Conferences related to Inductors

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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 57th ACM/ESDA/IEEE Design Automation Conference (DAC)

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2022 59th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2021 58th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2019 56th ACM/ESDA/IEEE Design Automation Conference (DAC)

    EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.

  • 2018 55th ACM/ESDA/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2017 54th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2015 52nd ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC Description for TMRF The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading

  • 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 session on design methodologies and EDA tool developments, keynotes, panels, plus User Track presentations. A diverse worldwide community representing more than 1,000 organization attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

  • 2012 49th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers

  • 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference is the world s leading technical conference and tradeshow on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does business.

  • 2010 47th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 200 of the leading electronics design suppliers.

  • 2009 46th ACM/EDAC/IEEE Design Automation Conference (DAC)

    DAC is the premier event for the electronic design community. DAC offers the industry s most prestigious technical conference in combination with the biggest exhibition, bringing together design, design automation and manufacturing market influencers.

  • 2008 45th ACM/EDAC/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. DAC features a wide array of technical presentations plus over 250 of the leading electronics design suppliers.

  • 2007 44th ACM/IEEE Design Automation Conference (DAC)

    The Design Automation Conference (DAC) is the premier Electronic Design Automation (EDA) and silicon solution event. DAC features over 50 technical sessions covering the latest in design methodologies and EDA tool developments and an Exhibition and Demo Suite area with over 250 of the leading EDA, silicon and IP Providers.

  • 2006 43rd ACM/IEEE Design Automation Conference (DAC)

  • 2005 42nd ACM/IEEE Design Automation Conference (DAC)

  • 2004 41st ACM/IEEE Design Automation Conference (DAC)

  • 2003 40th ACM/IEEE Design Automation Conference (DAC)

  • 2002 39th ACM/IEEE Design Automation Conference (DAC)

  • 2001 38th ACM/IEEE Design Automation Conference (DAC)

  • 2000 37th ACM/IEEE Design Automation Conference (DAC)

  • 1999 36th ACM/IEEE Design Automation Conference (DAC)

  • 1998 35th ACM/IEEE Design Automation Conference (DAC)

  • 1997 34th ACM/IEEE Design Automation Conference (DAC)

  • 1996 33rd ACM/IEEE Design Automation Conference (DAC)


2020 59th IEEE Conference on Decision and Control (CDC)

The CDC is the premier conference dedicated to the advancement of the theory and practice of systems and control. The CDC annually brings together an international community of researchers and practitioners in the field of automatic control to discuss new research results, perspectives on future developments, and innovative applications relevant to decision making, automatic control, and related areas.


2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.


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Periodicals related to Inductors

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Circuits and Systems I: Regular Papers, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Circuits and Systems II: Express Briefs, IEEE Transactions on

Part I will now contain regular papers focusing on all matters related to fundamental theory, applications, analog and digital signal processing. Part II will report on the latest significant results across all of these topic areas.


Device and Materials Reliability, IEEE Transactions on

Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the ...


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Most published Xplore authors for Inductors

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Xplore Articles related to Inductors

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Miniaturized Multilayer Inductors on GaAs Three-dimensional MMIC

2007 Korea-Japan Microwave Conference, 2007

Newly developed multi-layer inductors on GaAs three-dimensional MMICs are presented. We tested single-, double-, triple-, and quadruple-layer stacked- type inductors in what may be the first report on inductors on a GaAs MMIC with three or more layers. These proposed multilayer inductors can produce higher inductance in the same area as conventional 2D-MMICs. The performance of the single-and multilayer inductors ...


Design of “EIE” Shape Coupling Inductors and Its Application in Interleaved LLC Resonant Converter

2018 IEEE International Power Electronics and Application Conference and Exposition (PEAC), 2018

In order to solve the problems of large number of magnetic components and unequal current in interleaved LLC resonant converter, inverse coupling of two-phase resonant inductors is proposed. On the basis of traditional EE” and EI” shape coupling inductors, the “EIE” shape coupling inductors are proposed, which solve the problems of traditional coupling inductors, such as air gap is too ...


Experimental analysis of planar spiral inductors

2014 International Conference on Electrical Sciences and Technologies in Maghreb (CISTEM), 2014

This paper presents a comparative study between different planar inductors that is suitable for power converter applications. Basically there are four types of planar inductors such as square, hexagonal, octagonal and circular. These planar inductors are printed directly on PCB. The design concepts of the four shape planar inductors are first addressed. This is followed by the discussions of the ...


