IEEE Organizations related to Convection

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Conferences related to Convection

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 IEEE Industry Applications Society Annual Meeting

The Annual Meeting is a gathering of experts who work and conduct research in the industrial applications of electrical systems.


2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

electronic components, materials, packaging, integration, microfluidics, mems, sensors


2019 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC)

The aim of the conference is to provide a premier platform for electrical engineers and researchers to present their works and to share experiences and ideas in power and energy engineering with experts and scholars from around the world. Started in Wuhan in 2009, APPEEC is now an annual power engineering conference organized in Asia-Pacific Region.


2018 10th International Conference on Communication Software and Networks (ICCSN)

2018 10th International Conference on Communication Software and Networks (ICCSN 2018) will be held during July 6-9, 2018 in Chengdu, China. ICCSN 2018 is sponsored by University of Electronic Science and Technology of China, co-sponsored by 54th Institute, CETC, China, Science and Technology on Communication Networks Laboratory, supported by Guangdong University of Technology, China and AET Journal.

  • 2017 IEEE 9th International Conference on Communication Software and Networks (ICCSN)

    ICCSN 2017 is one of the leading international conferences for presenting novel and fundamental advances in the fields of Communication Software and Networks. It also serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Communication Software and Networking related techniques.

  • 2016 8th IEEE International Conference on Communication Software and Networks (ICCSN)

    I. COMMUNICATIONS NETWORKS AND SYSTEMSNetworking: Future Internet/Future Networks QoS/QoE and Resource Management Optical Networks Wireless, Mobile, Adhoc and Sensor Networks Ubiquitous Networks Network Security Multimedia Networking etc. Communication Systems Coding and Information Theory Wireless, UWB, Ultrasonic Communications Satellite Communications Other Emerging Technologies: Network Coding, Software Defined Radio, Cognitive Radio etc.II. SIGNAL PROCESSING & APPLICATIONS Signal, Image, Audio, Video Processing, Analysis and Applications Pattern Recognition Biomedical Signal Processing and Analysis Signal Filtering, Detection and Estimation Statistical Signal Processing and Modeling Ambient Intelligence Computer Vision and AuditionIII. OPTICAL COMMUNICATIONS AND NETWORKING Design and Management of Optical Networks Optical Networks Performance Modeling Optical Networks Control and Management Optical Modulation and Signal Processing Reliable Optical Netwo

  • 2015 IEEE International Conference on Communication Software and Networks (ICCSN)

    ICCSN 2015 is one of the leading international conferences for presenting novel and fundamental advances in the fields of Communication Software and Networks. It also serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Communication Software and Networking related techniques.

  • 2011 IEEE 3rd International Conference on Communication Software and Networks (ICCSN)

    ICCSN is an annual international forum for state-of-the-art research in Communication Software and Network Technology. It also serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Communication Software and Networking related techniques.


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Periodicals related to Convection

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Most published Xplore authors for Convection

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Xplore Articles related to Convection

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Introductory Survey on Fluid Dynamics

Filamentary Ion Flow: Theory and Experiments, None

This chapter presents an introduction to fluid dynamics. Interpreting a perfect gas model according to a statistical or continuum concept is of fundamental importance in the analysis of the fluid motion. An elementary material element of the continuum, previously indicated as a fluid particle, generally happens to be subject to longitudinal and angular deformations as it moves with the flow. ...


Why Kp is such a good measure of magnetospheric convection

Space Weather, 2004

The 3-hour magnetic activity index, Kp, is widely used for measuring the level of magnetospheric activity, and many magnetospheric properties are known to correlate with it. The common denominator for these different properties is the strength of the magnetospheric convection electric field, the large-scale electric field imposed across the magnetosphere by the flow of the magnetized solar wind past the ...


Investigation of heat transfer coefficient variation in air cooled hybrid electronic circuits

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016

This paper discusses the problem of heat transfer coefficient variation in air cooled hybrid circuits. The investigations are based on a practical example of a circuit containing a bipolar transistor heat source. Its temperature is measured using the base-emitter junction. Additionally, infrared measurements of circuit surface temperature are taken. The measurements are carried out in a wind tunnel for different ...


An Innovative Transom Type Venturi Cooling Design for High-Power LED Headlamp

2017 International Conference on Information, Communication and Engineering (ICICE), 2017

High power LED headlamp has the advantage of environmental protection and long-term usage and usually adopted as illuminating system in automobiles and motorcycles. But the problem of using high power LED is the heating issue which always costs a lot on heat dissipation design and thus limits its popularity. How to improve the heat performance and reach a feasible design ...


