Temperature

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Temperature is a physical property of matter that quantitatively expresses the common notions of hot and cold. (Wikipedia.org)






Conferences related to Temperature

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2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2019 IEEE 46th Photovoltaic Specialists Conference (PVSC)

Photovoltaic materials, devices, systems and related science and technology


2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to practicing power electronics engineer.


2019 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


2019 IEEE International Electron Devices Meeting (IEDM)

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.


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Periodicals related to Temperature

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Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer

Computer, the flagship publication of the IEEE Computer Society, publishes peer-reviewed technical content that covers all aspects of computer science, computer engineering, technology, and applications. Computer is a resource that practitioners, researchers, and managers can rely on to provide timely information about current research developments, trends, best practices, and changes in the profession.


Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.


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Xplore Articles related to Temperature

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Sensitivity Of AVHRR/2 Thermal Infrared Radiances To Some Atmospheric And Surface Parameters

International Geoscience and Remote Sensing Symposium, 'Remote Sensing: Moving Toward the 21st Century'., 1988

None


A 64K EEPROM with extended temperature and page mode operation

1985 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1985

A1.8muN channel 64K EEPROM with temperature operation from -55°C to +125°C will be described. Page mode allows writing of 32bytes in 10μs.


An alternative method to monitor and control the IC temperature in the 4.2-77 K range

27th European Solid-State Device Research Conference, 1997

None


Temperature mapping of Meharlo Lake by means of Landsat-5 TM-6

Proceedings of IGARSS '93 - IEEE International Geoscience and Remote Sensing Symposium, 1993

Thermography is a branch of remote sensing concerned with measuring the radiant temperature of Earth surface features from a distance. In the paper a method of determining the temperature of Meharlo lake surface from the Landsat-5 TM-6 data is described and the final results obtained From this study are presented.<<ETX>>


Precision Analog Circuit Design in SOI CMOS for a Wide Temperature Range up to 350 °C

PRIME 2012; 8th Conference on Ph.D. Research in Microelectronics & Electronics, 2012

High resolution ADCs or voltage references require precision analog circuit design. However, design for a wide temperature range up to 350 deg C has been so far strongly impeded by a high dependency of the circuits’ electrical properties, high leakage currents and severe performance losses. In this paper we present a body-biasing approach to reduce leakage currents and simultaneously improve ...


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Educational Resources on Temperature

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IEEE.tv Videos

CES 2008: Herman Miller's C2 Climate Control for the desktop
ITEC 2014: Widebandgap Switches: Paving the Path Towards High Frequencies and Higher Temperatures
30 Years to High Temperature Superconductivity (HTS): Status and Perspectives
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 7 of 7 - SQUID-based noise thermometers for sub-Kelvin thermometry
IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates
Analog to Digital Traits
AlGaN/GaN Plasmonic Terahertz Detectors
A Low Power High Performance PLL with Temperature Compensated VCO in 65nm CMOS: RFIC Interactive Forum
Larson Collection interview with William Alfred Fowler
ASC-2014 SQUIDs 50th Anniversary: 1 of 6 Arnold Silver
IMS 2011-100 Years of Superconductivity (1911-2011) - Existing and Emerging RF Applications of Superconductivity
A Precision 140MHz Relaxation Oscillator in 40nm CMOS with 28ppm/C Frequency Stability for Automotive SoC Applications: RFIC Interactive Forum 2017
High Temperature Superconductors (HTS) as Enabling Technology for Sustainable Mobility and Energy Efficiency - Applied Superconductivity Conference 2018
Developing a Plasma Thruster in Costa Rica
IMS 2014: A 600 GHz Low-Noise Amplifier Module
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 1 of 7 - Gordon Donaldson: A Memory - part I - John Clarke
Cryogenics for Applied Superconductivity - ASC-2014 Plenary series - 11 of 13 - Friday 2014/8/15
Development of Quantum Annealing Technology at D-Wave Systems - 2018 IEEE Industry Summit on the Future of Computing
High-current HTS cables for magnet applications - ASC-2014 Plenary series - 8 of 13 - Thursday 2014/8/14
MIRAI Program and the New Super-high Field NMR Initiative in Japan - Applied Superconductivity Conference 2018

IEEE-USA E-Books

  • Sensitivity Of AVHRR/2 Thermal Infrared Radiances To Some Atmospheric And Surface Parameters

    None

  • A 64K EEPROM with extended temperature and page mode operation

    A1.8muN channel 64K EEPROM with temperature operation from -55°C to +125°C will be described. Page mode allows writing of 32bytes in 10μs.

