2,827 resources related to

3d Integration

Top Conferences on 3d Integration

2021 International Conference on IC Design and Technology (ICICDT)

2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2021 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

2021 Symposium on VLSI Technology

2021 IEEE International Electron Devices Meeting (IEDM)

2021 IEEE International Interconnect Technology Conference (IITC)

2021 IEEE International 3D Systems Integration Conference (3DIC)

2021 58th ACM/IEEE Design Automation Conference (DAC)

2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

Global Oceans 2020: Singapore - U.S. Gulf Coast

2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

IECON 2020 - 46th Annual Conference of the IEEE Industrial Electronics Society

2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

2019 IEEE 15th International Conference on Automation Science and Engineering (CASE)

2019 IEEE 16th International Symposium on Biomedical Imaging (ISBI)

2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

2018 IEEE 36th VLSI Test Symposium (VTS)

2018 IEEE International Symposium on Circuits and Systems (ISCAS)

2018 IEEE Symposium on VLSI Circuits

2018 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

2018 IEEE Intelligent Vehicles Symposium (IV)

2018 IEEE 8th International Nanoelectronics Conferences (INEC)

2018 19th International Symposium on Quality Electronic Design (ISQED)

2018 24th International Conference on Pattern Recognition (ICPR)

2018 7th Electronic System-Integration Technology Conference (ESTC)

2018 31st International Conference on VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID)

2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)

2018 Design, Automation & Test in Europe Conference & Exhibition (DATE)

2018 IEEE International Test Conference (ITC)

2018 IEEE Custom Integrated Circuits Conference (CICC)

2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)

2018 IEEE International Conference on Information Reuse and Integration (IRI)

2017 23rd International Conference on Virtual System & Multimedia (VSMM)

ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC)

2017 International Conference on High Performance Computing & Simulation (HPCS)

2017 Fourth HCT Information Technology Trends (ITT)

2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI)

2017 IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC)

2017 IEEE 20th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS)

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

2017 International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)

2017 14th International Multi-Conference on Systems, Signals & Devices (SSD)

2017 International Conference on Optimization of Electrical and Electronic Equipment (OPTIM) & 2017 Intl Aegean Conference on Electrical Machines and Power Electronics (ACEMP)

2017 IEEE Symposium on 3D User Interfaces (3DUI)

2017 IEEE 26th Asian Test Symposium (ATS)

2017 Conference on Lasers and Electro-Optics (CLEO)

2017 IEEE-RAS 17th International Conference on Humanoid Robotics (Humanoids)

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

2017 Integrated Nonlinear Microwave and Millimetre-wave Circuits Workshop (INMMiC)

2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

2017 7th IEEE International Symposium on Microwave, Antenna, Propagation, and EMC Technologies (MAPE)

2017 IEEE 35th International Conference on Computer Design (ICCD)

2017 IEEE International Conference on Mechatronics (ICM)

2017 3DTV Conference: The True Vision - Capture, Transmission and Display of 3D Video (3DTV-CON)

2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

2016 International Conference on Audio, Language and Image Processing (ICALIP)

2015 IEEE 39th Annual Computer Software and Applications Conference Workshop (COMPSACW)

2015 2nd IEEE International Conference on Spatial Data Mining and Geographical Knowledge Services (ICSDM)

2014 IEEE Symposium Series on Computational Intelligence (SSCI)

2013 5th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI)

ESSCIRC 2013 - 39th European Solid State Circuits Conference

2013 IEEE 15th International Symposium and Exhibition onAdvanced Packaging Materials (APM)

2013 IEEE International Solid-State Circuits Conference - (ISSCC)

2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)

2013 Brazilian Power Electronics Conference (COBEP 2013)

2012 3rd International Conference on Mechanic Automation and Control Engineering (MACE)

2012 IEEE International Conference on Robotics and Biomimetics (ROBIO)

2012 International Conference on Devices, Circuits and Systems (ICDCS)

2012 European Microwave Conference (EuMC)

2012 IEEE International Conference on Automation and Logistics (ICAL)

2012 IEEE International Conference on Wireless Information Technology and Systems (ICWITS)

2012 13th International Workshop on Cellular Nanoscale Networks and their Applications (CNNA 2012)

2011 Third International Workshop on Quality of Multimedia Experience (QoMEX 2011)

2011 IEEE International Symposium on Multimedia (ISM)

2011 International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT)

2011 IEEE International Ultrasonics Symposium (IUS)

2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI)

2011 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)

2011 5th IEEE International Conference on E-Learning in Industrial Electronics (ICELIE)

2011 International Symposium on Low Power Electronics and Design (ISLPED)

2011 European Microwave Integrated Circuit Conference (EuMIC)

2011 4th International Symposium on Computational Intelligence and Design (ISCID)

2011 78th ARFTG Microwave Measurement Conference

2010 MIXDES - 17th International Conference "Mixed Design of Integrated Circuits & Systems"

2010 IEEE 10th International Conference on Advanced Learning Technologies (ICALT)

2010 18th International Conference on Advanced Thermal Processing of Semiconductors (RTP)

2010 11th International Conference on Control Automation Robotics & Vision (ICARCV 2010)

2010 Asia Pacific Microwave Conference - (APMC 2010)

APCCAS 2010-2010 IEEE Asia Pacific Conference on Circuits and Systems

2010 IEEE International SOC Conference (SOCC)

2010 Biomedical Sciences and Engineering Conference (BSEC)

2009 4th International Conference on Recent Advances in Space Technologies (RAST)

2009 IEEE International Workshop on Memory Technology, Design and Testing (MTDT)

2009 IEEE 8th International Conference on ASIC (ASICON 2009)

2009 International Conference on Parallel Architectures and Compilation Techniques (PACT)

2009 3rd International Conference on Signals, Circuits and Systems (SCS 2009)

