IEEE Organizations related to Nanoelectromechanical Systems

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Conferences related to Nanoelectromechanical Systems

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2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


2020 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


2020 IEEE International Solid- State Circuits Conference - (ISSCC)

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.


2019 12th German Microwave Conference (GeMiC)

GeMiC 2019 is a scientific conference aiming to bring together academic and industrial researchers from Germany and from abroad, to discuss research progress and prospects in the area of microwave and millimeter-wave theory and techniques.

  • 2018 German Microwave Conference (GeMiC)

    Microwaves, Microwave Systems, Radar, Communications

  • 2016 German Microwave Conference (GeMiC )

    microwaves, microwave systems, radar, communications

  • 2015 German Microwave Conference (GeMiC)

    Microwaves, Microwave Systems, Radar, Communications

  • 2012 German Microwave Conference (GeMiC 2012)

    The conference presents, through its keynote addresses, presentations, workshops, and forums unique opportunities to exchange scientific and technical information and to establish and foster collaboration in microwave and antenna research.

  • 2011 German Microwave Conference (GeMiC 2011)

    -Active/Passive Microwave Devices/Circuits -Metamaterial Structures and Applications -Emerging Technologies -Antennas, Antenna Arrays, and Reconfigurable Antennas -Radar, Imaging, and Localization -RFIDs and Microwave Sensors -Ultrawideband and Microwave Systems -Microwave Measurement Techniques -Electromagnetics, EMC, and Simulation Techniques -Propagation/Channel Modeling -Linear/Nonlinear Modeling

  • 2010 German Microwave Conference (GeMiC 2010)

    Passive Components and Modules, Active Devices and Circuits, RF-MEMS and Tuneable Components, Antennas and Antenna Arrays, Radar, Sensors, and Imaging, Microwave Systems and UWB, Millimetre- and Submillimetre-Waves, Electromagnetics and Numerical Techniques, Propagation and Channel Modeling, EMC, Linear and Nonlinear Modeling, Measurement Techniques

  • 2009 German Microwave Conference (GeMiC 2009)

    passive Circuit componentsm active components, RF-mems, EMC, Measurement techniques, antennas, radar, sensors, imaging, mocrowave systems, education in mocrowave engineering


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Periodicals related to Nanoelectromechanical Systems

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Most published Xplore authors for Nanoelectromechanical Systems

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Xplore Articles related to Nanoelectromechanical Systems

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MEMS Gyroscopes Based on Piezoresistive NEMS Detection of Drive and Sense Motion

Journal of Microelectromechanical Systems, 2017

This paper presents yaw and pitch microelectromechanical system gyroscopes embedding four active nanoelectromechanical (NEMS) piezoresistive gauges each, two of which are used for differential sensing of the Coriolis motion, and two of which are innovatively used to sense the drive motion and thus to close the drive oscillation loop. After presenting the devices design, this paper discusses the advantages of ...


IEEE-NEMS Tutorial (nanoHUB)

2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2007

None


Sub-50 mV NEM relay operation enabled by self-assembled molecular coating

2016 IEEE International Electron Devices Meeting (IEDM), 2016

Sub-50 mV operation of nano-electro-mechanical relays is demonstrated for the first time, enabled by an anti-stiction molecular coating. Specifically, a self-assembled monolayer of perfluorodecyltriethoxysilane (PFDTES) is shown to be effective for reducing the switching hysteresis voltage, without dramatically increasing its ON-state resistance, enabling stable device operation at very low voltages.


CoNiMnP-AAO hard magnetic nanocomposite film for MEMS applications

2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2012

This paper presents a novel permanent magnetic CoNiMnP-AAO nanocomposite film comprising of a CoNiMnP nanowire array with a high aspect ratio (>;150). The nanocomposite synthesized by a low temperature electroplating process (at 30°C) with AAO template can exhibit a unique magnetic characteristic of vertical shape anisotropy which results in a coercivity (Hc) of 2512Oe, a remanence (Br) up to 3616Gauss ...


