159 resources related to
Flip chip solder joints
Top Conferences on Flip chip solder joints
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2021 18th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON)
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)
2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
2018 IEEE 7th International Conference on Adaptive Science & Technology (ICAST)
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
2018 12th International Conference on Reliability, Maintainability, and Safety (ICRMS)
2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)
2012 International Symposium on Optomechatronic Technologies (ISOT 2012)
2009 IEEE International Conference on Portable Information Devices (PORTABLE)
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Xplore Articles related to Flip chip solder joints
Periodicals related to Flip chip solder joints
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Most published Xplore authors for Flip chip solder joints
H. Balkan
D. Patterson
G. Burgess
C. Carlson
P. Elenius
M. Johnson
B. Rooney
J. Sanchez
D. Stepniak
J. Wood
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