Numerical Analysis and Optimization of Thermal Performance of LED Filament Light Bulb

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017

This paper presents numerical studies on thermal performance of LED filament light bulbs with different bulb sizes, phosphor diameters, and phosphor shapes. A quarter of numerical model of LED filament light bulbs was built to analyze the temperature field, velocity field and distributions for convective heat flux coefficient on the filament surface. The effects of bulb sizes, phosphor diameters and ...


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Educational Resources on Convection

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IEEE.tv Videos

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IEEE-USA E-Books

  • Introductory Survey on Fluid Dynamics

    This chapter presents an introduction to fluid dynamics. Interpreting a perfect gas model according to a statistical or continuum concept is of fundamental importance in the analysis of the fluid motion. An elementary material element of the continuum, previously indicated as a fluid particle, generally happens to be subject to longitudinal and angular deformations as it moves with the flow. The chapter discusses conservation laws, and followed by a discussion on Stokesian and Newtonian fluids. The derivation of the Navier- Stokes equation from the momentum conservation, is shown in the chapter. This is followed by discussions on incompressible and irrotational flows. Among the individual fields describing the flow field, special importance is ascribed to the continuous velocity-field which, in particular, is also admitted to be finite and to vanish at infinity. The chapter ends with a discussion on Bernoulli's equation and Lagrange's function.

  • Why Kp is such a good measure of magnetospheric convection

    The 3-hour magnetic activity index, Kp, is widely used for measuring the level of magnetospheric activity, and many magnetospheric properties are known to correlate with it. The common denominator for these different properties is the strength of the magnetospheric convection electric field, the large-scale electric field imposed across the magnetosphere by the flow of the magnetized solar wind past the Earth. While the relationship between Kp and the global convection field has long been known, the question of why the relationship exists has apparently not been addressed. In this report, it is proposed that because Kp is derived from magnetic variations obtained at subauroral stations, it is extremely sensitive to the latitudinal distance to the equatorial edge of the auroral region, where the principal causative currents flow. Since the auroral region maps to the plasma sheet in the magnetosphere, motion of the inner edge of the plasma sheet, which is determined by the strength of the convection field, causes significant changes in Kp. Thus, through its dependence on the latitude of the auroral current region, Kp can be viewed as a direct monitor of the strength of magnetospheric convection, explaining the success of previous Kp-dependent models of the global electric field.

  • Investigation of heat transfer coefficient variation in air cooled hybrid electronic circuits

    This paper discusses the problem of heat transfer coefficient variation in air cooled hybrid circuits. The investigations are based on a practical example of a circuit containing a bipolar transistor heat source. Its temperature is measured using the base-emitter junction. Additionally, infrared measurements of circuit surface temperature are taken. The measurements are carried out in a wind tunnel for different values of dissipated power and with variable cooling air speed. The measurement results are analysed allowing the assessment of heat transfer coefficient variation with surface temperature and cooling air velocity. Based on the analyses, compact thermal models are generated for the circuit allowing fast and accurate simulation of circuit temperature in various cooling conditions.

  • An Innovative Transom Type Venturi Cooling Design for High-Power LED Headlamp

    High power LED headlamp has the advantage of environmental protection and long-term usage and usually adopted as illuminating system in automobiles and motorcycles. But the problem of using high power LED is the heating issue which always costs a lot on heat dissipation design and thus limits its popularity. How to improve the heat performance and reach a feasible design with reasonable cost of high power LED is our purpose. This project proposes an innovative window type Venturi cooling system to help reduce the high power LED emitting heat on working. It uses lamp-shape heat sink base that is coated by aluminum nitride (AlN) ceramics to be an insulation layer which can reduce the damage of emanating heat and promote the working hours of high power LED. In the experiment a heat sink base is mounted on the lamp base and a set of fin type aluminum contained in the Venturi to help dissipate heat is connected with the lamp. A convection window stands in the Venturi system to help the aluminum cool down. It is obviously seen that the force convection contributes a lot on heat dissipation when vehicles running. The record shows that the highest temperature comes to 96.4 °C ` 93.3 °C and 89.8 °C on the high power LED headlamps of 85W, 80W and 100W separately without the convection window design. The other record shows that the temperature comes to 74.6 °C ` 73.7 °C and 64.8°C on the same lamps but with cooling down window embedded. The effective cooling down temperature is 21.6 °C, 19.8°C and 25°C. The heat dissipation performance contributes 22.61% ` 21% and 27.83%. By the analysis of finite elements on window type Venturi system shows that experiments data coincides with theory assumption. This project absolutely shows that an innovative window type Venturi cooling system is highly effective on heat dissipation and can provide more competitive high power LED products in the market.

