IEEE Organizations related to Multivibrators

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Conferences related to Multivibrators

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2020 IEEE International Symposium on Circuits and Systems (ISCAS)

The International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems (CAS) Society and the world’s premier networking and exchange forum for researchers in the highly active fields of theory, design and implementation of circuits and systems. ISCAS2020 focuses on the deployment of CASS knowledge towards Society Grand Challenges and highlights the strong foundation in methodology and the integration of multidisciplinary approaches which are the distinctive features of CAS contributions. The worldwide CAS community is exploiting such CASS knowledge to change the way in which devices and circuits are understood, optimized, and leveraged in a variety of systems and applications.


2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS)

The IEEE International Midwest Symposium on Circuits and Systems is the oldest IEEE sponsored or co-sponsored conference in the area of analog and digital circuits and systems. Traditional lecture and interactive lecture/poster sessions cover virtually every area of electronic circuits and systems in all fields of interest to IEEE.


2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

PRIME 2018 will be held in Prague, Czech Republic. PRIME has been established over the recent years as an important conference where Ph. D. students and post-docs with less than one year post-Ph. D. experience can present their research results and network with experts from industry, academia and research. PRIME 2018 conference program will reflect the wide spectrum of research topics in Microelectronics and Electronics, building bridges between various research fields. In addition to the technical sessions, opportunities for the conference attendees will be the keynote talks, workshops and social events.

  • 2017 13th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    PRIME2017 conference program will reflect the wide spectrum of research topics in Microelectronics and Electronics, building bridges between various research fields. PRIME has been established over the recent years as an important conference where Ph.D. students and post-docs with less than one year post-Pd.D. experience can present their research results and network with experts from industry, academia and research. The main objectives of PRIME are: to encourage favourable exposure to Ph. D. students in the early stages of their careers; to benchmark Ph.D. research in a friendly and cooperative environment; to enable sharing of student and supervisor experiences of scientific and engineering research; to connect Ph.d. students and their supervisors with companies and research centres.

  • 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    PRIME2016 conference program will reflect the wide spectrum of research topics in Microelectronics and Electronics, building bridges between various research fields. PRIME has been established over the recent years as an important conference where PhD students and post-docs with less than one year post-PhD experience can present their research results and network with experts from industry, academia and research. The main objectives of PRIME are: to encourage favourable exposure to Ph.D. students in the early stages of their careers; to benchmark Ph.D. research in a friendly and cooperative environment; to enable sharing of student and supervisor experiences of scientific and engineering research; to connect Ph.D. students and their supervisors with companies and research centres.

  • 2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    PRIME conference is dedicated to Ph. D. students who have to present all regular papers.The purpose of PRIME is to: Encourage favorable exposure to Ph. D. students in the early stage of their career, Benchmark Ph. D. research in a friendly and cooperative environment, Enable sharing of Ph. D. and supervisors experience on scientific research, Create a connection between academic world and companies to meet these expectations PRIME features: Conference program reflecting the wide spectrum of research topics in Microelectronics and Electronics, building bridges between research fields, Free of charge full-day tutorials for all conference participants, Company Fair for fruitful interactions between Ph.D. students and their supervisors with industry representatives

  • 2014 10th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    PRIME conference is dedicated to Ph. D. students who have to present all regular papers.The purpose of PRIME is to :- Encourage favorable exposure to Ph. D. students in the early stage of their career- Benchmark Ph. D. research in a friendly and cooperative environment- Enable sharing of Ph. D. and supervisors experience on scientific research- Create a connection between academic world and companiesTo meet these expectations PRIME features:- Conference program reflecting the wide spectrum of research topics in Microelectronics and Electronics, building bridges between research fields- Free of charge full-day tutorials for all conference participants- Company Fair for fruitful interactions between Ph.D. students and their supervisors with industry representatives

  • 2013 9th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    The conference is a meeting point for PhD students that have the opportunity to present their scientific activities.

  • 2012 8th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    Encourage publication by Ph.D. students in the early stages of their career, in order to benchmark there research in a friendly and cooperative environment. Enable sharing of scientific and engineering experiences between students and supervisors.

