Conferences related to Mechanical Stress Analysis

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Mechanical Stress Analysis

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Mechanical Stress Analysis

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Xplore Articles related to Mechanical Stress Analysis

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VLSI thermo-mechanical stress analysis by gradient direction sensor method

Canadian Conference on Electrical and Computer Engineering, 2005., 2005

Silicon integrated sensors for thermo-mechanical stress measurement in VLSI (very large scale integration) has been studied extensively in recent years due to the increasing complexity of modern semiconductor devices. As chip size has increased continuously to accommodate more functions in modern integrated circuits (IC) technology, the stress induced in a chip from packaging combined with self heating becomes serious and ...


3-D Electromagnetic Field Analysis Combined With Mechanical Stress Analysis for Interior Permanent Magnet Synchronous Motors

IEEE Transactions on Magnetics, 2016

The method of 3-D electromagnetic field analysis combined with mechanical stress analysis has been developed for loss calculation of interior permanent magnet motors. Both the stator compressive stress caused by shrink fitting and the rotor tensile stress caused by centrifugal force are considered in the stress analysis. The 3-D flux density vector is calculated by the electromagnetic field analysis, including ...


A 32 000 r/min Axial Flux Permanent Magnet Machine for Energy Storage With Mechanical Stress Analysis

IEEE Transactions on Magnetics, 2016

This paper focuses on the design and analysis of a high-speed axial flux permanent magnet (PM) machine for an aerospace flywheel energy storage system. The design target is to experimentally verify the sinusoidal back electromotive force (EMF) considering the mechanical stress limitation of the machine at a speed of 32 000 r/min. Two machine models based on ferrite and SmCo ...


Development and thermo-mechanical stress analysis of TSVs filling with Sn-based intermetallics

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012

With the trend of commercialization of through-silicon vias (TSVs) in 3D integrated microsystems, new TSVs filling processes are developed to meet the requirement of low-cost fabricating of high-electrical performance and high- thermal reliability TSVs without any voids. In this paper, Sn-based IMCs are used as the filling materials for the formation of conductive path of TSVs. The Sn-based IMCs filling ...


Thermo-mechanical stress analysis of PBGA

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307), 1997

The solder joint reliability is the biggest disadvantage the plastic ball grid array (PBGA) has as compared with other conventional packages. A 2D steady state stress analysis based on the FE method has been carried out to study the most critical item, the solder joint. The parametric studies have been carried out to study the effect of chip length and ...


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Educational Resources on Mechanical Stress Analysis

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IEEE.tv Videos

Innovative Mechanical Systems to Address Current Robotics Challenges
Microfluidic devices for precision biological measurement: Stephen Quake
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Utkan Demirci
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Mehmet R. Dokmeci
EMBC 2011-Workshop-Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Michelle Khine
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Ali Khademhosseini
IMS 2011 Microapps - Yield Analysis During EM Simulation
IMS 2012 Microapps - Improve Microwave Circuit Design Flow Through Passive Model Yield and Sensitivity Analysis
IMS 2011 Microapps - A Practical Approach to Verifying RFICs with Fast Mismatch Analysis
IMS MicroApps: Multi-Rate Harmonic Balance Analysis
Robotics History: Narratives and Networks Oral Histories: Yoshiaki Shirai
New Approach of Vehicle Electrification: Analysis of Performance and Implementation Issue
A Flexible Testbed for 5G Waveform Generation and Analysis: MicroApps 2015 - Keysight Technologies
APEC 2011-Intersil Promo Apec 2011
APEC 2013 MicroMouse Competition
Robotics History: Narratives and Networks Oral Histories:Mark Yim
Maker Faire 2008: Babbage's Difference Engine No. 2 Replica
Spectrum Analysis: RF Boot Camp
Surgical Robotics: Analysis and Control Architecture for Semiautonomous Robotic Surgery
IMS 2012 Microapps - Generation and Analysis Techniques for Cost-efficient SATCOM Measurements Richard Overdorf, Agilent