  • An alternative method to monitor and control the IC temperature in the 4.2-77 K range

    None

  • Temperature mapping of Meharlo Lake by means of Landsat-5 TM-6

    Thermography is a branch of remote sensing concerned with measuring the radiant temperature of Earth surface features from a distance. In the paper a method of determining the temperature of Meharlo lake surface from the Landsat-5 TM-6 data is described and the final results obtained From this study are presented.<<ETX>>

  • Precision Analog Circuit Design in SOI CMOS for a Wide Temperature Range up to 350 °C

    High resolution ADCs or voltage references require precision analog circuit design. However, design for a wide temperature range up to 350 deg C has been so far strongly impeded by a high dependency of the circuits’ electrical properties, high leakage currents and severe performance losses. In this paper we present a body-biasing approach to reduce leakage currents and simultaneously improve the circuit’s performance, i.e. intrinsic gain and bandwidth, and allow operation in the moderate inversion region of the transistor devices. The method presented here allows FD (fully depleted) device characteristics in a 1.0 micrometer PD (partially depleted) SOI (silicon-on-insulator) CMOS process. Results report a leakage current reduction of two orders of magnitude and a 200 % improvement of the gm/Id factor in the moderate inversion region of the transistor.

  • Bipolar integrated pressure transducer

    An all-silicon, bipolar, two-chip integrated pressure transducer was developed. This device uses a piezoresistive pressure cell and a single-signal conditioning integrated circuit. No external compensation components are required for this circuit board mount device. This device uses a unique temperature-compensation circuit differing in basic concept from that used in previous attempts at developing such a device. No special TC resistors are required. The pressure-sensing cell has digital adjustment capabilities for zeroing the cell output.<<ETX>>

  • The use of IMPATT generated power for parametric amplifier pumps

    The performance of IMPATT oscillators and amplifiers for parametric amplifier pumps will be analyzed, citing noise, automatic power leveling, and power output. Experimental results at 35 GHz and 42 GHz will be discussed.

  • Ground surface temperature distribution maps by using LANDSAT data and geographical information

    Shows the use of geographical information and mapping of multi-temporal ground surface temperature distributions for a wide city area; this is compared with LANDSAT-5 Thematic Mapper data. Ground surface temperatures are measured by a portable infrared thermometer at the overpass times of LANDSAT-5. Variations of surface temperatures over 24 hours at intervals of one hour on summer days are drawn. The classification of land use corresponds with land cover, and the applied measured surface temperatures to land use data. Ground surface temperature distribution maps are drawn. The distribution map from LANDSAT data is compared with one using geographical information, and its effectiveness is investigated.<<ETX>>

  • The simulation of temperature and humidity control system based on PROTEUS

    Temperature and humidity controlling system which has the function of alarm memory was designed by PROTEUS software. The MCU AT89C51 was used to control the whole system. The humidity and temperature sensor SHT11 was used as the data collector. The system compare the collecting temperature and humidity data with their normal value to decide whether modifying the temperature and humidity or not. The software of PROTEUS was used to do the simulation of the designed system to evaluate the design's feasibility and stability. So the debugging time in objective hardware was reduced, the development process was accelerated.

  • Temperature Dependence of Total AC Loss in High-Temperature Superconducting Tapes

    A versatile experimental facility was designed and set up to measure transport ac losses, magnetization ac losses, and total ac losses in high-temperature superconductors at variable temperatures. Several sets of measurements were carried out in the temperature range of 35 K to 100 K. Sample temperature during the measurements could be controlled within plusmn0.5 K of set temperature. Temperature dependence of transport losses reflects variation of critical current density of the tapes with temperature. Temperature dependence of magnetization losses exhibits an interesting behavior with a peak, whose position shifts to lower temperatures as the magnetic field is increased. Experimental data of ac losses at various temperatures are compared with those calculated using numerical methods. Generally, the simulated results reproduce well the experimental data.



Standards related to Temperature

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IEEE Standard Requirements for Instrument Transformers

This standard is intended for use as a basis for performance and interchangeability of equipment covered, and to assist in the proper selection of such equipment. Safety precautions are also addressed. This standard covers certain electrical, dimensional, and mechanical characteristics, and takes into consideration certain safety features of current and inductively coupled voltage transformers of types generally used in the ...