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Flip chip

Top Conferences on Flip chip

2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

2023 IEEE International Solid- State Circuits Conference (ISSCC)

2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

2022 59th ACM/IEEE Design Automation Conference (DAC)

2022 IEEE Radio and Wireless Symposium (RWS)

2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 28th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2021 IEEE International Electron Devices Meeting (IEDM)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 IEEE Asia-Pacific Microwave Conference (APMC)

2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

2019 IEEE International Symposium on High Performance Computer Architecture (HPCA)

2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)

2019 IEEE Photonics Conference (IPC)

2018 IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS)

2018 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)

2018 IEEE International Symposium on Circuits and Systems (ISCAS)

2018 19th International Symposium on Quality Electronic Design (ISQED)

2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)

2018 7th Electronic System-Integration Technology Conference (ESTC)

2018 23rd Opto-Electronics and Communications Conference (OECC)

2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)

2018 12th International Conference on Reliability, Maintainability, and Safety (ICRMS)

2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

2017 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

2017 12th European Microwave Integrated Circuits Conference (EuMIC)

ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference (ESSCIRC)

2017 24th IEEE International Conference on Electronics, Circuits and Systems (ICECS)

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)

2016 IEEE International Symposium on Assembly and Manufacturing (ISAM)

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference

2016 International Symposium on Integrated Circuits (ISIC)

2015 6th Asia Symposium on Quality Electronic Design (ASQED)

2012 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications (IMWS)

2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS 2011)

Polytronic 2008 - IEEE 7th International Conference on Polymers and Adhesives in Microelectronics and Photonics *HELD JOINTLY with Portable #13518*

2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)

2007 26th International Conference on Thermoelectrics (ICT 2007)

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Xplore Articles related to Flip chip

Electromigration in **Flip Chip** Pb-Free Solder Joints

Failure modes of Sn3.0Ag0.5Cu flip-chip solder joints under current stress

Electromigration Characteristic of SnAg $_{3.0}$Cu $_{0.5}$ **Flip Chip** Interconnection

Electrical characteristics of fine pitch **flip chip** solder joints fabricated using low temperature solders

Solder paste reflow modeling for **flip chip** assembly

A study of electromigration in 3D **flip chip** solder joint using numerical simulation of heat flux and current density

Creep and crack propagation in **flip chip** SnPb37 solder joints

New failure mode induced by electric current in **flip chip** solder joint

Assembly and reliability of **flip chip** solder joints using miniaturized Au/Sn bumps

Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages

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Periodicals related to Flip chip

Advanced Packaging, IEEE Transactions on

Aerospace and Electronic Systems Magazine, IEEE

Applied Superconductivity, IEEE Transactions on

Components and Packaging Technologies, IEEE Transactions on

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Design & Test of Computers, IEEE

Device and Materials Reliability, IEEE Transactions on

Display Technology, Journal of

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Industrial Electronics, IEEE Transactions on

Lightwave Technology, Journal of

Microelectromechanical Systems, Journal of

Microwave and Wireless Components Letters, IEEE

Microwave Theory and Techniques, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Photonics Technology Letters, IEEE

Reliability, IEEE Transactions on

Selected Topics in Quantum Electronics, IEEE Journal of

Signal Processing, IEEE Transactions on

Solid-State Circuits, IEEE Journal of

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to Flip chip

Interconnects

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Courses related to Flip chip

SRAM Design - Overview and Memory Cell Division

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Top Organizations on Flip chip

Aerospace & Electronics Systems

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Electron Devices

Electronic Design Automation, Council on

Industrial Electronics

Instrumentation & Measurement

Microwave Theory & Techniques

Nuclear & Plasma Science

Photonics

Reliability

Robotics & Automation

Signal Processing

Solid State Circuits

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for Flip chip

P. H. Tsao

Steven Hsu

Y. L. Kuo

J. H. Chen

Abel Chang

H. P. Pu

L. H. Chu

M. J. Lii

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Xplore Articles related to Flip chip

Periodicals related to Flip chip

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Courses related to Flip chip

Top Organizations on Flip chip

Most published Xplore authors for Flip chip