Ultrathin High-<inline-formula><tex-math notation="LaTeX">$Q$</tex-math></inline-formula>2-D and 3-D RF Inductors in Glass Packages

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018

Embedded inductors in ultrathin glass substrates were modeled, designed, fabricated, and characterized. Various 2-D and 3-D topologies were explored to obtain the tradeoffs in inductance density, quality (Q) factor, size, and self-resonant frequency (SRF). Single-layer spiral inductors were modeled and designed to formulate an inductor library that is optimized for high inductance densities. These include variations in the number of ...


Miniature CPW Inductors for 3-D MMICs

2006 IEEE MTT-S International Microwave Symposium Digest, 2006

Newly developed miniaturized CPW inductors using the great flexibility of three-dimensional multilayer technology have been designed and fabricated. Their measured performances are also presented and compared. The area of these inductors are almost four time smaller than that of planar spiral inductors while maintaining the same performance. The miniaturized inductors are constructed using a combination of three metal and two ...


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Educational Resources on Inductors

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IEEE-USA E-Books

  • Miniaturized Multilayer Inductors on GaAs Three-dimensional MMIC

    Newly developed multi-layer inductors on GaAs three-dimensional MMICs are presented. We tested single-, double-, triple-, and quadruple-layer stacked- type inductors in what may be the first report on inductors on a GaAs MMIC with three or more layers. These proposed multilayer inductors can produce higher inductance in the same area as conventional 2D-MMICs. The performance of the single-and multilayer inductors was measured on wafer and calculated by electromagnetic field analysis using the finite element method. Though they are the same size, the multilayer inductors produce 2~11 times higher inductance than the single-layer inductors. In addition, the degradation of the multilayer inductor performances, such as resistance, Q-factor and self- resonant frequency, was not seen compared with the single-layer inductors. Multilayer inductors make it possible to shrink circuit size from many hundreds of MHz to the millimetre wave.

  • Design of “EIE” Shape Coupling Inductors and Its Application in Interleaved LLC Resonant Converter

    In order to solve the problems of large number of magnetic components and unequal current in interleaved LLC resonant converter, inverse coupling of two-phase resonant inductors is proposed. On the basis of traditional EE” and EI” shape coupling inductors, the “EIE” shape coupling inductors are proposed, which solve the problems of traditional coupling inductors, such as air gap is too concentrated, distribution of magnetic pressure is not uniform, and coupling coefficient is low. In order to verify the current sharing scheme, separate inductors and coupling inductor are made respectively. The experimental prototype of an interleaved LLC resonant converter with 48V input and 1kW/400V output is built. The comparison experiment shows that the current sharing is basically realized when the coupling coefficient is selected at certain value.

  • Experimental analysis of planar spiral inductors

    This paper presents a comparative study between different planar inductors that is suitable for power converter applications. Basically there are four types of planar inductors such as square, hexagonal, octagonal and circular. These planar inductors are printed directly on PCB. The design concepts of the four shape planar inductors are first addressed. This is followed by the discussions of the experimental data of these planar inductors.

  • Ultrathin High-<inline-formula><tex-math notation="LaTeX">$Q$</tex-math></inline-formula>2-D and 3-D RF Inductors in Glass Packages

    Embedded inductors in ultrathin glass substrates were modeled, designed, fabricated, and characterized. Various 2-D and 3-D topologies were explored to obtain the tradeoffs in inductance density, quality (Q) factor, size, and self-resonant frequency (SRF). Single-layer spiral inductors were modeled and designed to formulate an inductor library that is optimized for high inductance densities. These include variations in the number of turns, conductor linewidth and spacing, and the ratios of inner diameter and outer diameter of the spiral. In order to optimize the inductor topology for higher Q factors, various types of 3-D topologies with 300-μm glass were studied through modeling, fabrication, and model validation. Inductance densities, Q, and SRF were measured for various topologies. Higher inductance densities of 10-20 nH/mm2with a Q factor of 30-40 are obtained for spiral inductors on glass, making them more suitable for module miniaturization when Q-factor requirements are not stringent. For higher Q factors, 3-D solenoid and daisy- chain topologies are found to be more suitable in spite of their low inductance densities of 3 nH/mm2, making them a better choice for applications where better channel selectivity, precise phase-switching, and lower insertion loss are needed.

  • Miniature CPW Inductors for 3-D MMICs

    Newly developed miniaturized CPW inductors using the great flexibility of three-dimensional multilayer technology have been designed and fabricated. Their measured performances are also presented and compared. The area of these inductors are almost four time smaller than that of planar spiral inductors while maintaining the same performance. The miniaturized inductors are constructed using a combination of three metal and two polyimide dielectric layers on semi-insulating GaAs substrates

  • Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow process

    In order to meet the need of high integration and low cost of wireless communication systems, passive devices are widely used in all kinds of systems. This paper introduces an innovative method to manufacture integrated passive inductors based on glass reflow process. IPDs(integrated passive devices) have been simulated by 3D EM(electromagnetic) simulator software HFSS(high frequency structure simulator). From 0GHz to 10GHz, the Q value is above 200, higher than the Q value of conventional thin film inductors. Moreover, several key parameters of spiral inductors including inductor diameter, inductor thickness, substrate thickness, inductor width and inductor space are investigated. Finally, manufacturing process of inductors is presented.

