IEEE Organizations related to Metallic Materials

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Conferences related to Metallic Materials

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE 17th International Symposium on Biomedical Imaging (ISBI 2020)

The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2020 will be the 17th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2020 meeting will continue this tradition of fostering cross-fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2019 IEEE 16th International Symposium on Biomedical Imaging (ISBI)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging.ISBI 2019 will be the 16th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2019 meeting will continue this tradition of fostering cross fertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2018 IEEE 15th International Symposium on Biomedical Imaging (ISBI 2018)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2018 will be the 15th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2018 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2017 IEEE 14th International Symposium on Biomedical Imaging (ISBI 2017)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2017 will be the 14th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2017 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2016 IEEE 13th International Symposium on Biomedical Imaging (ISBI 2016)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forumfor the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2016 willbe the thirteenth meeting in this series. The previous meetings have played a leading role in facilitatinginteraction between researchers in medical and biological imaging. The 2016 meeting will continue thistradition of fostering crossfertilization among different imaging communities and contributing to an integrativeapproach to biomedical imaging across all scales of observation.

  • 2015 IEEE 12th International Symposium on Biomedical Imaging (ISBI 2015)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2015 will be the 12th meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2014 IEEE 11th International Symposium on Biomedical Imaging (ISBI 2014)

    The IEEE International Symposium on Biomedical Imaging (ISBI) is the premier forum for the presentation of technological advances in theoretical and applied biomedical imaging. ISBI 2014 will be the eleventh meeting in this series. The previous meetings have played a leading role in facilitating interaction between researchers in medical and biological imaging. The 2014 meeting will continue this tradition of fostering crossfertilization among different imaging communities and contributing to an integrative approach to biomedical imaging across all scales of observation.

  • 2013 IEEE 10th International Symposium on Biomedical Imaging (ISBI 2013)

    To serve the biological, biomedical, bioengineering, bioimaging and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2012 IEEE 9th International Symposium on Biomedical Imaging (ISBI 2012)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2011 IEEE 8th International Symposium on Biomedical Imaging (ISBI 2011)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2010 IEEE 7th International Symposium on Biomedical Imaging (ISBI 2010)

    To serve the biological, biomedical, bioengineering, bioimaging, and other technical communities through a quality program of presentations and papers on the foundation, application, development, and use of biomedical imaging.

  • 2009 IEEE 6th International Symposium on Biomedical Imaging (ISBI 2009)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2008 IEEE 5th International Symposium on Biomedical Imaging (ISBI 2008)

    Algorithmic, mathematical and computational aspects of biomedical imaging, from nano- to macroscale. Topics of interest include image formation and reconstruction, computational and statistical image processing and analysis, dynamic imaging, visualization, image quality assessment, and physical, biological and statistical modeling. Molecular, cellular, anatomical and functional imaging modalities and applications.

  • 2007 IEEE 4th International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2007)

  • 2006 IEEE 3rd International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2006)

  • 2004 2nd IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2004)

  • 2002 1st IEEE International Symposium on Biomedical Imaging: Macro to Nano (ISBI 2002)


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Magnetic Conference (INTERMAG)

INTERMAG is the premier conference on all aspects of applied magnetism and provides a range of oral and poster presentations, invited talks and symposia, a tutorial session, and exhibits reviewing the latest developments in magnetism.


2020 IEEE Photovoltaic Specialists Conference (PVSC)

Promote science and engineering of photovoltaic materials, devices, systems and applications


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Periodicals related to Metallic Materials

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Xplore Articles related to Metallic Materials

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Integrated Polarizer with Tilted Polarization Angle

2017 Asia Communications and Photonics Conference (ACP), 2017

A polarizer with polarization angle other than 0° or 90° is proposed on silicon-on-insulator platform. The extinction ratio is larger than 20 dB and excess loss is lower than 1 dB over 100 nm wavelength range.


Ultrasensitive microwave near-field based sensors for crack detection in metallic materials

2016 IEEE International Symposium on Antennas and Propagation (APSURSI), 2016

This paper presents an ultrasensitive microwave sensor based on electrically small resonators. The resonators are inspired by complementary split-ring resonators (CSRRs) and designed as near-field sensor for crack detection in metallic materials. The sensor is designed by etching out a resonator in the ground plane of a microstrip line technology. The sensors shows not only high sensitivity (increasing dynamic range ...


