Conferences related to Dendrites

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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


2020 IEEE International Conference on Image Processing (ICIP)

The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.


2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


2020 IEEE International Reliability Physics Symposium (IRPS)

Meeting of academia and research professionals to discuss reliability challenges


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Periodicals related to Dendrites

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


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Most published Xplore authors for Dendrites

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Xplore Articles related to Dendrites

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Notice of Retraction<br>The simulation of phase field method about fluctuation to the dendrites growth

2010 International Conference on Computer Application and System Modeling (ICCASM 2010), 2010

This article has been retracted by the publisher.


Physical analysis of dendrites within conformal coat

Proceedings of 1994 IEEE Aerospace Applications Conference Proceedings, 1994

The following describes an analysis performed on dendrites found in a conformally coated module within a frequency generator unit. High-power visual inspection, Scanning Electron Microscopy (SEM), and Energy Dispersive X-Ray (EDAX) results confirmed the existence and constituents of the dendrites. For the purposes of this paper, a dendrite is defined as the migration of metal (Ag, Cu, Pb, Sn, etc.) ...


Nickel dendrites: a new failure mechanism in ceramic hermetic packages

Annual Reliability and Maintainability Symposium 1995 Proceedings, 1995

A new failure mechanism, nickel dendrites, was identified in hermetic ceramic packages. Nickel dendrites resulted from an unauthorized change in the supplier's assembly process. The change caused lots to be produced with package ambient moisture levels ranging from 10% by volume to 20% by volume. Device cooling in the system application reduced the package temperature below the dew point of ...


Chemical reduction route towards fabrication of four-fold shape Ce(OH)CO3dendrites

Micro & Nano Letters, 2011

Highly uniform four-fold shape Ce(OH)CO3dendrites were successfully prepared in large quantities through a facile reduction hydrothermal approach. The samples were prepared from the reaction of Ce(NH4)2(NO3)6with CO(NH2)2at 160°C in a water°N2H4complex. X-ray diffraction, scanning electron microscopy and transmission electron microscopy were used to characterise the products. The influence of the N2H4on the dendrites formation was discussed.


A Robust Morphological Associative Memory Endowed with Dendrites

2005 International Conference on Neural Networks and Brain, 2005

Morphological neural networks are based on a new paradigm for neural computing. The basic neural computation in a morphological neuron takes the maximum or minimum of the sums of neural values and their corresponding synaptic weights. As a consequence, the properties of morphological neural networks are drastically different than those of traditional neural network models. By making the morphological neuron ...


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IEEE.tv Videos

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IEEE-USA E-Books

  • Notice of Retraction<br>The simulation of phase field method about fluctuation to the dendrites growth

    This article has been retracted by the publisher.

  • Physical analysis of dendrites within conformal coat

    The following describes an analysis performed on dendrites found in a conformally coated module within a frequency generator unit. High-power visual inspection, Scanning Electron Microscopy (SEM), and Energy Dispersive X-Ray (EDAX) results confirmed the existence and constituents of the dendrites. For the purposes of this paper, a dendrite is defined as the migration of metal (Ag, Cu, Pb, Sn, etc.) occurring in an electric field with moisture, temperature, and contamination as accelerating factors. This paper addresses the physical aspects of dendrites and not the factors required for growth. Conformal coating is a thin protective layer of silicone material used in electrical assemblies. It is mainly used to prevent particulate contamination and minor mechanical damage but does not protect the assembly against moisture due to its absorption properties.<<ETX>>

  • Nickel dendrites: a new failure mechanism in ceramic hermetic packages

    A new failure mechanism, nickel dendrites, was identified in hermetic ceramic packages. Nickel dendrites resulted from an unauthorized change in the supplier's assembly process. The change caused lots to be produced with package ambient moisture levels ranging from 10% by volume to 20% by volume. Device cooling in the system application reduced the package temperature below the dew point of the internal package ambient and allowed water to condense. The liquid water absorbed materials from the ambient atmosphere and reacted with the nickel underplating of the package conductors. Normal operating voltages provided the electrical potential necessary for the growth of nickel dendrites. Burn-in was not effective in screening out this failure mechanism because temperature during burn-in was above the dew point of the package ambient. The supplier revised their assembly procedures to prevent unauthorized process changes of this type. UNISYS purged all devices in the suspect date code range from the factory and field inventory. Corrective actions were implemented by UNISYS and the supplier with the result that this failure mechanism was eliminated from both field and factory. The nickel dendrite failure mechanism has not been reported in any literature. Hermetic ceramic packaging is widely used. The existence of a new failure mechanism has tremendous potential impact on product reliability, process controls, reliability prediction, and failure analysis.

  • Chemical reduction route towards fabrication of four-fold shape Ce(OH)CO3dendrites

    Highly uniform four-fold shape Ce(OH)CO3dendrites were successfully prepared in large quantities through a facile reduction hydrothermal approach. The samples were prepared from the reaction of Ce(NH4)2(NO3)6with CO(NH2)2at 160°C in a water°N2H4complex. X-ray diffraction, scanning electron microscopy and transmission electron microscopy were used to characterise the products. The influence of the N2H4on the dendrites formation was discussed.

