Mixed Mode Interface
144 resources related to Mixed Mode Interface
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The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.
The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE
ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.
The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...
Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.
IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003., 2003
A mixed-mode interface circuit for monolithically integrated gas sensor arrays has been developed. Circuitry includes the heater driver for the temperature control, interface electronics for inspection of up to four sensors array and interface logic for smart control. Because of its characteristics as robustness, small, size, low price and future capabilities with the adequate signal processing the system composed by ...
2014 IEEE International Conference on Advanced Communications, Control and Computing Technologies, 2014
A new IEEE 1451.4 standard for a smart transducer interface defines the concept for adding self-identification technology to traditional analog sensors and actuators. Numerous manufacturers' offers 1451.4 sensors, which are often called TEDS sensors. Tools for the development of these sensors are not yet widely available. In this work, a tool for development of smart sensor fully compliant with the ...
2018 IEEE International Symposium on Circuits and Systems (ISCAS), 2018
Lab on a Chip (LOC) applications are taking the world by storm. This paper proposes a mixed mode interface circuit for LOC applications for Bioimpedance measurement. The interface circuit consists of a low noise instrumentation amplifier and an analog to digital converter. The proposed interface circuit utilizes the benefits of both current mode and voltage mode circuits. The design of ...
2008 IEEE International Symposium on Industrial Electronics, 2008
This paper presents current-mode electronic cells designed for sensor analogue interfacing and conditioning in embedded systems. A digitally programmable element allows modifying the circuit operation, tuning the system behaviour according to changes in the sensor operation and reducing undesired effects as device mismatching. Circuits have been designed to give a good signal transfer, upholding their functions, and reducing load effects ...
2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also ...
IMS 2011 Microapps - Mixed-Signal Active Load Pull - The Fast Track to 3G/4G Amplifier Design
Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing Neuromorphic Mixed-Signal Circuitry for Asynchronous Pulse Processing - Peter Petre: 2016 International Conference on Rebooting Computing
APEC 2012 - Dr. Fred Lee Plenary
An Energy-Efficient Mixed-Signal Neuron for Inherently Error Resilient Neuromorphic Systems - IEEE Rebooting Computing 2017
Computational Intelligence for Brain Computer Interface
Envelope Tracking and Energy Recovery Concepts for RF Switch-mode Power Amplifiers
EMBC 2011-Panel Discussion-Frontiers and Future Trends in Brain-Machine Interface
Mixed Reality - The Future of Our World
Part 2: Mixed Reality Panel - TTM 2018
Ethical Considerations: A Key to Technological Advancement - IEEE TechEthics Virtual Panel
Augmented Reality at the Natural History Museum, London
Brooklyn 5G Summit: Channel Models: Key to 5G Air-Interface Technology
Part 1: Mixed Reality Panel - TTM 2018
Q&A with Nicholas Napp: IEEE Digital Reality Podcast, Episode 5
Radiated Emissions as Function of Common Mode Current - EMC Society Demo
High-Bandwidth Memory Interface Design
Multimodal Telepresent Control of DLR Rollin' JUSTIN
IEEE 125th Anniversary Media Event: Brain-Machine Interface Technology
IEEE @ SXSW 2015 - Mixed Reality Habitats: The New Wired Frontier
A mixed-mode interface circuit for monolithically integrated gas sensor arrays has been developed. Circuitry includes the heater driver for the temperature control, interface electronics for inspection of up to four sensors array and interface logic for smart control. Because of its characteristics as robustness, small, size, low price and future capabilities with the adequate signal processing the system composed by the sensor and the application specific integrated circuit would be able to cover most of today markets considered for gas sensors.
A new IEEE 1451.4 standard for a smart transducer interface defines the concept for adding self-identification technology to traditional analog sensors and actuators. Numerous manufacturers' offers 1451.4 sensors, which are often called TEDS sensors. Tools for the development of these sensors are not yet widely available. In this work, a tool for development of smart sensor fully compliant with the IEEE1451.4 standard is developed. Mixed-mode interface with auto detection of One-wire memory device has been developed by the use of Amicus Board which has PIC 18F25K20 microcontroller. To demonstrate the functionality and efficiency of developed tool, bridge sensor (load cell) is implemented and also analog temperature sensor is converted to smart transducer for Industrial automation. Details of sensor implementation and test results are presented. To validate, a smart transducer controller is made and tested.
Lab on a Chip (LOC) applications are taking the world by storm. This paper proposes a mixed mode interface circuit for LOC applications for Bioimpedance measurement. The interface circuit consists of a low noise instrumentation amplifier and an analog to digital converter. The proposed interface circuit utilizes the benefits of both current mode and voltage mode circuits. The design of the instrumentation amplifier uses a second-generation current conveyor to provide the low noise and high gain required to acquire the weak signal from the electrodes. The IA provides a maximum gain of 55.6 dB with 2 MHz bandwidth. A second order Sigma Delta Modulator with a maximum sampling rate of 128 MS/s provides the output digital bit stream capable of reaching a resolution of 11 bits for an input sinusoidal with 50 kHz frequency. The use of a buffered comparator allows the relaxation on the slew rate requirement while maintaining a high sampling rate. The full system power consumption is 5.5 mW with a chip area of only 0.0153 mm2.
This paper presents current-mode electronic cells designed for sensor analogue interfacing and conditioning in embedded systems. A digitally programmable element allows modifying the circuit operation, tuning the system behaviour according to changes in the sensor operation and reducing undesired effects as device mismatching. Circuits have been designed to give a good signal transfer, upholding their functions, and reducing load effects due to interconnecting them to build a conditioning architecture. Finally, a study of perturbative learning strategies for mixed mode tunable circuits is presented.