A Research on Effect of Probed Object Shape on Frequency Inflection Point (FIP) of Underwater Active Electrolocation System

IEEE Transactions on Applied Superconductivity, 2016

Weakly electric fish can orient and navigate in dark environment by their active electrolocation system. Bio-inspired active electrolocation sensor has been investigated. In previous work, amplitude information-frequency characteristics (AIFC) of the active electrolocation system have been investigated. Detect frequency dead zone and frequency inflection point (FIP) of AIFC for the electrolocation system were found. And FIP have relevance to the ...


IEEE Test Procedure for Determining Tensile Strength and Hardness of Lead Sheaths

IEEE Std 84-1963, 1963

This standard recommends testing procedure for tensile strength, elongation, and hardness tests on samples of lead sheaths removed from cables.


Effect of active agents on the rheological properties of SnAgCu solder pastes used for jetting printing

2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018

Solder paste plays an important role in the processing of surface mount technology in electronic packaging. In this study, the Sn-0.3Ag-0.7Cu solder powder was used as the alloy powder, in combination with different lead-free solder pastes. The effect of active agents on the rheological properties of solder paste was investigated systematically with a combined method including oscillation stress sweep test, ...


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Educational Resources on Metallic Materials

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IEEE.tv Videos

Magnetic Materials and Magnetic Devices - Josep Fontcuberta: IEEE Magnetics Distinguished Lecture 2016
Superconductors for the Future from the Perspective of the Past
Spatial-Spectral Materials for High Performance Optical Processing - IEEE Rebooting Computing 2017
EMBC 2011-Keynote-From Nature and Back Again ... Giving New Life to Materials for Energy, Electronics, Medicine and the Environment - Angela Belcher, PhD
IMS 2012 Microapps - Bonding Materials used in Multilayer Microwave PCB Applications
Wanda Reder: Educational Materials for Expert and Non-Expert — IEEE Power and Energy Society’s “Plain Talk” — Studio Tech Talks: Sections Congress 2017
Unconventional Superconductivity: From History to Mystery
Multi-Function VCO Chip for Materials Sensing and More - Jens Reinstaedt - RFIC Showcase 2018
Nanotechnology, we are already there: APEC 2013 KeyTalk with Dr. Terry Lowe
MicroApps: Fast, Accurate and Nondestructive Solutions of Materials Test up to 1.1 THz (Agilent Technologies)
Unique Fixtures for Characterizing Electromagnetic Properties of Materials at THz Frequencies: MicroApps 2015 - Keysight Technologies
Care Innovations: Green Engineering (com legendas em portugues)
IRDS: Metrology - George Orji at INC 2019
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
2013 IEEE Corporate Innovation Award
Materials Challenges for Next-Generation, High-Density Magnetic Recording - Kazuhiro Hono: IEEE Magnetics Distinguished Lecture 2016
35 Years of Magnetic Heterostructures
IMS MicroApp: Advances in High Frequency Printed Circuit Board (PCB)
Educational Resources for Humanitarian Activities - Michael Lightner - Brief Sessions: Sections Congress 2017
30 Years to High Temperature Superconductivity (HTS): Status and Perspectives

IEEE-USA E-Books

  • Integrated Polarizer with Tilted Polarization Angle

    A polarizer with polarization angle other than 0° or 90° is proposed on silicon-on-insulator platform. The extinction ratio is larger than 20 dB and excess loss is lower than 1 dB over 100 nm wavelength range.

  • Ultrasensitive microwave near-field based sensors for crack detection in metallic materials

    This paper presents an ultrasensitive microwave sensor based on electrically small resonators. The resonators are inspired by complementary split-ring resonators (CSRRs) and designed as near-field sensor for crack detection in metallic materials. The sensor is designed by etching out a resonator in the ground plane of a microstrip line technology. The sensors shows not only high sensitivity (increasing dynamic range of the sensor) but also high spatial resolution, design simplicity and scalability. The sensor is able numerically to resolve a crack of 10 um (equivalent to λ/4000), with 186 MHz shift in the resonance frequency.

