1,675 resources related to Surface-mount Technology
- Topics related to Surface-mount Technology
- IEEE Organizations related to Surface-mount Technology
- Conferences related to Surface-mount Technology
- Periodicals related to Surface-mount Technology
- Most published Xplore authors for Surface-mount Technology
No organizations are currently tagged "Surface-mount Technology"
No conferences are currently tagged "Surface-mount Technology"
No periodicals are currently tagged "Surface-mount Technology"
IEEE 1992 International Conference on Consumer Electronics Digest of Technical Papers, 1992
2008 16th IEEE International Conference on Advanced Thermal Processing of Semiconductors, 2008
▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D; materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and ...
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999
The key to low cost and high profit margins in flip chip assembly is high process throughput. While flip chip technology has been widely publicized over the last several years, little attention has been paid to process throughput while the majority of work has concentrated on interconnect technologies. The purpose of this project is to develop process technologies and material ...
2009 IEEE MTT-S International Microwave Symposium Digest, 2009
The cost of the millimeter-wave functions in the system overall price is today one of the main limiting factor for new high frequencies applications like wide band automotive RADARs or high data rate radios. A big difficulty for the new devices above 60 GHz is to be intrinsically low cost, but also to comply with simple and standard assembly techniques ...
Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004., 2004
The information communication infrastructure has increased the need for broadband. In order to meet this need, products for 10 Gbit Ethernet applications have been introduced to the market. The proliferation of Ethernet service, which offers lower cost and wider bandwidth in comparison with a leased line, enabled enormous amounts of high-speed data. However, such data transfers, with large capacity and ...
Brooklyn 5G 2016: Panel on eHealth and Virtual Reality
Brooklyn 5G 2016: Dr. Partho Sengupta on Mobile Health Biomedical Imaging
3D Body-Mapping for Severely Burned Patients - Julia Loegering - IEEE EMBS at NIH, 2019
A Robot to Mine the Moon
IROS TV 2019-STAR LAB at the University of Surrey Space Technology for Autonomous systems & Robotics
IMS 2011 Microapps - A Multi-Level Conductor Surface Roughness Model
Lighting the Way: Optical Sensors in the Life Sciences
IMPASS: Intelligent Mobility Platform with Active Spoke System
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 5 of 7 - SQUID Instrumentation for Early Cancer Diagnostics
Life Sciences: Surface Enhanced Raman Spectroscopy, and more
IEEE Magnetics Distinguished Lecture - Yoshichika Otani
BSIM Spice Model Enables FinFET and UTB IC Design
Making Orthogonal Transitions with Climbing Mini-Whegs
Lunar Industrialization: The First Step to the Solar System
Perpendicular magnetic anisotropy: From ultralow power spintronics to cancer therapy
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
Silicon THz: an Opportunity for Innovation
ASC-2014 SQUIDs 50th Anniversary: 4 of 6 - Keiji Enpuku
Demonstrations of Gravity-Independent Mobility and Drilling on Natural Rock using Microspines
▪ Strained and Ge-based materials have great interests for CMOS technology enhancement ▪ However, their introduction as channel and/or S&D; materials has a strong impact on the Salicide process which needs adaptations in order to keep the expected benefit induced by these new materials ▪ Indeed, new issues related to the silicidation (germanidation) of these advanced materials have emerged and most of them have been solved (exemple : Ge lateral diffusion) ▪ In addition to strained and Ge-based materials, the choice of the silicide/germanide contact material in itself, as well as the associated salicide process, are key areas for further performance enhancement (interface engineering, dual silicide approach…)
The key to low cost and high profit margins in flip chip assembly is high process throughput. While flip chip technology has been widely publicized over the last several years, little attention has been paid to process throughput while the majority of work has concentrated on interconnect technologies. The purpose of this project is to develop process technologies and material systems which could make the flip chip assembly process transparent to SMT and packaging and assembly lines by eliminating flip chip flux application, underfill application, and underfill cure processes by using reflowable encapsulants applied to bumped flip chip wafers. This paper presents an evaluation of several methods of material deposition at the wafer level over bump geometries and discusses critical factors and challenges involved therein. Some of the factors include polymer film thickness and uniformity, including edge effects, shadowing, and non-conformal coatings over the bumped regions of the wafer. This paper also discusses the process technology, challenges, and preliminary yield analysis associated with the assembly of pre-underfilled chips directly to low-cost substrates. Of particular interest is how a placement machine handles coated die. In general, the quality of the material coating is dependent on drying method, application method, and the material's theology. Multiple coats, when necessary, serve to provide beneficial leveling of the material. A commercial placement machine is capable of imaging bumps on a coated die and placing it, given the correct set of lighting conditions and transforms. Increasing placement pressure aids in reflow.