Finite element analysis of graphene resonator tuned by pressure difference

2014 15th International Conference on Electronic Packaging Technology, 2014

The vibrational mechanical properties of a graphene resonator were investigated by finite element analysis (FEA) modeling and simulation. By applying a pressure difference across the membrane, the natural frequency of the graphene sheets is changed. The resonance frequency increases with increasing pressure difference. The maximum deflection occurs at the center of graphene. As the initial tension in the graphene increases, ...


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Educational Resources on Nanoelectromechanical Systems

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IEEE.tv Videos

Open Systems Architecture for RF and Microwave Technologies: MicroApps 2015 - Mercury Systems
IMS 2011 Microapps - Calibration and Accuracy in Millimeter Systems
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Continuously Learning Neuromorphic Systems with High Biological Realism: IEEE Rebooting Computing 2017
Research, Development and Field Test of Robotic Observation Systems for Active Volcanic Areas in Japan
IEEE Green Energy and Systems Conference 2015
Intelligent Transportation Systems Society: Changing how the world moves
EMBC 2011-Workshop- Biological Micro Electro Mechanical Systems (BioMEMS): Fundamentals and Applications-Ali Khademhosseini
Quantum Accelerators for High-Performance Computing Systems - IEEE Rebooting Computing 2017

IEEE-USA E-Books

  • MEMS Gyroscopes Based on Piezoresistive NEMS Detection of Drive and Sense Motion

    This paper presents yaw and pitch microelectromechanical system gyroscopes embedding four active nanoelectromechanical (NEMS) piezoresistive gauges each, two of which are used for differential sensing of the Coriolis motion, and two of which are innovatively used to sense the drive motion and thus to close the drive oscillation loop. After presenting the devices design, this paper discusses the advantages of this particular implementation in terms of operating voltages, electrical equivalent model, and temperature behavior of the scale factor. In operation with voltages lower than 1.8 V without voltage boosting, the devices show sub mdps/√Hz noise density within areas of about 1 mm2per device at 0.2-mbar package pressure. Under temperature sweeps, a 3.7-fold better immunity of the scale factor stability is obtained, compared with a similar gyroscope embedding combs (and not NEMS) for drive detection.

  • IEEE-NEMS Tutorial (nanoHUB)

    None

  • Sub-50 mV NEM relay operation enabled by self-assembled molecular coating

    Sub-50 mV operation of nano-electro-mechanical relays is demonstrated for the first time, enabled by an anti-stiction molecular coating. Specifically, a self-assembled monolayer of perfluorodecyltriethoxysilane (PFDTES) is shown to be effective for reducing the switching hysteresis voltage, without dramatically increasing its ON-state resistance, enabling stable device operation at very low voltages.

  • CoNiMnP-AAO hard magnetic nanocomposite film for MEMS applications

    This paper presents a novel permanent magnetic CoNiMnP-AAO nanocomposite film comprising of a CoNiMnP nanowire array with a high aspect ratio (>;150). The nanocomposite synthesized by a low temperature electroplating process (at 30°C) with AAO template can exhibit a unique magnetic characteristic of vertical shape anisotropy which results in a coercivity (Hc) of 2512Oe, a remanence (Br) up to 3616Gauss and a maximum energy product, (BH)max, of 12.02kJ/m3. Such a simple fabrication process and excellent magnetic property reveal that permanent magnetic CoNiMnP-AAO nanocomposite is with great potential for magnetic N/MEMS applications.

  • Finite element analysis of graphene resonator tuned by pressure difference

    The vibrational mechanical properties of a graphene resonator were investigated by finite element analysis (FEA) modeling and simulation. By applying a pressure difference across the membrane, the natural frequency of the graphene sheets is changed. The resonance frequency increases with increasing pressure difference. The maximum deflection occurs at the center of graphene. As the initial tension in the graphene increases, the tunable range decreases. Smaller the dimension of the graphene sheets is, higher the resonance frequency will be, and so as the tunable range. The thickness of the graphene sheets has the similar phenomenon as the dimension has, both the frequency and tunable range will increase if the thickness turns smaller. The geometric nonlinearity is considered, too. We compare the simulation results with previous theoretical and experimental results, and find them in good agreement. The pressure difference can be tuned by changing the pressure in and outside the microchamber. These conclusions will be helpful for graphene in the application of high-quality resonators.

