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2,884 resources related to
Flip chip
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Top Conferences on Flip chip
2023 IEEE International Solid- State Circuits Conference (ISSCC)
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2022 59th ACM/IEEE Design Automation Conference (DAC)
2022 IEEE Radio and Wireless Symposium (RWS)
2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
2021 28th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
2021 IEEE International Electron Devices Meeting (IEDM)
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
2021 IEEE Asia-Pacific Microwave Conference (APMC)
2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
2019 IEEE International Symposium on High Performance Computer Architecture (HPCA)
2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
2019 IEEE Photonics Conference (IPC)
2018 IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS)
2018 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)
2018 IEEE International Symposium on Circuits and Systems (ISCAS)
2018 19th International Symposium on Quality Electronic Design (ISQED)
2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)
2018 7th Electronic System-Integration Technology Conference (ESTC)
2018 23rd Opto-Electronics and Communications Conference (OECC)
2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)
2018 12th International Conference on Reliability, Maintainability, and Safety (ICRMS)
2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)
2017 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)
2017 12th European Microwave Integrated Circuits Conference (EuMIC)
ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference (ESSCIRC)
2017 24th IEEE International Conference on Electronics, Circuits and Systems (ICECS)
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation andExperiments in Microelectronics and Microsystems (EuroSimE)
2016 IEEE International Symposium on Assembly and Manufacturing (ISAM)
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference
2016 International Symposium on Integrated Circuits (ISIC)
2015 6th Asia Symposium on Quality Electronic Design (ASQED)
2012 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications (IMWS)
2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS 2011)
Polytronic 2008 - IEEE 7th International Conference on Polymers and Adhesives in Microelectronics and Photonics *HELD JOINTLY with Portable #13518*
2007 International Symposium on High Density Design Packaging and Microsystem Integration (HDP)
2007 26th International Conference on Thermoelectrics (ICT 2007)
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Top Videos on Flip chip
IMS 2014:Flip Chip Assembly for Sub-millimeter Wave Amplifier MMIC on Polyimide Substrate
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
Flip Chip Interconnection and Its Applications
Kathleen Muhonen - RFIC Industry Showcase - IMS 2020
On-Shoring The Next Generation Of Advanced Packaging
Recent Advances And Trends In Advanced Packaging
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Xplore Articles related to Flip chip
Electromigration in **Flip Chip** Pb-Free Solder Joints
Failure modes of Sn3.0Ag0.5Cu flip-chip solder joints under current stress
Electromigration Characteristic of SnAg $_{3.0}$Cu $_{0.5}$ **Flip Chip** Interconnection
Electrical characteristics of fine pitch **flip chip** solder joints fabricated using low temperature solders
Solder paste reflow modeling for **flip chip** assembly
A study of electromigration in 3D **flip chip** solder joint using numerical simulation of heat flux and current density
Creep and crack propagation in **flip chip** SnPb37 solder joints
New failure mode induced by electric current in **flip chip** solder joint
Assembly and reliability of **flip chip** solder joints using miniaturized Au/Sn bumps
Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages
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Periodicals related to Flip chip
Advanced Packaging, IEEE Transactions on
Aerospace and Electronic Systems Magazine, IEEE
Applied Superconductivity, IEEE Transactions on
Components and Packaging Technologies, IEEE Transactions on
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Design & Test of Computers, IEEE
Device and Materials Reliability, IEEE Transactions on
Display Technology, Journal of
Electron Device Letters, IEEE
Electron Devices, IEEE Transactions on
Electronics Packaging Manufacturing, IEEE Transactions on
Industrial Electronics, IEEE Transactions on
Lightwave Technology, Journal of
Microelectromechanical Systems, Journal of
Microwave and Wireless Components Letters, IEEE
Microwave Theory and Techniques, IEEE Transactions on
Nuclear Science, IEEE Transactions on
Photonics Technology Letters, IEEE
Reliability, IEEE Transactions on
Selected Topics in Quantum Electronics, IEEE Journal of
Signal Processing, IEEE Transactions on
Solid-State Circuits, IEEE Journal of
Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
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E-books related to Flip chip
Interconnects
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Courses related to Flip chip
SRAM Design - Overview and Memory Cell Division
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Top Organizations on Flip chip
Aerospace & Electronics Systems
Circuits & Systems
Communications
Components, Packaging & Manufacturing Tech
Computer
Electron Devices
Electronic Design Automation, Council on
Industrial Electronics
Instrumentation & Measurement
Microwave Theory & Techniques
Nuclear & Plasma Science
Photonics
Reliability
Robotics & Automation
Signal Processing
Solid State Circuits
Ultrasonics, Ferroelectrics & Frequency Control
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Most published Xplore authors for Flip chip
P. H. Tsao
Steven Hsu
Y. L. Kuo
J. H. Chen
Abel Chang
H. P. Pu
L. H. Chu
M. J. Lii
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