Thermal expansion

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Thermal expansion is the tendency of matter to change in volume in response to a change in temperature. When a substance is heated, its particles begin moving more and thus usually maintain a greater average separation. (Wikipedia.org)






Conferences related to Thermal expansion

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.


2019 IEEE International Geoscience and Remote Sensing Symposium (IGARSS)

International Geosicence and Remote Sensing Symposium (IGARSS) is the annual conference sponsored by the IEEE Geoscience and Remote Sensing Society (IEEE GRSS), which is also the flagship event of the society. The topics of IGARSS cover a wide variety of the research on the theory, techniques, and applications of remote sensing in geoscience, which includes: the fundamentals of the interactions electromagnetic waves with environment and target to be observed; the techniques and implementation of remote sensing for imaging and sounding; the analysis, processing and information technology of remote sensing data; the applications of remote sensing in different aspects of earth science; the missions and projects of earth observation satellites and airborne and ground based campaigns. The theme of IGARSS 2019 is “Enviroment and Disasters”, and some emphases will be given on related special topics.


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Periodicals related to Thermal expansion

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Most published Xplore authors for Thermal expansion

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Xplore Articles related to Thermal expansion

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Pressure dependence of molar volume near the melting point in benzene

Tsinghua Science and Technology, 2007

The pressure dependence of the molar volume was at constant temperatures close to the melting point in benzene. The molar volume of benzene was calculated using experimental data for the thermal expansivity for constant temperatures of 25°C, 28.5°C, 40°C, and 51°C at various pressures for both the solid and liquid phases. The predictions are in good agreement with the observed ...


Current Capabilities/needs and future possibilities of multi-Chip-modules Summary

[1991] 49th Annual Device Research Conference Digest, 1991

None


An 8b 250MHz A/D converter

1986 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1986

An 8b converter, fabricated in a 5GHz, oxide-isolated bipolar process, will be reported. Full power bandwidth is 125MHz. The packaging used for the converter accomodates a power dissipation of 12W.


Development of a multichannel ultrasonic interferometer for the measurements under high pressures and its application to biomolecular studies

IEEE 1988 Ultrasonics Symposium Proceedings., 1988

A description is given of a device that comprises four parallel fixed-path interferometric cells with a volume of 0.2 cc each. This device provides relative measurements of sound velocity with an error of about 10/sup -3/ to 10/sup -4/% in the pressure range of 1 to 2500 bar. The specific increments of the nonlinearity acoustic parameter B/A, for different biomolecular ...


Optimization design for CNC machine spindle system heat-dissipating structure

2009 International Conference on Mechatronics and Automation, 2009

In this paper, the thermal characteristics of the CNC machine spindle system is simulated based on finite element method. The heat boundary conditions of the finite element model are calibrated by comparing with the experimental results. Furthermore, the spindle system thermal errors are calculated and reduced by two approaches: rational arrangement of the heat-dissipating rib plates and parametric optimization design ...


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Educational Resources on Thermal expansion

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IEEE.tv Videos

IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Intel Joule 570x Developer Kit with Expansion Board: Mouser's Engineering Bench Talk
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
ITRI: Technology Advances in Flexible Displays and Substrates
IEEE @ SXSW 2015 - Lessons from Africa: Relationships Over Privacy
APEC 2011 Exhibitor Overview
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
Hertz-Class Brillouin Lasing with Nanokelvin Thermal Sensing - William Loh - Closing Ceremony, IPC 2018
Big Data Meets Big Compute - 2018 IEEE Industry Summit on the Future of Computing
UE: Future of 5G - John Smee - B5GS 2019
Brooklyn 5G - 2015 - Hossein Moiin - Expanding the Human Possibilities with 5G
Global Impact of IEEE Standards on Smart Grid: Bill Ash
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
Superconducting Detectors for Astrophysics and Cosmology - ASC-2014 Plenary series - 9 of 13 - Thursday 2014/8/14
Insight Through Engagement: IEEE Standards Association Fellowship Program

IEEE-USA E-Books

  • Pressure dependence of molar volume near the melting point in benzene

    The pressure dependence of the molar volume was at constant temperatures close to the melting point in benzene. The molar volume of benzene was calculated using experimental data for the thermal expansivity for constant temperatures of 25°C, 28.5°C, 40°C, and 51°C at various pressures for both the solid and liquid phases. The predictions are in good agreement with the observed volumes in both the solid and liquid phases of benzene. The predicted values of the molar volume for a constant temperature of 28.5°C in the liquid phase of benzene agree well with experimental data in the literature.

