117 resources related to

Packaging And Interconnections

Top Conferences on Packaging And Interconnections

2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

2022 59th ACM/IEEE Design Automation Conference (DAC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 IEEE International Electron Devices Meeting (IEDM)

2021 IEEE CPMT Symposium Japan (ICSJ)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME)

2019 IEEE 62nd International Midwest Symposium on Circuits and Systems (MWSCAS)

2019 IEEE International Reliability Physics Symposium (IRPS)

2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC)

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)

2018 13th European Microwave Integrated Circuits Conference (EuMIC)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2018 IEEE International Interconnect Technology Conference (IITC)

2018 International Conference on IC Design & Technology (ICICDT)

2018 Asia-Pacific Microwave Conference (APMC)

2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

2017 19th International Conference on Transparent Optical Networks (ICTON)

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)

2017 Conference on Lasers and Electro-Optics (CLEO)

2017 IEEE 13th Malaysia International Conference on Communications (MICC)

2017 Eleventh IEEE/ACM International Symposium on Networks-on-Chip (NOCS)

2016 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting

2015 IEEE Energy Conversion Congress and Exposition

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014

2013 International Semiconductor Conference Dresden - Grenoble (ISCDG)

2013 36th International Spring Seminar on Electronics Technology (ISSE)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2013 Brazilian Power Electronics Conference (COBEP 2013)

2013 NORCHIP

2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS 2011)

2009 3rd International Conference on Signals, Circuits and Systems (SCS 2009)

2009 20th International Zurich Symposium on Electromagnetic Compatibility

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

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Xplore Articles related to Packaging And Interconnections

Thin Film **Packaging and Interconnections**: The Development of a Packaging Philosophy

Intelligent design automation of VLSI interconnects

High speed digital computer implementation techniques

A Method to Determine Wide Bandgap Power Devices Packaging Interconnections

Air Bridge Based Planar Hybrid Technology for Microwave and Millimeterwave Applications

Air bridge based planar hybrid technology for microwave and millimeterwave applications

Performance of a GaN Half Bridge Switching Cell with Substrate Integrated Chips

3D hybrid integration and functional interconnection of a power transistor and its gate driver

High-temperature endurable encapsulation material

Modeling of multiconductor systems for packaging and interconnecting high- speed digital IC's

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Periodicals related to Packaging And Interconnections

Advanced Packaging, IEEE Transactions on

Antennas and Propagation, IEEE Transactions on

Applied Superconductivity, IEEE Transactions on

Circuits and Systems Magazine, IEEE

Components and Packaging Technologies, IEEE Transactions on

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Computers, IEEE Transactions on

Dependable and Secure Computing, IEEE Transactions on

Design & Test of Computers, IEEE

Device and Materials Reliability, IEEE Transactions on

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Industrial Informatics, IEEE Transactions on

Industry Applications, IEEE Transactions on

Instrumentation & Measurement Magazine, IEEE

Instrumentation and Measurement, IEEE Transactions on

Lightwave Technology, Journal of

Magnetics, IEEE Transactions on

Microelectromechanical Systems, Journal of

Microwave and Wireless Components Letters, IEEE

Microwave Theory and Techniques, IEEE Transactions on

Photonics Technology Letters, IEEE

Power Delivery, IEEE Transactions on

Power Electronics, IEEE Transactions on

Power Systems, IEEE Transactions on

Proceedings of the IEEE

Quantum Electronics, IEEE Journal of

Reliability, IEEE Transactions on

Selected Topics in Quantum Electronics, IEEE Journal of

Semiconductor Manufacturing, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Packaging And Interconnections

Panel‐Level Packaging for Heterogenous Integration

Integrated Fan‐Out (InFO) for High Performance Computing

SWIFT® Semiconductor Packaging Technology

Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations

Embedded Multi‐die Interconnect Bridge (EMIB)

History of Embedded and Fan‐Out Packaging Technology

Die Integration Technologies on Advanced Substrates Including Embedding and Cavities

State‐of‐the‐Art IC Packages, Modules, and Substrates

Optical Interconnects

Interconnection Technology Innovations in 2.5D Integrated Electronic Systems

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Courses related to Packaging And Interconnections

Understanding On-Chip Transmission Lines - Part 1 (Archived)

RF Passives on Silicon--The Intended and the Unintended

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Standards related to Packaging And Interconnections

Standard for High Frequency Characterization for Low Temperature Co-Fired Ceramic (LTCC)Materials

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Top Organizations on Packaging And Interconnections

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Electron Devices

Electronic Design Automation, Council on

Industrial Electronics

Industry Applications

Instrumentation & Measurement

Magnetics

Microwave Theory & Techniques

Photonics

Power & Energy

Power Electronics

Reliability

Robotics & Automation

Sensors Council

Signal Processing

Solid State Circuits

Systems, Man & Cybernetics

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Packaging And Interconnections

Shin-Yueh Yang

Shih-Ying Chiang

Chan-Yen Chou

Ming-Chih Yew

Kuo-Ning Chiang

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Packaging And Interconnections

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Xplore Articles related to Packaging And Interconnections

Periodicals related to Packaging And Interconnections

E-books related to Packaging And Interconnections

Courses related to Packaging And Interconnections

Standards related to Packaging And Interconnections

Top Organizations on Packaging And Interconnections

Most published Xplore authors for Packaging And Interconnections