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1,897 resources related to

Semiconductor Device Packaging

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Top Conferences on Semiconductor Device Packaging

2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

2021 IEEE International Reliability Physics Symposium (IRPS)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

2019 IEEE Aerospace Conference

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2019 IEEE Workshop on Microelectronics and Electron Devices (WMED)

2019 IEEE International Ultrasonics Symposium (IUS)

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON)

2019 93rd ARFTG Microwave Measurement Conference (ARFTG)

2019 International Interconnect Technology Conference (IITC)

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

2018 19th International Conference on Electronic Packaging Technology (ICEPT)

2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2018 7th Electronic System-Integration Technology Conference (ESTC)

2018 13th European Microwave Integrated Circuits Conference (EuMIC)

ESSDERC 2018 - 48th European Solid-State Device Research Conference (ESSDERC)

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2009 IEEE International Conference on Portable Information Devices (PORTABLE)

Polytronic 2008 - IEEE 7th International Conference on Polymers and Adhesives in Microelectronics and Photonics *HELD JOINTLY with Portable #13518*

2007 Power Conversion Conference - Nagoya (PCC)

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Xplore Articles related to Semiconductor Device Packaging

An electrical design methodology for multi-chip modules

Assembly Level Reliability

"Static Or Dynamic", The Selection Process For A Memory System

An Integrated High Performance Mixed Signal IF-to-Digital Converter

FormFactor introduces an integrated process for wafer-level packaging, burn-in test, and module level assembly

VIA/BGA/sup (R)/: a low-cost, high-performance packaging technology for broadband telecommunications

Semiconductor perspective on test standards

Studies on the Possibilities of In-Line Die Attach Characterization of Semiconductor Devices

Finite element simulation of the temperature cycling tests

Package hermeticity testing with thermal transient measurements

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E-books related to Semiconductor Device Packaging

An electrical design methodology for multi-chip modules

Assembly Level Reliability

"Static Or Dynamic", The Selection Process For A Memory System

An Integrated High Performance Mixed Signal IF-to-Digital Converter

FormFactor introduces an integrated process for wafer-level packaging, burn-in test, and module level assembly

VIA/BGA/sup (R)/: a low-cost, high-performance packaging technology for broadband telecommunications

Semiconductor perspective on test standards

Studies on the Possibilities of In-Line Die Attach Characterization of Semiconductor Devices

Finite element simulation of the temperature cycling tests

Package hermeticity testing with thermal transient measurements

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Most published Xplore authors for Semiconductor Device Packaging

J.N. Calata

J.G. Bai

Xingsheng Liu

Sihua Wen

Guo-Quan Lu

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