IEEE-USA E-Books

  • VLSI thermo-mechanical stress analysis by gradient direction sensor method

    Silicon integrated sensors for thermo-mechanical stress measurement in VLSI (very large scale integration) has been studied extensively in recent years due to the increasing complexity of modern semiconductor devices. As chip size has increased continuously to accommodate more functions in modern integrated circuits (IC) technology, the stress induced in a chip from packaging combined with self heating becomes serious and may result in device degradation, circuit malfunction and even chip cracking. Therefore, for safe operation, it is necessary to construct thermo-mechanical stress monitoring tools to determine the spatial induced stress and study possible alternative heat sources placement or distribution that are capable in reducing level of thermo-mechanical stress. This paper presents VLSI thermo-mechanical stress analysis by gradient direction sensor (GDS). This investigation uses a thermal heat sources emplacement approach to estimate and predict stress and distortion of WSI (wafer scale integration) chip junction. Hence, the geometrical coordinates of the investigated source can be obtained by applying the gradient direction sensors. Then finite element method (FEM) is used to build models to validate thermal peaks prediction by GDS method. In this way we can explore the possibilities to minimize the thermal peaks in the critical areas for packaged BGA (ball grid array) WSI devices. Several considerations guided our study for a judicious placement of different sensors. That will enable us to establish the most homogeneous thermo-mechanical cartography

  • 3-D Electromagnetic Field Analysis Combined With Mechanical Stress Analysis for Interior Permanent Magnet Synchronous Motors

    The method of 3-D electromagnetic field analysis combined with mechanical stress analysis has been developed for loss calculation of interior permanent magnet motors. Both the stator compressive stress caused by shrink fitting and the rotor tensile stress caused by centrifugal force are considered in the stress analysis. The 3-D flux density vector is calculated by the electromagnetic field analysis, including the core end regions. The variation in the stress effect with the angle between stress and flux vectors is considered using the equivalent stress. The calculated loss is compared with the experimental loss in order to confirm the validity of the analysis. It is clarified that the accuracy of loss calculation is significantly improved as compared with the conventional method that neglects the angles between the stress and flux density vector.

  • A 32 000 r/min Axial Flux Permanent Magnet Machine for Energy Storage With Mechanical Stress Analysis

    This paper focuses on the design and analysis of a high-speed axial flux permanent magnet (PM) machine for an aerospace flywheel energy storage system. The design target is to experimentally verify the sinusoidal back electromotive force (EMF) considering the mechanical stress limitation of the machine at a speed of 32 000 r/min. Two machine models based on ferrite and SmCo PMs have been proposed. First, the back EMF analysis using a 3-D finite- element method is performed to determine the performance of the two models. Second, the mechanical stress analysis is performed to check the durability of the rotor strength. Finally, the selected model utilizing the ferrite PMs has been manufactured and tested at 32 000 r/min to validate its effectiveness at high-speed operation.

  • Development and thermo-mechanical stress analysis of TSVs filling with Sn-based intermetallics

    With the trend of commercialization of through-silicon vias (TSVs) in 3D integrated microsystems, new TSVs filling processes are developed to meet the requirement of low-cost fabricating of high-electrical performance and high- thermal reliability TSVs without any voids. In this paper, Sn-based IMCs are used as the filling materials for the formation of conductive path of TSVs. The Sn-based IMCs filling process is studied and the initial results are reported. Thermal-mechanical stress analysis of TSVs with different filling materials is performed through finite element analysis (FEA). The isotropic and anisotropic elastic property of silicon is considered in the FEA modeling. A static temperature ramp down analysis from 125°C to -40°C was carried out to simulate the maximum thermal stress state. The simulation results indicate that the TSVs filled with Cu6Sn5and Ni3Sn4exhibit lower thermal stress compared with solder TSVs and even Cu TSVs.

  • Thermo-mechanical stress analysis of PBGA

    The solder joint reliability is the biggest disadvantage the plastic ball grid array (PBGA) has as compared with other conventional packages. A 2D steady state stress analysis based on the FE method has been carried out to study the most critical item, the solder joint. The parametric studies have been carried out to study the effect of chip length and substrate thickness on the magnitude of the stress in the solder joints. The results indicate that the ball nearest to the die has the highest magnitude of stress and hence is the most critical. These results are expected to act as a database for reliable PBGA design.

