IEEE Organizations related to Micrometers

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Conferences related to Micrometers

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

All areas of ionizing radiation detection - detectors, signal processing, analysis of results, PET development, PET results, medical imaging using ionizing radiation


2020 Optical Fiber Communications Conference and Exhibition (OFC)

The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals. For over 40 years, OFC has drawn attendees from all corners of the globe to meet and greet, teach and learn, make connections and move business forward.OFC attracts the biggest names in the field, offers key networking and partnering opportunities, and provides insights and inspiration on the major trends and technology advances affecting the industry. From technical presentations to the latest market trends and predictions, OFC is a one-stop-shop.


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Periodicals related to Micrometers

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Most published Xplore authors for Micrometers

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Xplore Articles related to Micrometers

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Short Course

2019 Symposium on VLSI Technology, 2019

Short Course


Practical Research on Measuring Method of High Precision Parts in NC Turning

2019 International Conference on Robots & Intelligent System (ICRIS), 2019

Measurement of High Precision Parts by NC Turning, measurement by comparison of old and new measuring instruments, a new measuring method using new measuring tools is proposed. Experiments show that the new digital display measuring instrument has high measurement accuracy. It is very im ortant to study the measurement method of high precision parts in NC turning.


Optimization of SOI CMOS MEMS piezo resistive pressure sensor

2017 13th International Conference on Emerging Technologies (ICET), 2017

In this paper, we are presenting the optimization of SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) piezo resistive pressure sensor based on the design parameters. The design parameters against which sensor has been optimized are, membrane shape, piezo resistive material and geometric shape of piezo resistors. FEA (finite element analysis) was used to simulate and optimize the pressure ...


Micro-Displacement Detection using Echo-Signal Cepstrum Analysis for Medical Diagnosis

2018 15th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE), 2018

The estimation of micro changes in morphological dimensions of thin biological structures (e.g. arterial wall, pulmonary pleura, sclera, etc) is a significant area of medical diagnosis where ultrasound has been applied more often each day; achieving higher resolutions on mechanical parameters which allow to provide information about biological tissue condition in early stage of some diseases. Digital processing techniques have ...


Feasibility Study of a Microfluidic Solenoid for Discrete Quantitation of Magnetized Cells

IEEE Transactions on NanoBioscience, 2019

In this paper, a cell quantitation system is proposed based on a new microfluidic solenoid design. The design is simulated in COMSOL and a scaled version of the prototype is built and the induced voltage due to the passage of a magnetic material is measured using a low-noise amplifier and converted to a digital signal using a DSP chip. The ...


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Educational Resources on Micrometers

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IEEE.tv Videos

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IEEE-USA E-Books

  • Short Course

    Short Course

  • Practical Research on Measuring Method of High Precision Parts in NC Turning

    Measurement of High Precision Parts by NC Turning, measurement by comparison of old and new measuring instruments, a new measuring method using new measuring tools is proposed. Experiments show that the new digital display measuring instrument has high measurement accuracy. It is very im ortant to study the measurement method of high precision parts in NC turning.

  • Optimization of SOI CMOS MEMS piezo resistive pressure sensor

    In this paper, we are presenting the optimization of SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) piezo resistive pressure sensor based on the design parameters. The design parameters against which sensor has been optimized are, membrane shape, piezo resistive material and geometric shape of piezo resistors. FEA (finite element analysis) was used to simulate and optimize the pressure sensor. The simulations have been carried out in COMSOL Multiphysics modeling and simulation software. The side length (edge length) of square membrane is 400 micrometers, while thickness of square membrane is 3 micrometers. Square and circular membranes have been studied for the membrane shape optimization. The piezo resistors materials which have been studied for optimization are p-doped and n-doped monolithic silicon as well as p-doped and n-doped polysilicon. Optimization of piezo resistor layout is based on various parameters which are, offset of resistors from the membrane, resistor size and the distance between piezoresistors. Based on simulations, square membrane is considered better than the circular membrane in terms of sensitivity of MEMS (micro electromechanical systems) pressure sensor. Whereas n-doped monolithic silicon gives the optimum response among the materials studied. Piezo resistive design has been optimized to get best sensitivity.