  • 2011 7th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)

    The objectives of PRIME are: - to encourage favourable exposure to Ph. D. students in the early stages of their careers; - to benchmark Ph.D. research in a friendly and cooperative environment; - to enable sharing of students and supervisors experiences of scientific and engineering research; - to connect Ph.D. students and their supervisors with companies and research centers.

  • 2010 Ph.D. Research in Microelectronics and Electronics (PRIME)

    Last year P.hD. candidates should be come together at PRIME 2010 to be networked with Industry

  • 2009 Ph.D. Research in Microelectronics and Electronics (PRIME)

    The objectives of PRIME are: to encourage favourable exposure to Ph.D. students in the early stages of their careers, to benchmark Ph.D. research in a friendly and cooperative environment, to enable sharing of students and supervisors experiences of scientific and engineering research, and to connect Ph.D. students and their supervisors with companies and research centres.

  • 2008 Ph.D. Research in Microelectronics and Electronics (PRIME)

    The purpose of this conference is to: # Encourage favourable exposure to Ph.D. students in the early stage of their career # Benchmark Ph.D. research in a friendly and cooperative environement # Enable sharing of Ph.D. and supervisors experience on scientific research # Create at the Company Fair a connection between academic world (Ph.D. students) and companies The aim of PRIME 2008 is to provide an opportunity for Ph.D. students to present their research activity and contact other people in the rese

  • 2007 Ph.D. Research in Microelectronics and Electronics (PRIME)

    The purpose of this conference is to encourage favourable exposure to Ph.D. students in the early stage of their career and to benchmark Ph.D. research in a friendly and cooperative environment. It will also enable sharing of Ph.D. and supervisors experience on scientific research and create at the Company Fair a connection between academic world (Ph.D. students) and companies.

  • 2006 Ph.D. Research in Microelectronics and Electronics (PRIME)

  • 2005 Ph.D. Research in Microelectronics and Electronics (PRIME)


2018 15th IEEE India Council International Conference (INDICON)

The 15th IEEE India Council International Conference (INDICON 2018), being organized by the IEEE Madras Section during December 15-18, 2018, at Amrita Vishwa Vidyapeetham, Combatore, with technical support from the Indian Institute of Technology Madras, promises to be bigger and better than before. Covering all the areas of relevance to the IEEE, the topics have been broadly classified into twelve tracks. More information about the conference can be obtained from its website (http://indicon2018.in). It attracts the best of research and researchers in the country, in the areas of Electrical, Electronics and Computer Engineering.

  • 2017 14th IEEE India Council International Conference (INDICON)

    All areas of Computer Science Engineering, Electrical Engineering, as well as Electronics and Communication Engineering.

  • 2016 IEEE Annual India Conference (INDICON)

    INDICON is a well-recognized annual conference of IEEE India Council, hosted by an IEEE Section in India. It is in the areas of Computer Science Engineering, Electrical Engineering, as well as Electronics and Communication Engineering. The 13th edition of the conference, INDICON-2016, is organized by IEEE Bangalore Section. The 2016 edition of the conference has following areas of Call for Papers. We solicit original research work/studies in the following areas in the format of paper for possible acceptance after review for presentation. 7 tracks are, 1. Computer Science2. Electronic Systems3. Energy Systems4. Humanitarian Technology5. Microwave (Antenna/Measurements/EMI/EMC/)6. Networking and Communication Engineering7. Signal and Image ProcessingYou will get about conference on www.indicon2016.in

  • 2015 Annual IEEE India Conference (INDICON)

    INDICON is a conference dedicated to Electrical & Electronics Engineering in general and hence the theme of INDICON 2015 has been chosen as E3-C3. The conference will have Research Track focusing on cutting edge research in all the 6 tracks, Energy and Power, Electrical Engineering and Environment, Electronics, Computers & Information Technology, Control & Instrumentation, and Communications. The conference also plans to have industry specific panel sessions on all the 6 tracks mentioned. Expert tutorial sessions, one each will be held on each topic. An exhibition is planned with display of industrial advances in all the fields.

  • 2014 Annual IEEE India Conference (INDICON)

    Big data and Data mining, Cloud and Ubiquitous Computing, Emerging trends in Engineering, High Performance Computing, Information and network security, Power and Energy, Software and Database System

  • 2013 Annual IEEE India Conference (INDICON)

    INDICON has been the most prestigious conference conceptualized by IEEE India Council in the field of Computer Science and Engineering, Electrical Engineering & Electronics and Communication Engineering, in general.

