104 resources related to

3d-integration Packaging Technologies

Top Conferences on 3d-integration Packaging Technologies

2022 IEEE International Solid- State Circuits Conference (ISSCC)

2021 51st European Microwave Conference (EuMC)

2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)

2022 23rd International Symposium on Quality Electronic Design (ISQED)

2022 IEEE International Reliability Physics Symposium (IRPS)

2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

2022 59th ACM/IEEE Design Automation Conference (DAC)

2021 16th European Microwave Integrated Circuits Conference (EuMIC)

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2022 IEEE International Electron Devices Meeting (IEDM)

2022 IEEE International Memory Workshop (IMW)

2022 IEEE International Interconnect Technology Conference (IITC)

2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

2021 IEEE International 3D Systems Integration Conference (3DIC)

2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2021 International Conference on IC Design and Technology (ICICDT)

2021 IEEE Asia-Pacific Microwave Conference (APMC)

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

2019 IEEE Energy Conversion Congress and Exposition (ECCE)

2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

2018 IEEE Custom Integrated Circuits Conference (CICC)

2018 20th International Conference on Electronic Materials and Packaging (EMAP)

2018 31st IEEE International System-on-Chip Conference (SOCC)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)

2018 IEEE 36th VLSI Test Symposium (VTS)

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

2018 International Conference on Optical MEMS and Nanophotonics (OMN)

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

2017 IEEE Microwaves, Radar and Remote Sensing Symposium (MRRS)

2017 International Conference on Optimization of Electrical and Electronic Equipment (OPTIM) & 2017 Intl Aegean Conference on Electrical Machines and Power Electronics (ACEMP)

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM

2017 IEEE 12th International Conference on ASIC (ASICON)

2017 IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH)

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS)

2016 IEEE 8th International Power Electronics and Motion Control Conference (IPEMC 2016 - ECCE Asia)

2015 14th International Conference on Computer-Aided Design and Computer Graphics (CAD/Graphics)

2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014

2013 International Semiconductor Conference Dresden - Grenoble (ISCDG)

2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2013 IEEE International Integrated Reliability Workshop (IIRW)

2013 International Conference on Communications, Circuits and Systems (ICCCAS)

2013 Brazilian Power Electronics Conference (COBEP 2013)

2012 Symposium on Photonics and Optoelectronics (SOPO 2012)

2012 International Symposium on Signals, Systems and Electronics (ISSSE)

2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS)

2011 IEEE 6th International Design and Test Workshop (IDT)

2011 Symposium on VLSI Technology

2010 SC - International Conference for High Performance Computing, Networking, Storage and Analysis

2010 19th Asian Test Symposium (ATS)

2010 IEEE International Symposium Antennas and Propagation and CNC/USNC/URSI Radio Science Meeting

2010 International Conference on Microelectronics (ICM)

2009 3rd International Conference on Signals, Circuits and Systems (SCS 2009)

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Xplore Articles related to 3d-integration Packaging Technologies

Large area mold embedding technology with PCB based redistribution

From wafer level to panel level mold embedding

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Periodicals related to 3d-integration Packaging Technologies

Advanced Packaging, IEEE Transactions on

Circuits and Systems Magazine, IEEE

Components and Packaging Technologies, IEEE Transactions on

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Device and Materials Reliability, IEEE Transactions on

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Microelectromechanical Systems, Journal of

Parallel and Distributed Systems, IEEE Transactions on

Power Electronics, IEEE Transactions on

Proceedings of the IEEE

Semiconductor Manufacturing, IEEE Transactions on

Solid-State Circuits, IEEE Journal of

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

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E-books related to 3d-integration Packaging Technologies

NEPES’ Fan‐Out Packaging Technology from Single die, SiP to Panel‐Level Packaging

Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations

Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

Interconnection Technology Innovations in 2.5D Integrated Electronic Systems

Input/Output Interconnect Networks for Gigascale Systems

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Top Organizations on 3d-integration Packaging Technologies

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computer

Electromagnetic Compatibility

Electron Devices

Electronic Design Automation, Council on

Industrial Electronics

Member and Geographic Activities

Microwave Theory & Techniques

Photonics

Power & Energy

Power Electronics

Reliability

Robotics & Automation

Signal Processing

Solid State Circuits

Technical Activities Board

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Most published Xplore authors for 3d-integration Packaging Technologies

Stéphane Elisabeth

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3d-integration Packaging Technologies

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Top Conferences on 3d-integration Packaging Technologies

Xplore Articles related to 3d-integration Packaging Technologies

Periodicals related to 3d-integration Packaging Technologies

E-books related to 3d-integration Packaging Technologies

Top Organizations on 3d-integration Packaging Technologies

Most published Xplore authors for 3d-integration Packaging Technologies