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the crack propagates under mixed mode conditions. The present study deals with delamination toughness measurements of an epoxy molding compound - copper lead frame interface as directly obtained from a real production process. As a consequence the specimen dimensions are relatively small and therefore a dedicated small-size test set-up was designed and fabricated. The test setup allows transferring two separated loadings (mode I and mode II) on a single specimen. The setup is flexible and adjustable for measuring specimens with various dimensions. For measurements under various temperatures and moisture conditions, a special climate chamber is designed. The ldquocurrent crack lengthrdquo is required for the interpretation of measurement results through FEM-fracture mechanics simulations. Therefore, during testing the ldquocurrent crack lengthrdquo is captured using a CCD camera and a micro deformation analysis system (MicroDac). The critical fracture properties are obtained by interpreting the experimental results through dedicated finite element modeling.
The techniques used in the iSPLICE3 simulator for the analysis of mixed analog/digital circuits are described. iSPLICE3 combines circuit, switch-level timing, and logic simulation modes and uses event driven selective-trace techniques. It also uses a hierarchical schematic capture package called iSPI (Simulation Program Interface) for design entry, circuit partitioning, and simulation control. The contributions here include a new DC solution method, a mixed-mode interface modeling technique, and an automatic partitioning approach for MOS logic circuits. The details of these three methods are provided, along with the architecture and transient simulation algorithms used in iSPLICE3. The results of circuit simulations and mixed-mode simulations of a CMOS static RAM, two A/D converters, and a phase-locked loop are presented. These results indicate that iSPLICE3 is between one and two orders of magnitude faster than SPICE2 with negligible loss in accuracy.<<ETX>>
Analog transducers (sensors or actuators) are widely used in industry. The Institute of Electrical and Electronics Engineers (IEEE) 1451.4 standard defines a mixed-mode communication protocol and the Transducer Electronic Data Sheet (TEDS) formats for analog transducers. This standard enables the plug- and-play capability of analog transducers and easy integration of analog transducers with measurement and control systems. This paper describes a prototype of the IEEE 1451.4 one-wire interface for analog transducers. The prototype system developed at the National Institute of Standards and Technology (NIST) consists of an IEEE 1451.4-based transducer, a one-wire interface board, and a single board computer (SBC). An example of reading the IEEE 1451.4 TEDS from an IEEE 1451.4-compatible accelerometer is provided to illustrate system functionality.
A simulator called iSPLICE3 is described for the analysis of mixed analog/digital circuits is described. It combines electrical, switch-level timing and logic simulation modes using event-driven selective-trace techniques. This simulator features a hierarchical schematic capture package called iSPI for design entry and simulation control. It uses a novel approach to improve the speed and robustness of the DC solution. The details of the simulator architecture, circuit partitioning, mixed-mode interface, and event scheduling are provided along with the results of mixed-mode simulations of a recently designed memory circuit
The latest enhancements to NanoTCAD mixed-mode software package, combining 3D physics-based nano-scale device models and unique mixed-mode interface to the Cadence Spectre circuit simulator, have enabled simulations and in-operation analysis of ionizing radiation single event effects (SEEs) in modern high- speed SiGe BiCMOS technologies and integrated circuits. Additionally, the NanoTCAD new, automated interface to Geant4 radiation models and the 3D solver capability to model very low temperature behavior, enable a comprehensive and accurate modeling of radiation effects in nano-scale systems, in the extreme radiation and temperature environments of space. Example simulations of SEEs affecting digital output of a 7.2GHz mixed-signal circuit are presented. Our mixed-mode modeling results compare very well with experimental data.
A prototype is described which combines the TEDS-only (-4) and point-to-point serial (-2) versions of the IEEE 1451 standard. The standard, now being renamed the ISO/IEC/IEEE 21451-x smart transducer standards, provides a protocol which permits autoconfiguration (plug and play) and interoperability without operator intervention implemented. The Transducer Electronic Data Sheet (TEDS) is a key feature. While the TEDS-only version has achieved significant acceptance, there are drawbacks to the standard as it stands because it does not specify the digital data format and the TEDS format differs from the rest of the 1451 standard. Specifically, the ISO/IEC/ IEEE 21451-4 Mixed Mode Interface Smart Transducer Standard has a Plug and Play Sensor which includes a TEDS (Transducer Electronic Data Sheet). It is connected through the Mixed-Mode Interface (MMI) to an external data acquisition system whose specification are not specified by the standard. However, the ISO/IEC/IEEE 21450 Smart Transducer Standard does specify the digital data format in detail. Specifically described here is a prototype of the ISO/IEC/IEEE 21451-2 standard for point-to-point serial communication. It consists of a Transducer Interface Module (TIM) and a Network Capable Application Processor (NCAP). The TIM has a transducer (sensor or actuator), associated analog signal conditioner, analog-to-digital converter, TEDS, microcomputer and physical layer driver (RS232). The prototype consists of an NCAP (gateway) connected to a -2 style TIM which has with several -4 ports. The format of the -4 and -2 are differ significantly. Data from the TIM via the NCAP as seen from the Internet must have the 21450 format so that it is necessary to translate the -4 TEDS. An optional “virtual TEDS” is stored at an Internet site. The TEDS on the TIM stores only the address of the TEDS in addition to the Basic TEDS.
This project will establish a standard that allows analog transducers to communicate digital information with an IEEE 1451 object. The standard will define the protocol and interface. It will also define the format of the transducer TEDS. The transducer TEDS will be based on the IEEE 1451.2 TEDS. The standard will not specify the transducer design, signal conditioning, or the ...