  • 2012 Annual IEEE India Conference (INDICON)

    The conference tries to bring out innovations in Social and Humanitarian Engineering from all disciplines of Science and Engineering.

  • 2011 Annual IEEE India Conference (INDICON)

    INDICON 2011, the flagship annual conference of IEEE India Council, is scheduled to be held in Hyderabad during 16th-18th December, 2011.The theme of the conference this year is , "Engineering Sustainable Solutions". Jointly organised by India Council and IEEE Hyderabad Section, INDICON 2011 is 2011 Annual IEEE India Conference. It is a 3-day program (1 day tutorial and 2 day conference).

  • 2010 Annual IEEE India Conference (INDICON)

    INDICON is the Annual Conference of IEEE India Council. Green awareness and suitable design approaches to achieve Green Computing, Green Communication and Green Energy are the focus of this conference. Besides this, Power and Energy Systems, Computing, and communications are included in General Category. Tutorials and Exhibitions are also included.

  • 2009 Annual IEEE India Conference (INDICON)

    INDICON has been the most prestigious conference conceptualized by IEEE India Council in the field of Computer Science and Engineering, Electrical Engineering & Electronics and Communication Engineering, in general. This conference was earlier organized with the name of Annual Conference and Exhibition (ACE). It was later renamed as INDICON in 2004 when it was organized by IEEE Kharagpur Section at IIT Kharagpur.

  • 2008 Annual IEEE India Conference (INDICON)

    IEEE India Council has been holding annual conference and Exhibition (ACE) at different locations in India. From 2004 ACE is renamed as INDICON. INDICON-2008 is being organized by IEEE Uttar Pradesh Section, jointly with IEEE India council and IIT Kanpur during 11-13 December 2008 at Indian Institute of Technology, Kanpur. Emerging fields such as distributed systems, multi-agent systems and cooperative intelligent systems are bringing exciting prospects in research.

  • 2006 Annual IEEE India Conference (INDICON)

  • 2005 Annual IEEE India Conference (INDICON)

  • 2004 Annual IEEE India Conference (INDICON)


2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)

Circuits and Systems, Computers, Information Technology, Communication Systems, Control and Instrumentation, Electrical Power Systems, Power Electronics, Signal Processing


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Periodicals related to Multivibrators

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Most published Xplore authors for Multivibrators

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Xplore Articles related to Multivibrators

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A silicon thermal astable multivibrator for flow and temperature sensing

IEEE Transactions on Electron Devices, 2002

Here we report for the first time on a thermal astable multivibrator modality made possible with a silicon bulk micromachined flow sensor. The sensor shows an oscillatory response for constant current input. Further, the frequency of oscillation is modulated with the temperature of the sensing element, realizing the performance of a thermal multivibrator. The temperature variation is induced via air ...


Mixed VLSI System with Dynamic Reconfigurability & Multifunctionality

2018 4th International Conference on Computing Communication and Automation (ICCCA), 2018

Today in electronic system (VLSI), digital circuit dominates market by keeping importance of analog integrated circuit. In many electronics system, analog block is used as interfacing between digital world and real word application. Analog approach has advantages like compactness, low power as compared to digital approach. But for analog circuit designing fabrication and design required precise skill and long time ...


1200-V IGBT Driver IC with Level-shift Circuit using Multi-chip Composition with High dV/dt Reliability

2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe), 2018

We studied the problem that occurred when the level-shift circuit of a monolithic IC was applied to that of a multi-chip IC, especially malfunction caused by dV/dt of insulated gate bipolar transistors (IGBTs) switching. Using the Simulation Program with Integrated Circuit Emphasis (SPICE), we simulated a level-shift circuit of the sort used for our commercialized 600-V monolithic IC and found ...


Protection of spacecraft electronics against ESD effects using nanoconductive insulators

2018 Moscow Workshop on Electronic and Networking Technologies (MWENT), 2018

This paper develops the concept of possibility of using nanoconductive dielectrics in printed circuit boards instead of traditional ones. The symmetrical multivibrator was taken as an example of typical digital device and the computer simulations were performed using the LTspice software. Nanoconductive dielectrics have less electrificability, thus provide fewer electrostatic discharges (ESD) caused by the action of electron irradiation. Based ...


