IEEE Organizations related to Integrated Circuit Reliability

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Conferences related to Integrated Circuit Reliability

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2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


2019 20th International Symposium on Quality Electronic Design (ISQED)

20th International Symposium on Quality Electronic Design (ISQED 2019) is the premier interdisciplinary and multidisciplinary Electronic Design conference?bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, semiconductor technology,packaging, assembly & test to achieve design quality.


2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)

The DATE conference addresses all aspects of research into technologies for electronic andembedded system engineering. It covers the design process, test, and automation tools forelectronics ranging from integrated circuits to distributed embedded systems. This includes bothhardware and embedded software design issues. The conference scope also includes theelaboration of design requirements and new architectures for challenging application fields suchas telecoms, wireless communications, multimedia, healthcare, smart energy and automotivesystems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within themain technical programme such as panels, hot-topic sessions, tutorials and workshopstechnical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback fromrealworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic andembedded system engineering. It covers the design process, test, and automation tools forelectronics ranging from integrated circuits to distributed embedded systems. This includes bothhardware and embedded software design issues. The conference scope also includes theelaboration of design requirements and new architectures for challenging application fields suchas telecoms, wireless communications, multimedia, healthcare, smart energy and automotivesystems. Companies also present innovative industrial designs to foster the feedback from realworlddesign to research. DATE also hosts a number of special sessions, events within the maintechnical programme such as panels, hot-topic sessions, tutorials and workshops technical programme such as panels, hot-topic sessions, tutorials and workshops

  • 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback from realworld design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops.

  • 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE)

    The DATE conference addresses all aspects of research into technologies for electronic and embedded system engineering. It covers the design process, test, and automation tools for electronics ranging from integrated circuits to distributed embedded systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecoms, wireless communications, multimedia, healthcare, smart energy and automotive systems. Companies also present innovative industrial designs to foster the feedback from real-world design to research. DATE also hosts a number of special sessions, events within the main technical programme such as panels, hot-topic sessions, tutorials and workshops

  • 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE 2013)

    DATE is the complete event for the European electronic and test community. A leading world conference and exhibition, DATE unites 2,000 professionals with approximately 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.

  • 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE 2012)

    DATE is the complete event for the European electronic system and test community. A leading world conference and exhibition, DATE unites 2,000 professionals with some 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.

  • 2011 Design, Automation & Test in Europe Conference & Exhibition (DATE 2011)

    DATE is the complete event for the European electronic system and test community. A world leading conference and exhibition, DATE unites 2,000 professionals with some 60 exhibiting companies, cutting edge R&D, industrial designers and technical managers from around the world.

  • 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)

    All aspects of research into technologies for electronic and (embedded) systems engineering. It covers the design process, test, and tools for design automation of electronic products ranging from integrated circuits to distributed large-scale systems.

  • 2009 Design, Automation & Test in Europe Conference & Exhibition (DATE 2009)

    The Design, Automation, and Test in Europe (DATE) conference is the world's premier conference dedicated to electronics system design & test. The technical programme features: Four distinctive and integrated themes, covering all aspects of systems design and engineering. Two special days are focusing on SoC Development Strategies and Multicore Applications.

  • 2008 Design, Automation & Test in Europe Conference & Exhibition (DATE 2008)

    The 11th DATE conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software. The five-day event consists of a conference with plenary invited papers, regular papers, panels, hot-topic sessions, tutorials.

  • 2007 Design, Automation & Test in Europe Conference & Exhibition (DATE 2007)

    DATE is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on both ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software.

  • 2006 Design, Automation & Test in Europe Conference & Exhibition (DATE 2006)

  • 2005 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2004 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2003 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2002 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2001 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 2000 Design, Automation & Test in Europe Conference & Exhibition (DATE)

  • 1999 Design, Automation & Test in Europe Conference & Exhibition (DATE)


2019 IEEE 15th International Colloquium on Signal Processing & Its Applications (CSPA)

The colloquium will provide an excellent platform for knowledge exchange between researchers,scientists, academicians and engineers working in the areas of automation, process, scientificresearch and analysis. This event calls for local and international participation.