  • A Research on Effect of Probed Object Shape on Frequency Inflection Point (FIP) of Underwater Active Electrolocation System

    Weakly electric fish can orient and navigate in dark environment by their active electrolocation system. Bio-inspired active electrolocation sensor has been investigated. In previous work, amplitude information-frequency characteristics (AIFC) of the active electrolocation system have been investigated. Detect frequency dead zone and frequency inflection point (FIP) of AIFC for the electrolocation system were found. And FIP have relevance to the material properties and geometric features of the probed object and the conductivity of surrounding water. But how to the shape of the probed object influence on FIP has not been deeply researched. In order to deeply study on how to the probed object shape influence on FIP of the active electrolocation system, three different materials probed object with two different shapes with similar geometric features of the probed object were selected for the active electrolocation system experiment. The following conclusions were obtained: for the similar size and the same material of the probed object, the shape of the probed object has significant effect on FIP of AIFC for the electrolocation system. So the shape of the probed object may affect the electric image. It may have a reference value for active electrolocation system designing.

  • IEEE Test Procedure for Determining Tensile Strength and Hardness of Lead Sheaths

    This standard recommends testing procedure for tensile strength, elongation, and hardness tests on samples of lead sheaths removed from cables.

  • Effect of active agents on the rheological properties of SnAgCu solder pastes used for jetting printing

    Solder paste plays an important role in the processing of surface mount technology in electronic packaging. In this study, the Sn-0.3Ag-0.7Cu solder powder was used as the alloy powder, in combination with different lead-free solder pastes. The effect of active agents on the rheological properties of solder paste was investigated systematically with a combined method including oscillation stress sweep test, thixotropic loop test and creep-recovery test. The results show that the loss coefficient of the solder paste containing succinic anhydride was high and its flow stress was small as well at room temperature, which structure is unstable and have a poor jet printing performance. At low shear rate, Dimethylol Propionic Acid (DMPA) plays a role in the viscosity increasing of the solder paste, When the value of G"/G' was between 0.4 and 0.5 and the flow stress was about 100 Pa, the jet printing condition of the solder paste was better, and there was less phenomenon of nozzle jam at room temperature.

  • The transmission characteristics of metallic like smartphone case made of resin and small metallic particles

    Summary form only given. The smartphone designers prefer using metallic material to make smartphone case because it gives the consumer the impression of luxuriousness and toughness. It raises a hard task for antenna engineers that they can not arrang the antennas inside such metallic smartphone case. Although it is possible to use metallic case as a part of an antenna, there are still the requirements of mounting the antennas inside the case because it is convenience to arrange several antennas that are necessary in a smartphone. The material made of resin mixed with metallic particles is thought promising to satisfy the above requirements. In this paper, the propagation property of electromagnetic waves in such material is studied carefully for the different size, the different volume density and the different arrangement of metallic particles. The transmission and reflection coefficients of a plane wave incident on a 1mm thick plate of the material are calculated by using FDTD method. To obtain the propagation loss of the material, the metallic particle is assumed as a good conductor such as the copper, and the spatial division is chosen as 0.5 micrometer of the order of the skin depth. The particles of the size of several micrometers are arranged in the direction of the propagation, and the transverse directions are terminated by the perfect electric and magnetic walls. The result shows that the material is a low-pass property, and transmission coefficient decreases with the frequency. The transmission coefficient also decrease with the volume density of metallic particles. When the copper is used as metallic particles, the transmission coefficient is about 0.96, 0.92, 0.8 with a volume density of particles of 1.6%, 12.5%, 42.2%, respectively at frequency 5 GHz.

