Working Group Meeting 1: 2021 IEEE Heterogeneous Integration Roadmap
Working Group Meeting 4: 2021 IEEE Heterogeneous Integration Roadmap
Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones
Architectures & Business Aspects of Heterogeneous Integration
HIR Chiplet Workshop: Architectures and Business Aspects for Heterogeneous Integration
Wrap-up and Charge to Heterogeneous Integration Roadmap Teams
How the Semiconductor Research Corporation (SRC) is Leading Research in Packaging
The Future is Heterogeneous Integration: The HI Roadmap 2021 Edition
Working Group Meeting 2: 2021 IEEE Heterogeneous Integration Roadmap
Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap
Reimagining Co-design of HPC Systems for a Heterogeneous Future
Thermal Sciences for the Heterogeneous Future
21st-Century Nano System for Abundant Data Computing
Wrap-up & Charge to the Heterogeneous Integration Roadmap Teams
IEEE Heterogeneous Integration Roadmap: HIR 2020 Retrospective
The Future of Microelectronics After the Pandemic
The Roaring 20s: A Renaissance for the Semiconductor Industry
More links