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Periodicals related to Integrated Circuit Reliability

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Most published Xplore authors for Integrated Circuit Reliability

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Xplore Articles related to Integrated Circuit Reliability

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Surface mount technology in communications products

8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium, 1990

Summary form only given. Motorola development efforts in the area of communications-product surface-mount assembly are discussed. Attention is given to the development of a single-layer metallized chip carrier technology which has resulted in high-density packaging of integrated circuits with no compromise of field reliability or environmental performance. Techniques for the attachment or surface mount of these and other components directly ...


Determination of yield bounds prior to routing

Proceedings 1999 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (EFT'99), 1999

Integrated circuit manufacturing complexities have resulted in decreasing product yields and reliabilities. This process has been accelerated with the advent of very deep sub-micron technologies coupled with the introduction of newer materials and technologies like copper interconnects, silicon-on- insulator and increased wafer sizes. The need to improve product yields has been recognized and currently some yield enhancement techniques are used ...


Fast and accurate isothermal measurements on process-split wafers

2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580), 2001

None


Why We Need Design-for-testability

1991 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1991

Summary form only given. The basic reason for testing integrated circuits is to ensure satisfactory operation of a customer's system. Some systems require continuous uninterrupted operation.


The emerging role of the european IC industry

1976 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1976

Integrated solid-state circuits have gained much ground since they were first introduced. This gain has come about in at least three distinct fashions: 1) Standard (sometimes even off the shelf) low-or medium-scale integrated circuits enter electronic equipment in much the same way as the discrete components in earlier designs; 2)Programmable integrated circuit chips are one successful answer to the problem ...


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Educational Resources on Integrated Circuit Reliability

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IEEE.tv Videos

Maker Faire 2008: Spectrum's Digital Clock Contest Winner
IMS 2012 Microapps - Integrated Electrothermal Solution Delivers Thermally Aware Circuit Simulation Rick Poore, Agilent EEsof
Sources of Innovation
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software
An Integrated Optical Parallel Multiplier Exploiting Approximate Binary Logarithms - Jun Shiomi - ICRC 2018
An IEEE IPC Special Session with Kasia Balakier of UCL
BSIM Spice Model Enables FinFET and UTB IC Design
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
Education for Analog ICs
Micro-Apps 2013: Designing an ETSI E-Band Circuit for a MM Wave Wireless System
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
APEC 2011-Intersil Promo Apec 2011
The Evolution and Future of RF Silicon Technologies for THz Applications
2015 IEEE Honors: IEEE Jun-ichi Nishizawa Medal - Dimitri A. Antoniadis
New value creation with the Future X Network - Peter Vetter - IEEE Sarnoff Symposium, 2019
Arizona Reliability Society - May 1 2015
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
IMS 2012 Microapps - Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
Towards Logic-in-Memory circuits using 3D-integrated Nanomagnetic Logic - Fabrizio Riente: 2016 International Conference on Rebooting Computing

IEEE-USA E-Books

  • Surface mount technology in communications products

    Summary form only given. Motorola development efforts in the area of communications-product surface-mount assembly are discussed. Attention is given to the development of a single-layer metallized chip carrier technology which has resulted in high-density packaging of integrated circuits with no compromise of field reliability or environmental performance. Techniques for the attachment or surface mount of these and other components directly to printed circuit boards are also examined.<>

