IEEE Organizations related to Soft Electronics

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Conferences related to Soft Electronics

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Periodicals related to Soft Electronics

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Most published Xplore authors for Soft Electronics

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Xplore Articles related to Soft Electronics

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Submicrometer-Scale All-Soft Electronics Based on Liquid Metal

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019

This paper presents a novel fabrication technique to create submicrometer- scale liquid metal (eutectic gallium-indium alloy, EGaIn) thin-film patterns for all-soft electronic devices. The proposed hybrid lithography process combines electron-beam lithography with soft lithography and enables high resolution and high density all-soft electronic passive components and microelectrode arrays. For the first time, submicrometer-scale EGaIn thin film patterning with feature sizes ...


Foreword: Special section on soft electronics

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015

Welcome to this first Special Topics section on Soft Electronics. Beginning with this issue, the IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY has initiated a Special Topics section, which will contain between four to eight high-quality papers that comprehensively describe the state of the art and potential future directions for the topics of great interest to our readers. These ...



Educational Resources on Soft Electronics

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IEEE-USA E-Books

  • Submicrometer-Scale All-Soft Electronics Based on Liquid Metal

    This paper presents a novel fabrication technique to create submicrometer- scale liquid metal (eutectic gallium-indium alloy, EGaIn) thin-film patterns for all-soft electronic devices. The proposed hybrid lithography process combines electron-beam lithography with soft lithography and enables high resolution and high density all-soft electronic passive components and microelectrode arrays. For the first time, submicrometer-scale EGaIn thin film patterning with feature sizes as small as 375 nm is demonstrated. Thanks to the intrinsic softness of EGaIn, the fabricated devices can endure mechanical strain >30%, while maintaining electrical functionality.

  • Foreword: Special section on soft electronics

    Welcome to this first Special Topics section on Soft Electronics. Beginning with this issue, the IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY has initiated a Special Topics section, which will contain between four to eight high-quality papers that comprehensively describe the state of the art and potential future directions for the topics of great interest to our readers. These topics are selected by the EIC in consultation with the other EICs, AEs, and domain experts. Solicitation and peer review of the papers within the Special Topic are directed by a Guest or Associate Editor (GE/AE), who is a leading expert in the area. In the cases where the GE/AE is also an author, the EIC is responsible for the peer review to avoid any real or perceived conflicts of interest.



Standards related to Soft Electronics

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Jobs related to Soft Electronics

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