  • Four-Terminal-Relay Body-Biasing Schemes for Complementary Logic Circuits

    Four-terminal-relay inverter circuit characteristics are investigated. To achieve maximum noise margin and zero crowbar current while allowing for relay-to-relay variations, the optimal biasing scheme provides for switching that is symmetric about VDD/2 with minimum hysteresis and no possibility of both the pull-down and pull-up devices being on simultaneously.

  • Parameter characterization of anodic bonded electrical interconnect in MEMS/NEMS devices

    The approach to realize the electrical interconnect and qualities of the contact have a direct impact on the performance and reliability of devices. Herein, Si-Au/Pt/Ti contact structure is fabricated using anodic bonding as a novel approach to realize the electrical interconnect. In order to evaluate the qualities of the anodic bonded contact, the contact resistance is extracted. The cross-bridge Kelvin method is optimized and a new method is presented to directly measure the contact resistance, named four-terminals bonded vertical Kelvin method (BVD). The two-dimensional resistor network model of the BVD method indicates that the relationship between the contact resistance and the measured resistance can be easily established. The BVD method can directly and precisely measure the contact resistance since kinds of interferences from parasitic resistances are minimized. Data obtained from the test indicate that the anodic bonded contact is Ohmic contact when the area of the contact is larger than 15*20 mum2 with the contact length not smaller than 15 mum; whereas, the contact is not Ohmic contact and not stable when the area of the contact is smaller than 15*20 mum2. The qualities of small-size anodic bonded contact is related with the effects of interfacial states, native oxide layer, series resistances at the interface, and the other particularities such as interfacial inter-diffusion, Au/Si eutectic reaction and surface topology.

  • Deinterleaving of radar signals with stagger PRI and dwell-switch PRI types

    The main objective of passive Electronic Warfare (EW) systems is to receive radar signals, measure parameters of signals, deinterleave and identify composed clusters of pulses. In a dense environment, identification of each radar signals has had vital importance. Nowadays, EW systems use multi- parameters deinterleaving methods to compose clusters from receiving radar pulses. Then, these clusters are identified by using time of arrival (TOA) deinterleaving methods. In this paper, we will discuss a new deinterleaving algorithm based on predefined parameters for radars which emit stagger and dwell-switch pulse repetition interval (PRI) types. The results of proposed algorithm are simulated via test scenario.

  • Comparison of convolutional neural network models for document image classification

    Despite the increase in digitization, the use of documents is still very common today. It is essential that these documents are correctly labeled and classified for their need to be archived in an accessible manner. In this study, we used state-of-the-art convolutional neural network models to satisfy this need. Convolutional Neural Networks achieve high performance compared to alternative methods in the field of classification, due to the strong and rich features they can learn from large data through deep architecture. For the experiments, we have used a dataset containing 400,000 images of 16 different document classes. The state-of-the-art deep learning models have been fine- tuned and compared in detail. VGG-16 architecture has achieved the best performance on this dataset with 90.93% correct classification rate.

  • Development of an artificial nose integrating NEMS and biological olfactory receptors

    Microsystems' including biomolecules is currently a research field in fast development and expansion. By coupling biomolecules to non-biological electronic transducers, molecular bioelectronic systems could one day be used in a wide variety of applications, including biosensors, biofuel cells and maybe even biocomputers. A major thrust in this framework is to integrate and process the chemical information at molecular level inside of a microsystem. In this sense, the animal olfactory system represents the gold standard of biosensors with its capability to identify and discriminate thousands of odorant compounds. In order to mimic the performances of natural olfactory biosensors, the overall objective of european project "SPOT-NOSED" is the development of a nanobiosensor array based on the electrical properties of single olfactory receptors. The nanobiosensor array integrates a set of nanotransducers, each of which consists of two noble metal nanoelectrodes with a single olfactory receptor anchored in between.



Standards related to Nanoelectromechanical Systems

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Jobs related to Nanoelectromechanical Systems

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