2,693 resources related to

Grain boundaries

Top Conferences on Grain boundaries

2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

2022 IEEE 22nd International Conference on Nanotechnology (NANO)

2022 IEEE International Symposium on Applications of Ferroelectrics (ISAF)

2022 IEEE International Reliability Physics Symposium (IRPS)

2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)

2022 IEEE International Conference on Mechatronics and Automation (ICMA)

2022 23rd International Vacuum Electronics Conference (IVEC)

2022 IEEE International Interconnect Technology Conference (IITC)

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

2021 20th International Workshop on Junction Technology (IWJT)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2021 34th International Vacuum Nanoelectronics Conference (IVNC)

2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

2021 13th Spanish Conference on Electron Devices (CDE)

2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

2021 IEEE 48th Photovoltaic Specialists Conference (PVSC)

2021 IEEE International Magnetic Conference (INTERMAG)

2021 IEEE 32nd International Conference on Microelectronics (MIEL)

2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

IGARSS 2020 - 2020 IEEE International Geoscience and Remote Sensing Symposium

2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

2018 IEEE 8th International Nanoelectronics Conferences (INEC)

SC18: International Conference for High Performance Computing, Networking, Storage and Analysis

2018 19th International Symposium on Quality Electronic Design (ISQED)

2018 IEEE Symposium on VLSI Technology

2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC)

2017 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

2017 IEEE International Integrated Reliability Workshop (IIRW)

2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

2017 75th Device Research Conference (DRC)

2014 IEEE International Conference on Oxide Materials for Electronic Engineering (OMEE)

2013 Fifth International Conference on Measuring Technology and Mechatronics Automation (ICMTMA)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)

2011 3rd International Conference on Advanced Computer Control (ICACC)

2011 International Semiconductor Device Research Symposium (ISDRS)

2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems (ELECTRO-2009)

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Xplore Articles related to Grain boundaries

Effect of hot carrier stress on the performance, trap densities and transient behavior of SLS ELA TFTs

A novel sub-10 nm transistor

Correlation between grain composition and charge carrier collection in Cu(In,Ga)Se2 solar cells

Resistance Increase in Metal Nano-wires

The impact of scaling-down oxide thickness on poly-Si thin-film transistors' I-V characteristics

Multilayered ${\rm MgB}_{2}/{\rm B}$ Thin Films Prepared by Electron Beam Evaporation Technique

Conduction properties of CaCu3Ti4O12

Effect of antimony on magnetic properties in non-oriented 2.4 wt% Si electrical sheets

Three terminal YBaCuO Josephson device with quasi-particle injection gate

Residual resistivity model and its application

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Periodicals related to Grain boundaries

Applied Superconductivity, IEEE Transactions on

Device and Materials Reliability, IEEE Transactions on

Dielectrics and Electrical Insulation, IEEE Transactions on

Display Technology, Journal of

Electrical Insulation Magazine, IEEE

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Geoscience and Remote Sensing, IEEE Transactions on

Image Processing, IEEE Transactions on

Lightwave Technology, Journal of

Magnetics, IEEE Transactions on

Microwave Magazine, IEEE

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Plasma Science, IEEE Transactions on

Proceedings of the IEEE

Quantum Electronics, IEEE Journal of

Reliability, IEEE Transactions on

Semiconductor Manufacturing, IEEE Transactions on

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

Visualization and Computer Graphics, IEEE Transactions on

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E-books related to Grain boundaries

A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties

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Top Organizations on Grain boundaries

Aerospace & Electronics Systems

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Dielectrics & Electrical Insulation

Electron Devices

Geoscience & Remote Sensing

Instrumentation & Measurement

Magnetics

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Reliability

Signal Processing

Solid State Circuits

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Grain boundaries

Tatyana Rodionova

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Grain boundaries

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Top Conferences on Grain boundaries

Top Videos on Grain boundaries

Xplore Articles related to Grain boundaries

Periodicals related to Grain boundaries

E-books related to Grain boundaries

Top Organizations on Grain boundaries

Most published Xplore authors for Grain boundaries