  • Microstructure and properties of AuSn20 solder ribbons prepared by rapid solidification process

    The AuSn20 solder ribbons were prepared by single roll rapid solidification device and the effect of rapid solidification process parameters on the forming performance of the ribbons were studied. Microstructure, composition distribution, phase composition, melting characteristics and welding strength of the rapidly solidified AuSn20 ribbons were studied through OM, EPMA, SEM, XRD, DSC and other testing methods. AuSn20 solder ribbons prepared by single roll rapid solidification device have fine formability. The width of the strip is 6 mm and the thickness is 100 μm. The rapid solidification AuSn20 solder are composed of ζ'-Au5Sn and δ-AuSn. The quantity of primary phase ζ'-Au5Sn is reduced and the morphology is significantly refined. The eutectic (ζ'-Au5Sn+δ-AuSn) structure is small and the composition is uniformly distributed. The rapid solidification solder has a lower melting temperature and narrow melting range compared to the common solidification solder.

  • Concepts Expansion in Materials Domain Based on Ontology Matching Results

    Traditional keyword-based search methods are used widely to find the user's requirements, but the results are not very satisfactory because of semantic ambiguity of concepts. However, domain ontologies contain great number of domain concepts and their relations. Hence, to achieve more accurate query results, in this paper, we propose a novel approach to expand the domain concepts using the results of ontology matching, especially in metallic materials domain. Firstly, we use the semantic similarity calculation strategy to find the domain concepts, which is similar to the seed query concept, from the ontology matching results. Then the corresponding concepts of these similar concepts can be acquired according to the structure of ontology matching results. At last, we can get the expansion concepts by merging the similar concepts and corresponding concepts. This approach is evaluated in light of F1-measure and time performance, and the experimental results show that the proposed approach can improve the query results effectively, and the time performance is acceptable.

  • Light radiating-manipulation in toroidal metamaterial by the gain in quantum dots

    Toroidal dipolar response in a metallic metastructure, composed of double flat rings, is utilized to manipulate the radiation pattern of a single dipolar emitter (e.g., florescent molecule/atom or quantum dot). Strong Fano-type radiation spectrum can be obtained when these two coupling dipoles are spatially overlapped, leading to significant radiation suppression (so-called nonradiating source) attributed to the dipolar destructive interference. Moreover, this nonradiating configuration will become a directionally super- radiating nanoantenna after a radial displacement of the emitter with respect to the toroidal flat-ring geometry, which emits linearly polarized radiation with orders of power enhancement in a particular orientation. Furthermore, via surface plasmon amplification with the assistance of the gain medium of PbS quantum dots, not only toroidal dipole response can be greatly strengthened but also the directional super-radiating intensity also obtains strong enhancement. Our results are promising in manipulating the radiation power and direction of a single emitter, such as fluorescent molecule/atom and quantum dot, by utilizing the intriguing toroidal dipolar response based on the proposed flatring metastructure.

  • Performance Analysis of Acoustic Emission Hit Detection Methods Using Time Features

    Acoustic emission (AE) analysis is a powerful potential characterization method for fracture mechanism analysis during metallic specimen testing. Nevertheless, identifying and extracting each event when analyzing the raw signal remains a major challenge. Typically, the AE detection is carried out using a thresholding approach. However, though extensively applied, this approach presents some critical limitations due to overlapping transients, differences in strength and low signal-to-noise ratio. In this paper, to address these limitations, advanced methodologies for detecting AE hits have been developed. The most prominent methodologies used are instantaneous amplitude, the short-term average to long-term average ratio, the Akaike information criterion, and wavelet analysis, each of which exhibits satisfactory performance and ease of implementation for diverse applications. However, their proneness to errors in the presence of non-cyclostationary AE wavefronts and the lack of thorough comparison for transient AE signals are constraints to the wider application of these methods in non-destructive testing procedures. In this paper, with the aim of making aware of the drawbacks of the traditional threshold approach, a comprehensive analysis of its limiting factors when taking into regard the AE waveform behavior is presented. In addition, in a second section, a performance analysis of the main advanced representative-methods in the field is carried out through a common comparative framework, by analyzing first, AE waves generated from a standardized Hsu-Nielsen test and second, a data frame of a highly active signal derived from a tensile test. In this paper, with the aim to quantify the performance with which these AE detection methodologies work, for the first time, time features as the endpoint and duration accuracies, as well as statistical metrics as accuracy, precision, and false detection rates, are studied.



Standards related to Metallic Materials

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Jobs related to Metallic Materials

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