  • Thermo-mechanical stress analysis and optimization for 28nm extreme low-k large die fcBGA

    The pre-solder crack phenomenon after thermal cycling test is observed in 28nm extreme low-k (ELK) large die fcBGA (flip chip ball grid array), which may come from the resulted critical stresses in IMC (intermetallic compounds) on Cu pad layer. For the purpose of realizing the thermal-mechanical stress distributions in 28nm ELK large die fcBGA, a comprehensive study for the effects of package geometry is investigated by using three-dimensional finite element analyses (FEA) in this paper. The effects of under bump metallurgy (UBM) size, solder resistant opening (SRO) size, solder bump dimension, thermal interface material (TIM) thickness, Cu pad diameter, substrate thickness and its coefficient of thermal expansion (CTE) are discussed by Taguchi L16(2<sup>7</sup>) methodology to figure out the most significant factors. Through the statistical results, it is found that the factors of UBM size, SRO size and Cu pad diameter had significant contributions to stress responses. The most important parameters of UBM and SRO size ratio (UBM/SRO) as well as Cu pad diameter and SRO size ratio (pad/SRO) that comprehend the corresponding stress responses are captured by using response surface methodology (RSM). To have further discussions of these significant factors, dissections for UBM, SRO and polyimide (PI) opening size are also illustrated. The simulated results can be good references and effectively served as design guidelines to avoid the critical stresses as well as enhance the reliability in 28nm ELK large die fcBGA.

  • A complete internal mechanical stress analysis of multilayer composite leads to optimized coating process control for 50 GHz thin film filters

    Internal stress simulation of a multilayer structure using measured wafer curvature accurately predicts the central wavelength shifts and spectrum ripple resulting from grinding and temperature change, thereby greatly improving the production yield of 50 GHz filters.

  • Three-dimensional mechanical stress analysis of trench isolation along {111} gliding planes

    Three dimensional mechanical stress simulation has been applied to the trench isolation structure for bipolar LSIs. The accuracy of the simulation was confirmed by the micro Raman measurements of the actual trench structure. Considering the three dimensional analysis of the dislocation formation in the silicon crystal, there are 4 different {111} gliding planes at each point, and 3 specific gliding <110> directions for each {111} plane along which the dislocation of silicon occurs. Thus 12 gliding directions exist at each point. Resolved shear stresses along the 12 directions have been calculated by the simulation. The simulated results basically agree with the results of dislocation formation in the experiment. This method is a very useful tool to analyze the dislocation or defect formation along {111} gliding planes of the trench isolation structure.<<ETX>>

  • Design and Mechanical Stress Analysis of a Toroidal-Type SMES Magnet

    This paper investigates the mechanical stresses of a toroidal-type superconducting magnet (TSM). The TSM is designed by 3D CAD program. The Bi-2223 high temperature superconducting (HTS) wire made by soldering brass on both sides of the superconductor is used for the magnet winding. The TSM consists of 30 double pancake coils (DPC). Single pancake coils (SPC) constituting the double pancake coils are arranged at an angle of 6 from each other based on the central axis of the TSM. The mechanical stresses due to the Lorentz force caused by the operating current are analyzed using FEM. These fundamental data will effectively be applied to design a toroidal-type superconducting magnetic energy storage.

  • Thermo-mechanical stress analysis

    This paper reports about the development and application of a new test chip for stress analysis in microelectronic packaging processes and reliability tests. Special focus will be on transfer molding with epoxy molding compound (EMC). The CMOS based stress sensor is able to measure in-plane normal stress and shear stress on the chip surfaces with an absolute stress resolution of plusmn 3 MPa. By the use of a multiplexer and an array of measuring cells on the chip surface we are able to sense temperatures and mechanical stresses space-and time resolved. We analyzed 1<sup>st</sup> and 2<sup>nd</sup> level encapsulation methods by transfer and injection molding and performed an in- situ relaxation and stress monitoring of the packaged sensor during temperature load and moisture uptake. The experimental results will be compared with numerical simulations. In substitutive application for electronic parts, the test chip implicates a major potential for investigating production processes and lifetime impacts on MEMS. Adjusting material combinations and optimizing packaging processes to achieve reliable products will be the applications on focus in future.



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