliable qualification test for creep corrosion remains, though some progress has been made developing the mixed flowing gas (MFG), the Chavant clay and the flowers of sulfur tests. The iNEMI (International Electronics Manufacturing Initiative) technical project team on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consists of a 300-mm cube chamber with two means of mounting the test specimens and flowing air over them to expose them to constant, predefined humidity and temperature conditions and sulfur and other contaminants. The FOS chamber performance has been evaluated using copper and silver foils and preliminary test runs have been conducted on PCBs from a manufacturing lot known to have failed in service. The effect of air velocity on the copper and silver corrosion rates was quite linear. The effect of humidity on copper and silver corrosion rates in the low air velocity range of less than 0.1 m/s showed a strong dependence on relative humidity. In the high velocity range of 1 m/s, there was no clear dependence of humidity on copper and silver corrosion rates. A means has been developed for applying controlled concentration of ionic contamination on selected local areas of test PCBs. Preliminary test runs have shown that ionic contamination found in fine dust may be a necessary condition for copper creep corrosion. The focus of this paper is the design of a FOS chamber and its performance evaluation using copper and silver foils and the preliminary testing of the procedure using PCBs from a manufacturing lot known to have failed in service.



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