  • Micro-Displacement Detection using Echo-Signal Cepstrum Analysis for Medical Diagnosis

    The estimation of micro changes in morphological dimensions of thin biological structures (e.g. arterial wall, pulmonary pleura, sclera, etc) is a significant area of medical diagnosis where ultrasound has been applied more often each day; achieving higher resolutions on mechanical parameters which allow to provide information about biological tissue condition in early stage of some diseases. Digital processing techniques have been applied to evaluate their performance to detect these micro changes, some of them, with excellent results. In this paper, linear cepstrum technique was applied, as an alternative tool, to assess it performance in the estimation of micrometric separation between laminar structures. A basic mechanism controlled fixed increments (of 500 micrometers) of the separation between two low density polyethylene laminar layers that simulates biological membranes while an inspection system, based on ultrasound, was used to acquire the echo-signals. Previously to processing, the set of these signals were filtered and segmented, then they were added in pairs to be processed with cepstrum technique. In all cases, a quefrency peak value related to the inter-layers separation of 500 micrometers was found. Resultant distances were compared with reference measurements and an average error of 3.45 percent, i.e. 17.7 micrometers, was estimated.

  • Feasibility Study of a Microfluidic Solenoid for Discrete Quantitation of Magnetized Cells

    In this paper, a cell quantitation system is proposed based on a new microfluidic solenoid design. The design is simulated in COMSOL and a scaled version of the prototype is built and the induced voltage due to the passage of a magnetic material is measured using a low-noise amplifier and converted to a digital signal using a DSP chip. The simulation results show approximately 16-nV induced voltage across the solenoid and the measurement results for a scaled version of the solenoid outputs 125-mV peak voltage. A microfluidic fabrication process demonstrates a successful prototype of a microfluidic solenoid.

  • Integration of Tungsten Micro-Heaters and Polymer Microfluidic for the Cell Sorting Application

    Cell sorting is an important diagnostic tool in medical field to separate different type of cells. Various techniques are employed for sorting with main mechanism being cell analysis and then separation either by electric or magnetic field. In this paper we explain the fabrication process for tungsten micro-heaters on silicon and polymer microfluidic for a formation of a generic platform that can be used for the various cell sorting applications. Polymer material is not only used for the formation of channel for fluidics movement but also used as bonding interface between the silicon wafer and the glass. We report on the bonding strength of the polymer material. It shows that our devices can withstand a pressure in excess of 3 bar which is more than sufficient for most microfluidic applications such as cell sorting. Characterization of micro stream bubble generation life cycle is presnted. The sorting efficiency of our device is reported, with initial characterization done beads to determine sorting rate and sorting yield. We achieved sorting rate of 1,000 beads/s with sorter purity of up to 98 % in initial investigations.

  • A 1,000x improvement in computer systems by bridging the processor-memory gap

    For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.

  • Mid-Infrared Dual-Comb Spectroscopy of Liquid-Phase Samples using Attenuated Total Reflectance

    Mid-infrared dual-comb spectroscopy (DCS) is performed on liquid isopropanol from 3.0-3.75 μm with a 1.5-second acquisition time. This experiment is a first step towards viewing liquid-phase reactions in real time using DCS.

  • Theoretical model and experiments of glass reflow process in TGV for 3D wafer-level packaging

    TGV (Through Glass Via) substrate plays an important role in wafer-level vacuum packaging. And glass reflow is the critical step of fabricating TGV. To describe the process, the theoretical formula was deduced through the analogy of fluid equation and circuit equation. Parameters of glass reflow process, such as heating treatment time and temperature for a certain width mold et al. were comprised in theoretical model, which significantly influence the reflow speed. Simulations were conducted and compatible to the theoretical results. Moreover, in all the three types of fabricating process including wet etching, laser burning and DRIE, the theoretical formula shows the feasibility for providing parameters for glass reflow process. Finally, hermetic packaging experiments were performed by sealing a gyroscope, and the Q factor measured was 9119, which indicates the feasibility of the TGV substrate for wafer-level hermetic packaging.

  • The Timepix3 Telescope and Sensor R&D for the LHCb VELO Upgrade

    The VErtex LOcator (VELO) of the LHCb detector is going to be replaced in the context of a major upgrade of the experiment planned for 2019-2020. The upgraded VELO is a silicon pixel detector, designed to withstand a radiation dose up to 8 × 10151 MeV neq cm−2, with the additional challenge of a highly nonuniform radiation exposure. A wide range of sensor prototypes has been tested in beam using the Timepix3 telescope to compare the key performance figures of the different prototypes. Detailed studies of the assemblies are performed using the precise particle tracking and timestamp information provided by the telescope. The performance of the Timepix3 telescope and the testbeam results are presented.



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