Thermal conductivity

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In physics, thermal conductivity,, is the property of a material's ability to conduct heat. (Wikipedia.org)






Conferences related to Thermal conductivity

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2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

premier components, packaging and technology conference


2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.


2019 IEEE Electrical Insulation Conference (EIC)

Electrical Materials, Equipment, Testing, Nanotechnologies, Power Systems, Motors, Generators, Transformers, Switchgear


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Periodicals related to Thermal conductivity

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems Magazine, IEEE


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Xplore Articles related to Thermal conductivity

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High Mobility Poly-Si TFTs Fabricated by a Novel Excimer-Laser Crystallization Method

50th Annual Device Research Conference, 1992

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Temperature rise of insulated lead-covered cables

Proceedings of the American Institute of Electrical Engineers, 1916

After a brief historical note the factors that determine the rating of a cable are considered. The thermal conductivity of a cable is expressed in terms of the volume thermal conductivity of the insulation, the surface thermal conductivity of the lead sheath, and the dimensions of the cable. The values of the thermal conductivities as given by various observers including ...


Thermal self-focusing instability in the high-latitude ionosphere

Radio Science, 2003

A model for the linear theory of the overdense thermal self-focusing instability, as generated by high power radio waves, in the high-latitude F-region ionosphere is developed. We treat self-focusing-driven irregularities with scale sizes, perpendicular to the geomagnetic field, on the order of a kilometer and smaller. We find that E-region coupling leads to nonambipolar perpendicular diffusive effects. The conducting E-region ...


Influence Of An Axial Magnetic field and current risetime on an aluminum vapor z-pinch

IEEE Conference Record - Abstracts. 1992 IEEE International Conference on Plasma, 1993

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Temperature Rise of Submarine Cable on Riser Poles

IEEE Power Engineering Review, 1991

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Educational Resources on Thermal conductivity

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IEEE.tv Videos

IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
IMS 2011 Microapps - Tools for Creating FET and MMIC Thermal Profiles
IMS 2012 Microapps - Electrical Thermal Coupled Solutions for Flip Chip Designs
Micro-Apps 2013: Integrated Electro-Thermal Design of a SiGe PA
On the Characterization of Thermal Coupling Resistance in a Current Mirror: RFIC Industry Showcase 2016
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
ITRI: Technology Advances in Flexible Displays and Substrates
APEC 2011 Exhibitor Overview
KeyTalk with Hamish Laird: The Gap Between Large Power Converters and Small Power Converters - APEC 2017
Winds of Change: Part 3 - Wind Energy in Developing Countries
Hertz-Class Brillouin Lasing with Nanokelvin Thermal Sensing - William Loh - Closing Ceremony, IPC 2018
Stochastic Single Flux Quantum Neuromorphic Computing using Magnetically Tunable Josephson Junctions - Stephen Russek: 2016 International Conference on Rebooting Computing
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 3 of 7 - MEG and ULF-MRI
Low-energy High-performance Computing based on Superconducting Technology
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Next Generation Power Supplies - APEC 2016
Zero Emission Powertrains and Fuel Cell Engines: APEC 2019
Mildred Dresselhaus: IEEE Medal of Honor 2015

IEEE-USA E-Books

  • High Mobility Poly-Si TFTs Fabricated by a Novel Excimer-Laser Crystallization Method

    None

  • Temperature rise of insulated lead-covered cables

    After a brief historical note the factors that determine the rating of a cable are considered. The thermal conductivity of a cable is expressed in terms of the volume thermal conductivity of the insulation, the surface thermal conductivity of the lead sheath, and the dimensions of the cable. The values of the thermal conductivities as given by various observers including the author are compared. A diagram is shown for readily obtaining the thermal conductivities of one-conductor cables, and tables are given of the carrying capacity of one-conductor cables for various duct temperatures and thicknesses of insulation. Factors are added so that the carrying capacity of multiple- conductor cables may be taken from these tables. Sometimes the lead sheath of a cable carries considerable stray current. A formula is given for calculating the increased temperature due to such current. The carrying capacity of a cable is largely determined by the thermal properties of the duct line in which it is installed. This feature is discussed briefly. The overload or intermittent rating is calculated from a formula involving the thermal capacity of the cable multiplied by a factor. Experimental values of this factor for several types of cables are given. A formula is given to take account of variable air temperature. Various formulas given in the paper are developed in three appendixes.

  • Thermal self-focusing instability in the high-latitude ionosphere

    A model for the linear theory of the overdense thermal self-focusing instability, as generated by high power radio waves, in the high-latitude F-region ionosphere is developed. We treat self-focusing-driven irregularities with scale sizes, perpendicular to the geomagnetic field, on the order of a kilometer and smaller. We find that E-region coupling leads to nonambipolar perpendicular diffusive effects. The conducting E-region is shown to increase the threshold for the thermal self-focusing instability. Growth rates of the thermal self-focusing instability are computed, including E-region conductivity effects, for a range of radio wave amplitudes.

  • Influence Of An Axial Magnetic field and current risetime on an aluminum vapor z-pinch

    None

  • Temperature Rise of Submarine Cable on Riser Poles

    None

  • Charge exchange pumping in the vacuum ultraviolet

    None

  • Some Recent Developments In Plasma Switches

    None

  • An 8b 250MHz A/D converter

    An 8b converter, fabricated in a 5GHz, oxide-isolated bipolar process, will be reported. Full power bandwidth is 125MHz. The packaging used for the converter accomodates a power dissipation of 12W.

  • Metal Insulator Structures For Multichip Modules

    The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.

  • A Contribution to the Study of Aging of XLPE Insulated Cables

    None



Standards related to Thermal conductivity

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IEEE Standard for Safety Levels with Respect to Human Exposure to Radio Frequency Electromagnetic Fields, 3 kHz to 300 GHz

Recommendations are made to protect against established adverse health effects in human beings associated with exposure to electric, magnetic and electromagnetic fields in the frequency range of 3 kHz to 300 GHz. The recommendations are expressed in terms of basic restrictions (BRs) and maximum permissible exposure (MPE) values. The BRs are limits on internal fields, specific absorption rate (SAR), and ...



Jobs related to Thermal conductivity

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