IEEE Organizations related to Nanopackaging

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No organizations are currently tagged "Nanopackaging"



Conferences related to Nanopackaging

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)

The scope of the 2020 IEEE/ASME AIM includes the following topics: Actuators, Automotive Systems, Bioengineering, Data Storage Systems, Electronic Packaging, Fault Diagnosis, Human-Machine Interfaces, Industry Applications, Information Technology, Intelligent Systems, Machine Vision, Manufacturing, Micro-Electro-Mechanical Systems, Micro/Nano Technology, Modeling and Design, System Identification and Adaptive Control, Motion Control, Vibration and Noise Control, Neural and Fuzzy Control, Opto-Electronic Systems, Optomechatronics, Prototyping, Real-Time and Hardware-in-the-Loop Simulation, Robotics, Sensors, System Integration, Transportation Systems, Smart Materials and Structures, Energy Harvesting and other frontier fields.


2020 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS)

One of the flagship conferences for the IEEE Robotics and Automation Society (RAS)


2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO)

DNA Nanotechnology Micro-to-nano-scale Bridging Nanobiology and Nanomedicine Nanoelectronics Nanomanufacturing and Nanofabrication Nano Robotics and Automation Nanomaterials Nano-optics, Nano-optoelectronics and Nanophotonics Nanofluidics Nanomagnetics Nano/Molecular Heat Transfer & Energy Conversion Nanoscale Communication and Networks Nano/Molecular Sensors, Actuators and Systems


2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)

Characterization, modeling and design for signal and power integrity of electronic systems.Modeling, simulation and measurement of electrical interconnect performance at chip, boardand package levels. Innovative CAD concepts and algorithms. Applications to computingdevices, mobile devices, automotive/aerospace.


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Periodicals related to Nanopackaging

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No periodicals are currently tagged "Nanopackaging"


Most published Xplore authors for Nanopackaging

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Xplore Articles related to Nanopackaging

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Nanotechnology-Empowered Flexible Printed Wireless Electronics: A Review of Various Applications of Printed Materials

IEEE Nanotechnology Magazine, 2019

In this article, the particular importance of nanotechnology-enabled materials associated with additive manufacturing techniques for the realization of radio-frequency (RF) components and modules for Internet of Things (IoT) and millimeter-wave (mm-wave) applications is discussed.


Ultrabarrier Films for Packaging Flexible Electronics: Examining the Role of Thin-Film Technology

IEEE Nanotechnology Magazine, 2019

The development of organic electronics, such as organic LED (OLED) devices and organic field effect transistors (OFE Ts), as well as thin-film solar cells enable the development of devices with a range of functionality in f lexible form factors [1]-[6].


Nanopackaging Pervades Future Electronic and Bioelectronic Systems [Guest Editorial]

IEEE Nanotechnology Magazine, 2019

Seamless heterogeneous device and component copackaging technologies are the key to future electronic and bioelectronic systems. Such systems will be pervasive and include mobile and high-performance computing, high-bandwidth 5G communications with enhanced mobile broadband and massive Internet of Things (IoT) connectivity, implantables and wearables for health monitoring and therapy, and advanced driver assistance systems, among other features.


Next-Generation Nanopackaging [Guest Editorial]

IEEE Nanotechnology Magazine, 2018

The articles in this special section focus on nanopackaging to realize next generation three-dimensional (3-D) and flexible electronics with heterogeneous functional integration. Nanopackaging is defined as the packaging of devices and systems with nanoscale materials and processes for improved performance, functionality, miniaturization, reliability, and cost. It seeks to bridge the gap between integrated circuits (ICs), which are at the nanoscale, ...



Educational Resources on Nanopackaging

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IEEE.tv Videos

No IEEE.tv Videos are currently tagged "Nanopackaging"

IEEE-USA E-Books

  • Nanotechnology-Empowered Flexible Printed Wireless Electronics: A Review of Various Applications of Printed Materials

    In this article, the particular importance of nanotechnology-enabled materials associated with additive manufacturing techniques for the realization of radio-frequency (RF) components and modules for Internet of Things (IoT) and millimeter-wave (mm-wave) applications is discussed.

  • Ultrabarrier Films for Packaging Flexible Electronics: Examining the Role of Thin-Film Technology

    The development of organic electronics, such as organic LED (OLED) devices and organic field effect transistors (OFE Ts), as well as thin-film solar cells enable the development of devices with a range of functionality in f lexible form factors [1]-[6].

  • Nanopackaging Pervades Future Electronic and Bioelectronic Systems [Guest Editorial]

    Seamless heterogeneous device and component copackaging technologies are the key to future electronic and bioelectronic systems. Such systems will be pervasive and include mobile and high-performance computing, high-bandwidth 5G communications with enhanced mobile broadband and massive Internet of Things (IoT) connectivity, implantables and wearables for health monitoring and therapy, and advanced driver assistance systems, among other features.

  • Next-Generation Nanopackaging [Guest Editorial]

    The articles in this special section focus on nanopackaging to realize next generation three-dimensional (3-D) and flexible electronics with heterogeneous functional integration. Nanopackaging is defined as the packaging of devices and systems with nanoscale materials and processes for improved performance, functionality, miniaturization, reliability, and cost. It seeks to bridge the gap between integrated circuits (ICs), which are at the nanoscale, and the rest of the system components that are typically at milliscale or microscale. Nanopackaging plays a key role in all the major aspects of system integration: improved functional density, higher power densities and power efficiency, higher bandwidth with lower power, improved thermal management, and better reliability.



Standards related to Nanopackaging

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No standards are currently tagged "Nanopackaging"


Jobs related to Nanopackaging

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