IEEE Organizations related to System Integration

Back to Top

No organizations are currently tagged "System Integration"



Conferences related to System Integration

Back to Top

No conferences are currently tagged "System Integration"


Periodicals related to System Integration

Back to Top

No periodicals are currently tagged "System Integration"


Most published Xplore authors for System Integration

Back to Top

Xplore Articles related to System Integration

Back to Top

IME's capabilities and programs in 2.5D/3DIC

2015 International 3D Systems Integration Conference (3DIC), 2015

The document was not made available for publication as part of the conference proceedings.


Service Integration and Service Launch

Successful Service Design for Telecommunications: A comprehensive guide to design and implementation, None

This chapter contains sections titled: Service Integration Model Service Integration Strategy Test Environment versus Live Service Environment Post‐Service Launch Reviews


Invited talk: Progress in 3D integrated circuits

2015 International 3D Systems Integration Conference (3DIC), 2015

Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.


Invited talk: Some challenges in scaling 3D ICs to a broader application set

2015 International 3D Systems Integration Conference (3DIC), 2015

Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.


3D system integration research at IMEC

2015 International 3D Systems Integration Conference (3DIC), 2015

The document was not made available for publication as part of the conference proceedings.


More Xplore Articles

Educational Resources on System Integration

Back to Top

IEEE.tv Videos

Heterogeneous Integration Roadmap
IRDS: Outside System Connectivity - Michael Garner at INC 2019
3D Printing for Sensor Platform Integration - Benjamin Ingis - IEEE EMBS at NIH, 2019
Levente Klein: Drone-based Reconstruction for 3D Geospatial Data Processing: WF-IoT 2016
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Pt. 2: Limits & Prospects of Mixed-Signal Electronics - Tomislav Drenski - Industry Panel 2, IEEE Globecom, 2019
Validating Cyber-Physical Energy Systems, Part 1: IECON 2018
Yasir Saleem: Exploitation of Social IoT for Recommendation Services - Special Session on SIoT: WF-IoT 2016
Validating Cyber-Physical Energy Systems, Part 3: IECON 2018
Validating Cyber-Physical Energy Systems, Part 4: IECON 2018
Validating Cyber-Physical Energy Systems, Part 2: IECON 2018
Affordable Wireless Networks - GHTC 2012 Session - Marco Zennaro
Wireless networks for humanitarian use - GHTC 2012 Sessions - Emmanuel Togo
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
Neural Processor Design Enabled by Memristor Technology - Hai Li: 2016 International Conference on Rebooting Computing
EDOC 2010 - Dr. Benjamin Grosof Keynote
The Design of Wearable Robots for Lower-Extremity Human Augmentation
Towards a distributed mm-scale chronically-implantable neural interface - IEEE Brain Workshop
The Intergrid - Safe, Dependable, Sustainable: IECON 2018
Robotics History: Narratives and Networks Oral Histories:Herman Bruyninckx

IEEE-USA E-Books

  • IME's capabilities and programs in 2.5D/3DIC

    The document was not made available for publication as part of the conference proceedings.

  • Service Integration and Service Launch

    This chapter contains sections titled: Service Integration Model Service Integration Strategy Test Environment versus Live Service Environment Post‐Service Launch Reviews

  • Invited talk: Progress in 3D integrated circuits

    Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.

  • Invited talk: Some challenges in scaling 3D ICs to a broader application set

    Provides an abstract of the keynote presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.

  • 3D system integration research at IMEC

    The document was not made available for publication as part of the conference proceedings.

  • 3D research activities in ITRI

    The document was not made available for publication as part of the conference proceedings.

  • "When you Believe in Things that you don't Understand": the Effect of Cross-Generational Habits on Self-Improving System Integration

    Humans experiencing unexpected feedback to certain actions which they are not able to explain, might develop superstitious behaviour. In this paper, we discuss that similar behaviour might also occur in engineered systems. We provide a thought-experiment regarding such behaviour in computational systems. In this paper, we propose a first step towards improved runtime systems integration based on a the ability to become aware of previously- unknown others and their actions, as described in networked self-awareness.

  • The balance perception changes by motor learning with active trunk movements

    This paper investigates that the motor learning has an influence on the human perception, focusing on an upright balance. In order to apply some disturbances, we have constructed a special stool which moves horizontally as well as rotates around the roll direction. This stool allows us to provide two different conditions for the motor learning phase in whether an active trunk movements for balance maintenance is required or not. The comparison of the balance perception tests before and after the motor learning phase indicates that balance perception, i.e., the subjective upright posture, has changed if the subjects have repeated trunk movements during the motor learning phase.

  • Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies

    We have proposed and developed 3D integration technologies based on self- assembly using surface tension of liquid from 2005. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configurations are introduced for fine-pitch interconnect formation. In addition, “non-transfer stacking”, in other word, flip-chip self-assembly and “transfer stacking” called reconfigure-wafer-to-wafer using SAE (Self-Assembly and Electrostatic) carrier are explained.

  • Spatial-aware iterative integration of crisis management information systems

    Information systems are playing increasingly more important role in modern crisis management process. An integrated system with capabilities like foresight, prediction and decision support capabilities can provide substantial addedvalue for decision makers on both tactical and policy-making levels. It is however a challenging task to seamlessly integrate various systems with dedicated functionalities on functional and technical aspects, especially when these systems are developed independently from each other with substantially different design rationale and software technology. In this paper, an iterative system integration approach is proposed by harmonising service-oriented, model-driven and agile system development. Several design principles and best practices from the software engineering community are adopted to facilitate the integration task. In addition, extra attention is paid to provide enhanced support for integrating spatial data into the crisis management workflow. This approach aims to provide a pragmatic system integration methodology to integrate crisis management information systems in a more effective and efficient fashion.



Standards related to System Integration

Back to Top

No standards are currently tagged "System Integration"