  • Magnetic Materials and Design Trade-Offs for High Inductance Density, High-Q and Low-Cost Power and EMI Filter Inductors

    This paper investigates the trade-offs in inductance density and quality factor of inductors with and without magnetic-cores through modeling, design, fabrication and model validation through characterization. Two type of inductors, one for power-supply and the other for EMI filters, are investigated. Parametric analysis was performed to study the enhancement in inductance density without compromising the current handling and efficiency. For EMI filter inductors, the inductance and quality factor (Q) were improved by 13X and 4X respectively with and without magnetic cores. For power inductors, the inductance and quality factor were improved by 5X and 1.6X respectively. The fabricated magnetic core inductors achieved 5X reduction in thickness, compared to the stage-of-the art air-core inductors which use multilayered and thick solenoid.

  • Performance Boost of Spiral Inductors With Thickness-Controlled Domain-Patterned Permalloy

    In CMOS radio frequency integrated circuits, inductors are a barrier in achieving better monolithic solutions because of the large area occupied and the associated parasitics. For better performance of on-chip inductors, soft magnetic materials are incorporated with them. In an earlier work, it was shown that by tailoring the shape and size of the permalloy patterns, formation of magnetic domains can be controlled. When such domain patterns are incorporated with inductors, they have varied effects on inductor performance. In this paper, it is demonstrated that by depositing 60 nm thick domain- controlled permalloy patterns, better performance of inductors can be obtained at higher frequencies (>5 GHz). About 2× increment in inductance and 7× increment in quality factor is obtained at frequencies >5 GHz by incorporating appropriate domain-controlled permalloy patterns with inductors.

  • Scaling Meander Inductors from Micro to Nano

    In order to efficiently scale down RF circuits it is necessary also to decrease the size of the inductors. The ultimate limit of this miniaturization would be an RF circuit consisting of nano-scaled inductors. Meander nanoinductors presented in this work were fabricated by electron beam lithography. Their performance was investigated by electromagnetic simulation software. It was found that inductance and quality factor of these inductors linearly scale down with their size. Nano-inductors could offer advantages at higher frequencies because their quality factor linearly increases with frequency in the range where the quality factor of the micro-inductors reaches a maximum

  • Analysis for efficiency improvement of CMOS class-E power amplifiers with MEMS inductors

    This paper presents an analysis and enhancement of efficiency in a class-E power amplifier using MEMS inductors. The MEMS technology is proposed and demonstrated by a prototype inductor. The model of MEMS inductors is created by HFSS simulator and its simulated result has good match with the measured result. Stacked-metal layer inductors in MEMS process are also developed to increase the quality factor. The simulation result of a CMOS class-E PA with MEMS inductors shows that the increased quality factor of inductors by 2 can improve the PA's efficiency by 6%. Furthermore, we present a design methodology for optimizing the PA's efficiency.



Standards related to Inductors

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Guide for Application and Specification of Harmonic Filters

Provide guidelines for the application and specification of passive shunt harmonic fileters for use on 50 and 60 Hz power systems at 216 volts and above.


IEEE Guide for Acceptance and Maintenance of Insulating Oil in Equipment

This guide applies to mineral oil used in transformers, load tap changers, voltage regulators, reactors, and circuit breakers. The guide discusses the following: a) Analytical tests and their significance for the evaluation of mineral insulating oil. b) The evaluation of new, unused mineral insulating oil before and after filling into equipment. c) Methods of handling and storage of mineral insulating ...


IEEE Guide for Diagnostic Field Testing of Electric Power Apparatus - Part 1: Oil Filled Power Transformers, Regulators, and Reactors


IEEE Guide for the Detection and Location of Acoustic Emissions from Partial Discharges in Oil-Immersed Power Transformers and Reactors

This guide is applicable to the detection and location of acoustic emissions from partial discharges and other sources in oil immersed power transformers and reactors. Both electrical sources (partial discharge) and mechanical sources (such as loose clamping, bolts, or insulation parts) generate these emissions. There are descriptions of acoustic instrumentation, test procedures, and interpretation of results. When this guide is ...


IEEE Loss Evaluation Guide for Power Transformers and Reactors


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