Conferences related to Shape Memory Material

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2021 IEEE International Conference on Mechatronics (ICM)

CM focuses on recent developments and future prospects related to the synergetic integration of mechanics, electronics, and information processing.


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Shape Memory Material

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Automation Science and Engineering, IEEE Transactions on

The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...


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Most published Xplore authors for Shape Memory Material

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Xplore Articles related to Shape Memory Material

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Sensing Characteristics of Magnetic Shape Memory Materials

2009 Second International Conference on Intelligent Computation Technology and Automation, 2009

Magnetic shape memory (MSM) material is a class of smart material that changes shape when it is exposed to a moderate magnetic field, which provides a new way to produce motion and force. The material has also another interesting property: the MSM material can change its magnetic property when it is subjected to external force, which is known as sensing ...


Electromagnetic induction system for testing ferromagnetic shape memory alloys

Proceedings of 2011 6th International Forum on Strategic Technology, 2011

This paper presents an electromagnetic induction system aiming to measure elongation of ferromagnetic magnetic shape memory alloys (FSMA) and to move the FSMA element backward as a load cell. In present study linear motor as a load cell and measurement device is used and tested. Experimental results show that the system is able to measure the elongation of the FSMA ...


Researches on the Realization of a Electromechanical Micropump

2018 International Conference and Exposition on Electrical And Power Engineering (EPE), 2018

The paper aims to determine the characteristics of smart materials with shape memory and to find out their resistance to repeated cycles of use. The system consists of an electromechanical micropump prototype based on current- controlled Nitinol spring elements for the purpose of dosing a liquid. In the paper there will be presented characteristics concretized in the variation of liquid ...


Research on LCD active disassembly structure reliability based on smart material

2012 IEEE International Symposium on Sustainable Systems and Technology (ISSST), 2012

To improve the disassembly and recycling efficiency of waste electronic products, the research on active disassembly of product with shape memory materials has attracted people's attention. Cleaner Electronic Research of Brunel University's Joseph Chiodo, etc, conducted a series of active disassembly experimental and method studies for ADSM (Active disassembly using smart materials, ADSM) and applied active disassembly structure to Walkman, ...


Fabrication of Ferrite-Coated Magnetic Fe-Mn-Si-Cr-Ni Alloy Utilizing Selective Oxidation of Mn Element

IEEE Transactions on Magnetics, None

The development of magnetic properties extends application fields of Fe-Mn-Si- based shape memory alloys (SMAs) into the field of electromagnetic sensors and actuators. In the previous studies, magnetic Fe-Mn-Si-based shape memory ribbons have been prepared by the melt-spinning technique. However, the melt- spinning technique could only obtain 2-D thin materials. In this paper, a ferrite-coated Fe-18.81Mn-5.61Si-9.31Cr-5.36Ni bulk shape memory material, ...


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Educational Resources on Shape Memory Material

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IEEE.tv Videos

Perpendicular magnetic anisotropy: From ultralow power spintronics to cancer therapy
35 Years of Magnetic Heterostructures
Accelerating Machine Learning with Non-Volatile Memory: Exploring device and circuit tradeoffs - Pritish Narayanan: 2016 International Conference on Rebooting Computing
Magnetics + Mechanics + Nanoscale = Electromagnetics Future - Greg P. Carman: IEEE Magnetics Distinguished Lecture 2016
Material-Handling- Paradigms for Humanoids and UAVs
Micro-Apps 2013: Determining Circuit Material Dielectric Constant from Phase Measurements
Computing Based on Material Training: Application to Binary Classification Problems - IEEE Rebooting Computing 2017
IEEE Future Networks Initiative - Academia and Industry Shaping and Evolving the Future
From Edge To Core: Memory-Driven Hardware and Software Co-Design - IEEE Rebooting Computing Industry Summit 2017
IMS 2014: Out-of-Plane and Inline RF Switches based on Ge2Sb2Te5 Phase-Change Material
Satoshi Tadokoro: RAS Project - Creation of Educational Material in RA (CEMRA) - Studio Tech Talks: Sections Congress 2017
IMS 2011 Microapps - Memory Effects in RF Circuits: Definition, Manifestations and Fast, Accurate Simulation
Nonlinear Material Responses and Their Characterization: An IPC Keynote with Eric Van Stryland
Ted Berger: Far Futures Panel - Technologies for Increasing Human Memory - TTM 2018
DROP: The Durable Reconnaissance and Observation Platform
Improved Deep Neural Network Hardware Accelerators Based on Non-Volatile-Memory: the Local Gains Technique: IEEE Rebooting Computing 2017
Impact of Linearity and Write Noise of Analog Resistive Memory: IEEE Rebooting Computing 2017
Towards Logic-in-Memory circuits using 3D-integrated Nanomagnetic Logic - Fabrizio Riente: 2016 International Conference on Rebooting Computing
Consistent, Reliable and Peak-Performing PCB Assemblies: MicroApps 2015 - Zentech Manufacturing, Inc.
2011 IEEE Honors Ceremony