Comment on "VCO jitter reduction with bandpass filtering"

Electronics Letters, 1995

Following publication of the Letter 'VCO jitter reduction with bandpass filtering', the author received a critique from G.H.S. Rokos, who pointed out several limitations of the approach and observed that the jitter reduction provided by the post-VCO filter would be minimal for multivibrator phase noise produced by a correlated power spectrum. Furthermore, he pointed out that a single transition phase ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • A silicon thermal astable multivibrator for flow and temperature sensing

    Here we report for the first time on a thermal astable multivibrator modality made possible with a silicon bulk micromachined flow sensor. The sensor shows an oscillatory response for constant current input. Further, the frequency of oscillation is modulated with the temperature of the sensing element, realizing the performance of a thermal multivibrator. The temperature variation is induced via air flow and a change in frequency of 5 Hz is observed for air flow velocities in the range of 0-21 m/s. The low output frequencies (20-25 Hz) observed clearly suggest that the oscillations are purely thermal in origin. In contrast, others have reported many electronic switching effects obtained by the various physical mechanisms via negative differential resistance regimes, which typically give rise to much higher frequencies of oscillations in the range of kHz-GHz.

  • Mixed VLSI System with Dynamic Reconfigurability & Multifunctionality

    Today in electronic system (VLSI), digital circuit dominates market by keeping importance of analog integrated circuit. In many electronics system, analog block is used as interfacing between digital world and real word application. Analog approach has advantages like compactness, low power as compared to digital approach. But for analog circuit designing fabrication and design required precise skill and long time and cost. The concept of hierarchy, modularity and regularity is used in digital system therefore design and study of various parameters affected by this design process are easily possible. Automation and abstraction level is low in analog design, Also lack of a structured design flow and limited functional availability is in analog world and there is no synthesizer or method available to make analog system dynamic reconfigurable with Multifunctionality. So there is need to design the analog circuit dynamic synthesizable similar that of digital domain. From above it is very clear that there is vast area available in analog system design. Reconfigurability and Multifunctionality are the challenging task for dynamic mixed design. Therefore our proposed work is carried out with proposing prototype in analog field for mixed signal design with Reconfigurability and Multifunctionality of an analog design as well the total reconfiguration will be carried out with digital controlling. Result shows a sample of design simulation and comparison of original and proposed design.

  • 1200-V IGBT Driver IC with Level-shift Circuit using Multi-chip Composition with High dV/dt Reliability

    We studied the problem that occurred when the level-shift circuit of a monolithic IC was applied to that of a multi-chip IC, especially malfunction caused by dV/dt of insulated gate bipolar transistors (IGBTs) switching. Using the Simulation Program with Integrated Circuit Emphasis (SPICE), we simulated a level-shift circuit of the sort used for our commercialized 600-V monolithic IC and found that when the maximum rating of the circuit was exceeded, a malfunction occurred based on dV/dt. We developed a new 1200-V level-shift circuit composed of multi-chips and used SPICE and experiment that the developed IC was supplied with DC 900V to confirm that it operated without malfunction when dV/dt was from 0 to 30 kV/μs.

  • Protection of spacecraft electronics against ESD effects using nanoconductive insulators

    This paper develops the concept of possibility of using nanoconductive dielectrics in printed circuit boards instead of traditional ones. The symmetrical multivibrator was taken as an example of typical digital device and the computer simulations were performed using the LTspice software. Nanoconductive dielectrics have less electrificability, thus provide fewer electrostatic discharges (ESD) caused by the action of electron irradiation. Based on the results of computer simulations and calculations the dielectric parameters of the printed circuit board for which ESD are physically impossible were determined. It was shown that the change in the output parameters of the multivibrator does not exceed 5%. Therefore, it is possible and necessary to use nanoconductive dielectrics in the on-board radio electronic systems and equipment of space vehicles. According to our data, such dielectrics discharge-free, also conductivity raised to 10-9Ω-Ω-1does not affect the operation of the electronics.