2009 Joint Urban Remote Sensing Event

2008 International SoC Design Conference (ISOCC)

2008 International Nano-Optoelectronics Workshop (i-NOW)

2008 15th IEEE International Conference on Image Processing (ICIP 2008)

2007 IEEE Antennas and Propagation Society International Symposium

2007 10th IEEE International Conference on Computer-Aided Design and Computer Graphics (CAD/Graphics 2007)

2007 European Conference on Power Electronics and Applications (EPE)

2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

2007 ITI 5th International Conference on Information & Communications Technology (ICICT2007)

2006 IEEE International Symposium on Mixed and Augmented Reality (ISMAR)

2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems

2005 9th International Conference on Computer Supported Cooperative Work in Design (CSCWD)

2005 IEEE International Reliability Physics Symposium (IRPS)

2005 International Conference of Communications, Circuits and Systems (ICCCAS)

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Xplore Articles related to 3d Integration

Effect of frequency in the **3D integration** of a PZT-actuated MEMS switch using a single crystal silicon asymmetric beam

Self-assembly-based **3D integration** technologies

Multichip thinning technology with temporary bonding for multichip-to-wafer **3D integration**

Leading edge review: What is an important factor of CMP consumables for **3D Integration** Bonding?

Process development for **3D integration**: Conductive wafer bonding for high density inter-chip interconnection

Cu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for **3D integration**

A versatile optical system for metrology and defects inspection of **3D integration** processes

Low temperature bonding for **3D integration** — A review of the surface activated bonding (SAB)

Via-last/backside-via **3D integration** using a visible-light laser debonding technique

Fine-pitch interconnection by hybrid Cu/Sn-adhesive bonding for **3D integration**

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Periodicals related to 3d Integration

Advanced Packaging, IEEE Transactions on

Aerospace and Electronic Systems Magazine, IEEE

Antennas and Propagation, IEEE Transactions on

Applied Superconductivity, IEEE Transactions on

Biomedical Circuits and Systems, IEEE Transactions on

Biomedical Engineering, IEEE Transactions on

Circuits and Systems for Video Technology, IEEE Transactions on

Communications Magazine, IEEE

Components and Packaging Technologies, IEEE Transactions on

Computer Architecture Letters

Computer Graphics and Applications, IEEE

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Computers, IEEE Transactions on

Control Systems Magazine, IEEE

Design & Test of Computers, IEEE

Electron Device Letters, IEEE

Electron Devices, IEEE Transactions on

Electronics Packaging Manufacturing, IEEE Transactions on

Geoscience and Remote Sensing, IEEE Transactions on

Industrial Electronics, IEEE Transactions on

Industry Applications, IEEE Transactions on

Information Technology in Biomedicine, IEEE Transactions on

Lightwave Technology, Journal of

Magnetics, IEEE Transactions on

Mechatronics, IEEE/ASME Transactions on

Medical Imaging, IEEE Transactions on

Micro, IEEE

Microelectromechanical Systems, Journal of

Microwave Theory and Techniques, IEEE Transactions on

Nanotechnology, IEEE Transactions on

Nuclear Science, IEEE Transactions on

Pattern Analysis and Machine Intelligence, IEEE Transactions on

Photonics Technology Letters, IEEE

Power Delivery, IEEE Transactions on

Proceedings of the IEEE

Selected Topics in Signal Processing, IEEE Journal of

Semiconductor Manufacturing, IEEE Transactions on

Sensors Journal, IEEE

Software Engineering, IEEE Transactions on

Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on

Visualization and Computer Graphics, IEEE Transactions on

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E-books related to 3d Integration

Hybrid Integral Equation Modeling Methods for 3D Integration

Modeling of Through-Silicon Vias (TSV) in 3D Integration

Macromodeling of Complex Interconnects in 3D Integration

Three-dimensional Integrated Circuits: Design, EDA, and Architecture

Three‐Dimensional Integration of Ge and Two‐Dimensional Materials for One‐Dimensional Devices

Resistive Random Access Memory (RRAM)

Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

Input/Output Interconnect Networks for Gigascale Systems

NEPES’ Fan‐Out Packaging Technology from Single die, SiP to Panel‐Level Packaging

Interconnection Technology Innovations in 2.5D Integrated Electronic Systems

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Top Organizations on 3d Integration

Aerospace & Electronics Systems

Antennas & Propagation

Circuits & Systems

Communications

Components, Packaging & Manufacturing Tech

Computational Intelligence

Computer

Control Systems

Electromagnetic Compatibility

Electron Devices

Electronic Design Automation, Council on

Engineering in Medicine & Biology

Geoscience & Remote Sensing

Industrial Electronics

Industry Applications

Instrumentation & Measurement

Intelligent Transportation Systems

Magnetics

Member and Geographic Activities

Microwave Theory & Techniques

Nanotechnology Council

Nuclear & Plasma Science

Photonics

Power & Energy

Power Electronics

Reliability

Robotics & Automation

Sensors Council

Signal Processing

Solid State Circuits

Technical Activities Board

Ultrasonics, Ferroelectrics & Frequency Control

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Most published Xplore authors for 3d Integration

Fumihiko Nakazawa

Takeaki Shimanouchi

Tadashi Nakatani

Takashi Katsuki

Hisao Okuda

Osamu Toyoda

Satoshi Ueda

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3d Integration

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Xplore Articles related to 3d Integration

Periodicals related to 3d Integration

E-books related to 3d Integration

Top Organizations on 3d Integration

Most published Xplore authors for 3d Integration