  • Determination of yield bounds prior to routing

    Integrated circuit manufacturing complexities have resulted in decreasing product yields and reliabilities. This process has been accelerated with the advent of very deep sub-micron technologies coupled with the introduction of newer materials and technologies like copper interconnects, silicon-on- insulator and increased wafer sizes. The need to improve product yields has been recognized and currently some yield enhancement techniques are used in industry CAD tools. Still, the significant increase in problem size implies that considerable time and effort can be saved if the designer could predict the yield of each design stage. In this paper we undertake an effort to derive bounds on the yield of the routing for a given placement. When the design is routed, resulting in a yield which is significantly smaller than the bound, the designer can choose to change the router cost functions, modify the placement or even re-design the unit in an attempt to increase the yield. We compare the bounds on yield obtained for a set of standard benchmarks against exact yield values for the "vanilla" routings, and the run times needed to calculate the two. The results indicate that reasonably good estimates of yield can be obtained in significantly lower amounts of run time. The accuracy of the estimates increases when larger designs are considered as the simplifying assumptions made and the model no longer influences the estimates significantly.

  • Fast and accurate isothermal measurements on process-split wafers

    None

  • Why We Need Design-for-testability

    Summary form only given. The basic reason for testing integrated circuits is to ensure satisfactory operation of a customer's system. Some systems require continuous uninterrupted operation.

  • The emerging role of the european IC industry

    Integrated solid-state circuits have gained much ground since they were first introduced. This gain has come about in at least three distinct fashions: 1) Standard (sometimes even off the shelf) low-or medium-scale integrated circuits enter electronic equipment in much the same way as the discrete components in earlier designs; 2)Programmable integrated circuit chips are one successful answer to the problem of regaining flexibility in the case of logic circuits. The microprocessor is the main example of this type of integrated circuit; and 3)the other answer to the same problem is the customer designed IC (CDIC).

  • Tense-deformation condition in multi-layered structure

    Modelling of mechanical tensions in multi-layered structures taking into consideration the thickness of adhesive layers is carried out in this work. Modelling of tension-deformation conditions in multilayered structures makes it possible to forecast the reliability of multi-layered junctions in integrated circuits. Using the proposed model, it is possible to predict scaling of materials, appearance of cracks and increased structural defects.

  • Surface roughness modelling with neural networks

    Accurate surface modelling has become important in the modem integrated circuits manufacturing technology. On all the real surfaces microscopic roughness appears, which affects many electronic properties of the material, which in turn decides the yield and reliability of the integrated circuits. The surface roughness is a complex function of the processing parameters of the fabrication processes. It is difficult to express surface roughness as a function of process parameters in the form of analytical function. It is necessary to map the input parameters to roughness for a process control since it directly affects the yield and reliability of the product. In this paper we show that neural networks can be used to map these parameters to surface roughness. This approach is also suitable for model based control systems in manufacturing.

  • A multi-chip packaged GaAs 16*16 bit parallel multiplier

    A GaAs 16*16 16-bit parallel multiplier utilizing multichip packaging technology is demonstrated. This multichip approach was taken in an effort to realize GaAs ULSIs with high yield and reliability, using multiple smaller scale integrated circuits. The device is composed of four GaAs 8*8-bit expandable parallel multipliers and a multichip package (MCP). The developed 8*8 multipliers consist of 1097 enhancement/depletion DCFL (directly coupled FET logic) gates each, and have a 3.4 ns multiplication time. The developed MCP is composed of five layers of alumina ceramic which include 50 Omega striplines. The multiplication time of this 16*16-bit multichip multiplier is 7.6 ns, and the total production yield is 70%.<>

  • Enabling technologies for achieving avionics modularization

    A packaging approach is described which maximizes IC density and minimizes those complexities which degrade reliability. It emphasizes the reduction of parts count along with a high degree of functional integration to achieve these goals. The packaging and interconnection technologies required to maximize density and reliability are under development at Allied-Signal and through cooperative efforts with appropriate government agencies full-scale interconnect modules could be produced to verify performance. It is found that a single board implementation with no prepacked die is the optimum configuration. A module becomes a large hybrid circuit in the sense that it integrates several technologies on a single substrate.<>

  • The Vanishing "Component"

    None



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