  • Comment on "VCO jitter reduction with bandpass filtering"

    Following publication of the Letter 'VCO jitter reduction with bandpass filtering', the author received a critique from G.H.S. Rokos, who pointed out several limitations of the approach and observed that the jitter reduction provided by the post-VCO filter would be minimal for multivibrator phase noise produced by a correlated power spectrum. Furthermore, he pointed out that a single transition phase error such as that analysed in the Letter would cause a permanent phase shift in the multivibrator output, which would eventually be corrected by the phase-locked loop. The post-VCO filter would 'at best delay the effect of such an event'. Rokos concluded that the conditions under which the author's analysis is appropriate are hard to envisage, and they should be stated explicitly. The author acknowledges the points raised and goes on to clarify the conditions under which his analysis is valid.<>

  • Shape-Memory Alloy Actuated Low Frequency Astable Electromechanical Multivibrator

    This paper presents a design of an astable electromechanical multivibrator using Shape Memory Alloy (SMA) spring. The device has been designed by assembling a nitinol spring, an elastic spring and a bistable mechanical toggle switch, and driving the assembly by a DC voltage source. The same design can be operated by AC voltage also. The proposed SMA-actuated astable electromechanical multivibrator can generate an electromechanical oscillation of 33 mHz directly from a DC voltage source. This astable electromechanical multivibrator can be used as an oscillatory translational or reciprocating curvilinear motion actuator of large deflection and large block force. The design has been prototyped and tested with bench-top experimental set-up.

  • Monolithic GaAs multivibrator for operation at temperatures up to 300 degrees C

    A technology for temperature-stable GaAs integrated circuits is described, using as an example a monolithic multivibrator. The performance of this multivibrator and the different modes of operation are presented. It is shown that conventional models for integrated circuits fail at temperatures higher than 200 degrees C and that only careful design may prevent failures due to electric overstress, which is more probable at high temperatures.<>

  • All-optical flip-flop operations in a coupled element bistable device

    An optical bistable device composed of coupled nonlinear elements is proposed. This device features optical bistability without hysteresis. It is shown theoretically that a set-reset type (S-R) flip-flop operation can be easily achieved on an all-optical basis by utilising nonhysteretic bistable characteristics.<>

  • Microfluidic Circuit Dynamics and Control for Caterpillar-Inspired Locomotion in a Soft Robot

    Because caterpillars can locomote through complex terrain, caterpillar- inspired soft robots promise safe and reliable access for search, rescue, and exploration. Microfluidic components analogous to electronic components like resistors and capacitors further promise the principled design and fabrication of autonomous soft robots powered by microfluidic circuits. This paper presents a model for caterpillar locomotion using an oscillator network approach, in which the periodic motion of each leg is described by an oscillator, and the collection of all legs forms a network. We use tools from graph theory to model (1) a first-order system consisting of a network of RC oscillators connected to an astable multivibrator circuit serving as a Central Pattern Generator (CPG); and (2) a second-order system consisting of a network of RLC oscillators with a deCentralized Pattern Generator (dCPG) as reference control. For the RC network, we analyze the rate of convergence and the gait number, a metric that characterizes the locomotion gait. For the RLC network, we design feedback laws to stabilize consensus and traveling wave solutions. Numerical modeling and preliminary experimental results show promise for the design and control of locomotion circuitry in a caterpillar-inspired soft robot.

  • A Combination of Astable Multivibrator and Microcontroller for Thermistor-Based Temperature Measurement Over Internet

    The paper reports the development of a cost-effective Negative Temperature Coefficient thermistor-based temperature transducer for embedded systems and for the Internet of Things applications. The venture uses a 555 timer-based astable multivibrator as a first-stage linearizer in which the thermistor and a linearizing resistance in series with it modulate the threshold voltages of the internal comparators of the integrated circuit. The output is further processed by a microcontroller which performs a second stage linearization with the help of a look-up table coupled with linear interpolation. Furthermore, the microcontroller uses an Ethernet shield to transmit the temperature information to remote locations. The performance of the proposed setup has been examined for three different thermistors, over 30 °C to 120 °C. The measurement strategy has been found to outperform the competing arrangements reported in recent times, with regard to the measurement accuracy, linearity of transfer, compactness, cost, reliability, and immunity to drift.



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