  • A Robust Morphological Associative Memory Endowed with Dendrites

    Morphological neural networks are based on a new paradigm for neural computing. The basic neural computation in a morphological neuron takes the maximum or minimum of the sums of neural values and their corresponding synaptic weights. As a consequence, the properties of morphological neural networks are drastically different than those of traditional neural network models. By making the morphological neuron incorporate dendritic processes, a more realistic model is established. In this paper, we restrict our attention to morphological associative memory endowed with dendrites (MAMED). After a brief review of MAMED and a short discussion about the disadvantages of MAMED in coping with random noises, we present an efficient way of choosing parameter for MAMED taking into account position characteristics of patterns. Our experimental results demonstrate that our way not only makes MAMED be robust in the presence of random noises, but avoids a series of problems brought by choosing arbitrarily

  • Notice of Retraction<br>3D anisotropy simulation of dendrites growth with phase-field method

    This article has been retracted by the publisher.

  • Current carrying capacity of dendrites

    Dendrites are sometimes found on electronic hardware during failure analysis or trouble shooting activities. Problems due to dendrite formation can vary from catastrophic failure to occasional electronic glitches. If a dendrite is thought of as a fuse in a circuit, then it is apparent that it can have, depending on size, a wide range of current carrying capability. Mathematical modeling and experimental analyses were conducted to determine the reasons for the wide range of observed behavior. Mathematical modeling indicates that the resistivity of the dendrite and the thermophysical characteristics of the substrate on which it is grown determine its current carrying capacity. More specifically, the modeling indicates that maximum dendrite size and time to failure are determined by the power loss within the dendrite and the rate at which heat can be transferred away from the dendrite. Small dendrites are stable and can grow until they reach a size at which internal heat generation cannot be accommodated by the heat loss due to conduction through the substrate. Dendrites in low voltage applications on substrates with high thermal diffusivity are more likely to lead to failures with high power loss, whereas dendrites in high voltage applications on low thermal diffusivity substrates (e.g. tin on glass/epoxy circuit board material) are more likely to lead to high resistance shorts. Experimental results and failure analysis observations agree qualitatively and semi-quantitatively with the results of the idealized dendrite model.<<ETX>>

  • An Augmented Two-Layer Model Captures Nonlinear Analog Spatial Integration Effects in Pyramidal Neuron Dendrites

    In pursuit of the goal to understand and eventually reproduce the diverse functions of the brain, a key challenge lies in reverse engineering the peculiar biology-based “technology” that underlies the brain's remarkable ability to process and store information. The basic building block of the nervous system is the nerve cell, or “neuron,” yet after more than 100 years of neurophysiological study and 60 years of modeling, the information processing functions of individual neurons, and the parameters that allow them to engage in so many different types of computation (sensory, motor, mnemonic, executive, etc.) remain poorly understood. In this paper, we review both historical and recent findings that have led to our current understanding of the analog spatial processing capabilities of dendrites, the major input structures of neurons, with a focus on the principal cell type of the neocortex and hippocampus, the pyramidal neuron (PN). We encapsulate our current understanding of PN dendritic integration in an abstract layered model whose spatially sensitive branch-subunits compute multidimensional sigmoidal functions. Unlike the 1-D sigmoids found in conventional neural network models, multidimensional sigmoids allow the cell to implement a rich spectrum of nonlinear modulation effects directly within their dendritic trees.

  • Active Processing of Spatio-Temporal Input Patterns in Silicon Dendrites

    Capturing the functionality of active dendritic processing into abstract mathematical models will help us to understand the role of complex biophysical neurons in neuronal computation and to build future useful neuromorphic analog Very Large Scale Integrated (aVLSI) neuronal devices. Previous work based on an aVLSI multi-compartmental neuron model demonstrates that the compartmental response in the presence of either of two widely studied classes of active mechanisms, is a nonlinear sigmoidal function of the degree of either input temporal synchrony OR input clustering level. Using the same silicon model, this work expounds the interaction between both active mechanisms in a compartment receiving input patterns of varying temporal AND spatial clustering structure and demonstrates that this compartmental response can be captured by a combined sigmoid and radial-basis function over both input dimensions. This paper further shows that the response to input spatio- temporal patterns in a one-dimensional multi-compartmental dendrite, can be described by a radial-basis like function of the degree of temporal synchrony between the inter-compartmental inputs.

  • An accelerated analog neuromorphic hardware system emulating NMDA- and calcium-based non-linear dendrites

    This paper presents an extension of the BrainScaleS accelerated analog neuromorphic hardware model. The scalable neuromorphic architecture is extended by the support for multi-compartment models and non-linear dendrites. These features are part of a 65 nm prototype Application Specific Integrated Circuit (ASIC). It allows to emulate different spike types observed in cortical pyramidal neurons: NMDA plateau potentials, calcium and sodium spikes. By replicating some of the structures of these cells, they can be configured to perform coincidence detection within a single neuron. Built-in plasticity mechanisms can modify not only the synaptic weights, but also the dendritic synaptic composition to efficiently train large multi-compartment neurons. Transistor-level simulations demonstrate the functionality of the analog implementation and illustrate analogies to biological measurements.



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