  • Current Capabilities/needs and future possibilities of multi-Chip-modules Summary

    None

  • An 8b 250MHz A/D converter

    An 8b converter, fabricated in a 5GHz, oxide-isolated bipolar process, will be reported. Full power bandwidth is 125MHz. The packaging used for the converter accomodates a power dissipation of 12W.

  • Development of a multichannel ultrasonic interferometer for the measurements under high pressures and its application to biomolecular studies

    A description is given of a device that comprises four parallel fixed-path interferometric cells with a volume of 0.2 cc each. This device provides relative measurements of sound velocity with an error of about 10/sup -3/ to 10/sup -4/% in the pressure range of 1 to 2500 bar. The specific increments of the nonlinearity acoustic parameter B/A, for different biomolecular compounds (nucleotides, amino acids, and proteins), have been measured. The error of relative measurements of B/A is less than 0.5%.<<ETX>>

  • Optimization design for CNC machine spindle system heat-dissipating structure

    In this paper, the thermal characteristics of the CNC machine spindle system is simulated based on finite element method. The heat boundary conditions of the finite element model are calibrated by comparing with the experimental results. Furthermore, the spindle system thermal errors are calculated and reduced by two approaches: rational arrangement of the heat-dissipating rib plates and parametric optimization design of finite element model.

  • High performance wavelength-tunable filter based on in-fiber Bragg grating and electrically resistive coating

    None

  • Creep properties of Sn-rich solder joints

    None

  • Interconnects and packaging of millimeter wave circuits

    This paper presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different interconnects and two realized front-ends are demonstrated.

  • Electrical equivalent method for thermal stress analysis

    A method that can help to improve understanding of thermal-stress problems and is useful for the first-order analysis of thermal stresses in the layered structures of laminates is introduced. The technique models the thermal expansion and the elasticity of each layer as components in a three-terminal equivalent electrical circuit. A model of the laminate is developed by connecting the equivalent circuits of the layers in a network. Currents and voltages are obtained by network analysis. The thermal stresses in the laminate are derived from the branch currents; the local thermal expansion coefficients for the surfaces or for internal bonding interfaces are given by the node voltages.<<ETX>>

  • 4H-5 Optical Differential Dilatometry for the Determination of the Coefficients of Thermal Expansion of Single Crystal Solids

    This work reports on the optical differential dilatometry technique applied to the measurement of thermal coefficients of expansion on crystalline X, Y, and Z cuts of quartz and langatate (LGT) samples. The assembled dilatometer uses a phase shift technique with a Michelson-type interferometer which detects the fringe patterns generated by the recombination of two beam paths which were reflected off of the metallized surfaces of two samples as they are heated within a furnace. The differential sample expansion is calculated directly from the measured interference pattern. The measured expansion data agreed well with calculated expansion data using published expansion coefficients. For instance, the expansion of X-cut quartz was measured from room temperature to approximately 155degC, and the agreement between measured data with those calculated from published values for the entire temperature range is better than 0.32 wavelengths (202.5 nm or 5.1%)



Standards related to Thermal expansion

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Guide to Specifications for Gas-Insulated, Electric Power Substation Equipment

This guide covers the technical requirements for the design, fabrication, testing, installation, and in-service performance of gas-insulated substations(GIS). In line with the user functional one-line diagram, the supplier should furnish all components of the GIS such as circuit breakers(CB), disconnect switches(DS), maintenance ground switches (MGS), fast-acting ground switches(FGS), voltage transformers(VT), current transformers(CT), SF6-to-air bushings, SF6-to-cable terminations, surge arresters, all the ...


IEEE Recommended Practice for Electric Power Systems in Commercial Buildings



Jobs related to Thermal expansion

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