IEEE-USA E-Books

  • Sensing Characteristics of Magnetic Shape Memory Materials

    Magnetic shape memory (MSM) material is a class of smart material that changes shape when it is exposed to a moderate magnetic field, which provides a new way to produce motion and force. The material has also another interesting property: the MSM material can change its magnetic property when it is subjected to external force, which is known as sensing characteristics of MSM material. In this paper, shape variation mechanism and performance of MSM material is introduced, a testing device which is used to measuring sensing characteristics of MSM material is presented. Experimental results show that the larger variation of magnetic flux density is caused when the MSM material is mechanically compressed in testing device. The variation of magnetic flux density depends on the geometrical and material parameters of the MSM element, as well as on its deformation rate. Potential application is proposed as a MSM force sensor.

  • Electromagnetic induction system for testing ferromagnetic shape memory alloys

    This paper presents an electromagnetic induction system aiming to measure elongation of ferromagnetic magnetic shape memory alloys (FSMA) and to move the FSMA element backward as a load cell. In present study linear motor as a load cell and measurement device is used and tested. Experimental results show that the system is able to measure the elongation of the FSMA element in the range 0 to 2.3 mm.

  • Researches on the Realization of a Electromechanical Micropump

    The paper aims to determine the characteristics of smart materials with shape memory and to find out their resistance to repeated cycles of use. The system consists of an electromechanical micropump prototype based on current- controlled Nitinol spring elements for the purpose of dosing a liquid. In the paper there will be presented characteristics concretized in the variation of liquid quantities dosing through the containers depending on the position of the shape memory material elements. The results will lead to the development of special applications with intelligent materials, of some high-performance micropumps with applicability in the medical and automotive field.

  • Research on LCD active disassembly structure reliability based on smart material

    To improve the disassembly and recycling efficiency of waste electronic products, the research on active disassembly of product with shape memory materials has attracted people's attention. Cleaner Electronic Research of Brunel University's Joseph Chiodo, etc, conducted a series of active disassembly experimental and method studies for ADSM (Active disassembly using smart materials, ADSM) and applied active disassembly structure to Walkman, mobile phones and other small electronic products[1]. But for large electronics, such as LCD TVs, LCD monitors, etc, due to its internal parts and complex work environment, there are very few studies at present. Research shows that the complete disassembly of LCD module is about 2 minutes. It is much more than disassembly time of active disassembly unit 10 seconds. Therefore, there is much great significance to study active disassembly of large electronics.

  • Fabrication of Ferrite-Coated Magnetic Fe-Mn-Si-Cr-Ni Alloy Utilizing Selective Oxidation of Mn Element

    The development of magnetic properties extends application fields of Fe-Mn-Si- based shape memory alloys (SMAs) into the field of electromagnetic sensors and actuators. In the previous studies, magnetic Fe-Mn-Si-based shape memory ribbons have been prepared by the melt-spinning technique. However, the melt- spinning technique could only obtain 2-D thin materials. In this paper, a ferrite-coated Fe-18.81Mn-5.61Si-9.31Cr-5.36Ni bulk shape memory material, exhibiting both magnetic and shape memory functions, was fabricated by means of the oxidation at 1173 K for different times. The ferritic layer was depleted in the Mn element due to the selective oxidation of the Mn element, and its growth behavior followed the parabolic law. Furthermore, we prepared not only ferrite/austenite/ferrite sandwich sheets but also matrix at ferrite core-shell wires in the case of ferrite-coated Fe-18.81Mn-5.61Si-9.31Cr-5.36Ni alloy. The shape recovery ratio of sandwich sheets decreased to 74.1% from 78.3% of the ferrite-free state while their saturation magnetization increased to 7.8 emu/g. The shape recovery ratio of core-shell wires decreased to 54.8% from 78.3% of the ferrite-free state with increasing the saturation magnetization to 36.2 emu/g. For both sandwich sheets and core-shell wires, there is a tradeoff relationship between shape memory effect (SME) and saturation magnetization. Accordingly, it is necessary to strike a balance between their shape memory and magnetic properties according to engineering applications.

  • Intergranular strains in transforming NiTi alloys

    Shape memory alloys (SMAs) exhibit unique thermomechanical properties due to a reversible martensitic phase transformation. Their current high cost and the insufficient predictability of the thermomechanical responses of these materials hinders further growth in their application. Neutron diffraction offers a unique tool to probe the phase transformation of bulk materials in situ during thermal and mechanical loading, allowing the simultaneous monitoring of phase fraction, texture evolution, interphase and intergranular strains. This paper describes the initial results of thermomechanical loading tests of the shape memory material NiTi as it martensitically transforms in complex thermomechanical load cycles. When fully analyzed this experimental data will provide crucial information on the interaction between the transformed and untransformed material, and on the dependence of transformation on grain level orientation.



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