  • Numerical Analysis and Optimization of Thermal Performance of LED Filament Light Bulb

    This paper presents numerical studies on thermal performance of LED filament light bulbs with different bulb sizes, phosphor diameters, and phosphor shapes. A quarter of numerical model of LED filament light bulbs was built to analyze the temperature field, velocity field and distributions for convective heat flux coefficient on the filament surface. The effects of bulb sizes, phosphor diameters and phosphor shapes on the thermal performance were investigated. The maximum temperature of a type of commercial LED filament light bulb reaches 145 °C, which can be reduced by the increasing of bulb sizes and phosphor diameters. When the phosphor diameter increases from 2 mm to 5 mm, the maximum temperature is reduced by 24 °C, which is also decreased by 10 °C with the increased bulb size of 4 mm. In addition, fin-shape filaments can effectively reduce the bulb temperature, and the maximum temperature reduction is 10 °C when the fin length reaches 0.91 mm.

  • A new idea of effective cooling of integrated circuits

    The purpose of this paper is the thermal analysis of the structure consisting of integrated circuit, heat sink, additional temperature sensor and active fan in which the power dissipation is used as the control parameter to get both maximum throughput of a microprocessor and energy saving. It focuses on adjustment of convection coefficient (in other word adjustment of fan rotation speed) at heat sink level with respect to the amount of power dissipated by the chip and environmental circumstances. The duality between electrical and thermal parameters enables to model the RC thermal network of the structure. Therefore, the dynamic thermal behaviour of the integrated system is investigated by utilizing the RC compact model, which is implemented in Spice environment. The simulation result indicates the case of short temperature peak whenever the power dissipation changes. The benefit of this approach is the rapid removal of internal chip energy accumulation due to the adjustment of fan speed. Consequently the cooling system's energy consumption can be minimized, what enhances reliability and efficiency of integrated circuit.

  • Influence of internal heat source on double-diffusive soret induced convection in a binary fluid

    The neutral convection in a double-diffusive fluid layer subject to the internal heat source (internal heating) and thermodiffusion or also known as Soret effect is studied analytically. The influence of the internal heating is supplied by an internal volumetric source with a uniform distribution. Results show that the presence of internal heating in the binary fluid layer which is fluid layer heated and salted has a significant influence on the neutral convection where increasing the internal heating will destabilize the fluid system. Despite the destabilizing factor, an increase of the Solutal Rayleigh number spikes the critical Rayleigh number and thus ensures greater stability of the system. The instability gets fluctuate depending on values of Soret parameter in the presence of internal heating.

  • Dynamical simulations of the plasmapause and the plasmasphere

    Plasmapause and plasmasphere simulations have been developed at BIRA-IASB to better understand the physical mechanisms implicated in this region of the inner magnetosphere. The simulations include convection and co-rotation and can also take into account the interchange mechanism for the formation of the plasmapause. The simulations show an inward motion of the plasmapause when the geomagnetic activity increases, in good agreement with satellite observations. A plume is formed in the afternoon and dusk Magnetic Local Time (MLT) sectors during geomagnetic storms. Comparisons with observations of different satellites including IMAGE, CRRES, CLUSTER, THEMIS and KAGUYA show an excellent agreement with the simulations including corotation, convection with E5D electric field and interchange. These simulations can be run for any date on the space weather portal www.spaceweather.eu.

  • Numerical Study of the Thermal Behavior of a HAWT nacelle Operating Under Severe Saharan Climate

    The present work investigates numerically the impact of turbulent natural convection heat transfer on the nacelle thermal behavior. Reynolds-Averaged Navier-Stokes and energy equations have been considered. ANSYS FLUENT code has been employed to solve the resulting mathematical model. Temperature and velocity profiles within the 2D and 3D-configurations of the nacelle have been presented and discussed. Variations of the average temperature inside the nacelle and the required cooling capacity are determined and thoroughly discussed.

  • Heat dissipation capability of package with integrated processor and 3D-stacked memory

    The thermal performance of 2.5D package with integrated processor and 2 memory stacks has been investigated, and 4 types of thermal lids without increasing the package footprint has been designed and evaluated. The heat dissipation capabilities of different structures were first analyzed under natural convection condition, and then forced air cooling condition was considered in portable device scenario. The effect of stiffener on the heat dissipation and thermal crosstalk has been analyzed. Under natural convection, providing heating power to both processor and memory, a total power around 3W can be dissipated. With forced air cooling in limited space, the initial package can dissipate around 6.5W heating power. By using the designed thermal lid, the dissipated heating power can be increased by almost one time. The results and conclusions obtained will aid the thermal design of 2.5D package.



Standards related to Convection

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Jobs related to Convection

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