The cost of the millimeter-wave functions in the system overall price is today one of the main limiting factor for new high frequencies applications like wide band automotive RADARs or high data rate radios. A big difficulty for the new devices above 60 GHz is to be intrinsically low cost, but also to comply with simple and standard assembly techniques at the module level. This very hard challenge has already been overcome for applications below 40 GHz with low cost plastic Quad Flat No-Lead packages (QFN) in the last three years. This generation of plastic packages has strongly contributed to decrease the weight of packaging and assembly in the system's cost. It has also enabled the assembly of microwave devices on standard SMT lines achieving industrial and competitive microwave solutions. Today, the same demand exists for millimeter- wave applications. And plastic packaging solutions has to be pushed to their limits to fulfill these objectives. This paper will present new ultra-low cost packaging concepts involving plastic over-molding techniques. The realization of a 77 GHz transmitter for automotive RADAR packaged in a plastic QFN will be detailed.
The information communication infrastructure has increased the need for broadband. In order to meet this need, products for 10 Gbit Ethernet applications have been introduced to the market. The proliferation of Ethernet service, which offers lower cost and wider bandwidth in comparison with a leased line, enabled enormous amounts of high-speed data. However, such data transfers, with large capacity and high speed, demands tight specifications for the oscillator used as a frequency generator. As a solution for those demands, we built a small packaged, 7/spl times/5 mm, 622.08 MHz VCSO (voltage controlled SAW oscillator) with a SAW (surface acoustic wave) resonator using high density surface mount technology. Then, we confirm that our VCSO could offer the same level of good linearity, wide pull range, and excellent frequency short-term stability as a VCXO, and that it can be of practical use.
The aim of this work is utilization of anisotropic conductive adhesives in industrial praxis. The accent was laid on the new approaches in solving of tasks by using of standard electrotechnologies and available production facilities. The results of the work was advisement of anisotropic conductive joints usability as an alternative of soldered joints in production process at equipment, what is mainly used for reflow of standard Sn63Pb solder between contact areas. As simplest adaptable are the existing production facilities, the less expensive is the process transformation. Practical results of the performed study indicate, that realized joints with applied anisotropic conductive adhesive have comparable electrical conductivity with soldered ones. The lower mechanical strength with concerning of operating conditions is the less relevant.
At the contractor level once a product is required to be soldered with lead- free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes. The selection of soldering materials and fluxes are important as to insure high quality solder joints with leadfree solders which tend to wet slower than leaded solders but also the process equipment must be lead-free process compatible. Components must be lead-free and able to meet the thermal requirements of the process but also the MSL (moisture sensitivity limits) must be observed. Board finish must be lead-free and the PCB must be able to sustain higher process temperature cycles with no physical damage but also good solderability to enable subsequent soldering at the wave or hand assembly. Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. The IPC Solder Value Product Council as the preferred option endorsed Sn96.5Ag3.0Cu0.5 (SAC305) for SMT assembly and most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional leaded process for this reason many contract manufacturers and PCBA assemblers are opting for less costly options such as tin-copper based solders for wave, selective, handsoldering, dip tinning operations. In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall properties and performance of tin-copper solders. Tin-copper solder without the incremental additions of certain elements is rarely used but the addition of nickel or nickel and bismuth as found for example in K100 and K100LD respectively do offer improvements in wetting, joint cosmetics and in some cases solder joint reliability. In this conversion SAC305 was used for the reflow process, tin-copper-nickel based solder K100 was used in the wave soldering operation and it was also used in solder wire form for hand assembly. This paper is a summary of the experience at a medium sized assembler in achieving the customer driven mandate to go lead-free and the maintenance of production yields and quality using both tin- silver-copper and tin-copper in the assembly of high end printer boards. Over 120,000 builds were achieved with a 99.6% first pass yield for the overall soldering process.
A millimeter-wave waveguide filter suitable for surface mounting has been designed and realized using plastic injection molding and metal coating technology. The manufacturing process enables low cost mass production of the plastic filters in high quality. In combination with fully automated SMD assembly techniques this concept allows the low cost integration of waveguide components into planar circuits, as it will be required in future mass market millimeter-wave transceiver applications, as for example LMDS or VSAT.
For the INDRA charged-particle detector, high-density electronics modules have been developed. The size of a complete channel will be reduced to about 40 cm/sup 3/ by the use of special surface mounted technology (SMT) circuits: constant fraction discriminator (CFD), gate generator, charge integrator, etc.<>
No standards are currently tagged "Surface-mount Technology"