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The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.
2021 IEEE Photovoltaic Specialists Conference (PVSC)
Photovoltaic materials, devices, systems and related science and technology
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
The International Conference on Image Processing (ICIP), sponsored by the IEEE SignalProcessing Society, is the premier forum for the presentation of technological advances andresearch results in the fields of theoretical, experimental, and applied image and videoprocessing. ICIP 2020, the 27th in the series that has been held annually since 1994, bringstogether leading engineers and scientists in image and video processing from around the world.
IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.
The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.
The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.
Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission
The IEEE Transactions on Automation Sciences and Engineering (T-ASE) publishes fundamental papers on Automation, emphasizing scientific results that advance efficiency, quality, productivity, and reliability. T-ASE encourages interdisciplinary approaches from computer science, control systems, electrical engineering, mathematics, mechanical engineering, operations research, and other fields. We welcome results relevant to industries such as agriculture, biotechnology, healthcare, home automation, maintenance, manufacturing, pharmaceuticals, retail, ...
Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013
The implementation of Restriction of Hazardous Substances Directive (RoHS) in 2006 has led to a requirement that soldering materials used in the fabrication of printed circuit boards (PCBs) should be lead-free. This change has raised the peak reflow temperature by 30 C as compared with a tin-lead process. A protective surface finishing should be designed to maintain good solderability, by ...
2009 International Conference on Information Technology and Computer Science, 2009
In nondestructive testing (NDT) it is important to have a high probability of detection (POD) and more reliable characterization of each defect. This can be gained by using several techniques combined into one. A borescope and eddy current integrative nondestructive testing system was presented. A dual probe containing an eddy current probe and a borescope was designed. This dual probe ...
2003 Conference on Lasers and Electro-Optics Europe (CLEO/Europe 2003) (IEEE Cat. No.03TH8666), 2003
Weak or sensitive surfaces like pigment lacquer, finishing varnish, art paintings or plastics are much more precarious to clean due to the danger of a partial or complete damage of the layer which may have a protective function or artistic merit. So it is essential only to remove the contamination itself or, if necessary, the contamination together with some very ...
1993 IEEE International Frequency Control Symposium, 1993
Natural quartz crystal spheres were etched in various etchants at room temperature and at 80/spl deg/C. Ten 12-mm-diameter polished natural quartz spheres were placed into each of several etchants, including 40% HF:60% NH/sub 4/F, saturated NH/sub 4/F-HF and lattice etch, at each of two nominal temperatures: 20/spl deg/C and 80/spl deg/C. The resulting quartz pieces were scanning electron micrographed normal ...
2012 Oceans, 2012
Large vessels such as tankers, LNG gas carriers and container ships have traditionally used steel wire ropes for mooring. These ropes are heavy, rust if not properly maintained and also suffer broken wires which make them difficult and hazardous to handle. Synthetic fibre ropes such as high modulus polyethylene (HMPE) offer a lightweight alternative to steel wire. When properly cared ...
Quantum Computation - ASC-2014 Plenary series - 4 of 13 - Tuesday 2014/8/12
IMPASS: Intelligent Mobility Platform with Active Spoke System
Life Sciences: Surface Enhanced Raman Spectroscopy, and more
IEEE Magnetics Distinguished Lecture - Yoshichika Otani
Robotics History: Narratives and Networks Oral Histories: Alicia Casals
BSIM Spice Model Enables FinFET and UTB IC Design
3D Body-Mapping for Severely Burned Patients - Julia Loegering - IEEE EMBS at NIH, 2019
Making Orthogonal Transitions with Climbing Mini-Whegs
A Robot to Mine the Moon
Microwave PCB Structure Selection Microstrip vs. Grounded Coplanar Waveguide: MicroApps 2015 - Rogers Corporation
Silicon THz: an Opportunity for Innovation
IROS TV 2019-STAR LAB at the University of Surrey Space Technology for Autonomous systems & Robotics
Perpendicular magnetic anisotropy: From ultralow power spintronics to cancer therapy
Lighting the Way: Optical Sensors in the Life Sciences
ASC-2014 SQUIDs 50th Anniversary: 4 of 6 - Keiji Enpuku
Demonstrations of Gravity-Independent Mobility and Drilling on Natural Rock using Microspines
ISEC 2013 Special Gordon Donaldson Session: Remembering Gordon Donaldson - 5 of 7 - SQUID Instrumentation for Early Cancer Diagnostics
Larson Collection interview with Rudolph Peierls
Lunar Industrialization: The First Step to the Solar System
The implementation of Restriction of Hazardous Substances Directive (RoHS) in 2006 has led to a requirement that soldering materials used in the fabrication of printed circuit boards (PCBs) should be lead-free. This change has raised the peak reflow temperature by 30 C as compared with a tin-lead process. A protective surface finishing should be designed to maintain good solderability, by preventing the copper surface from being oxidized, both during storage after PCB fabrication and during exposures to soldering temperatures. Organic solderability preservative (OSP) is considered as a preferred low cost surface mount technology (SMT)-compatible non-metallic surface finishing method, due to the excellent surface co-planarity of the coated pads. However, the protectiveness of some commercial available OSPs is still poor and their solderability performances are always deteriorated after the multiple lead-free reflow cycles. This article presents experimental data to illustrate the newly developed OSP coating in terms of thermal resistance, copper diffusion suppression and solderability.
In nondestructive testing (NDT) it is important to have a high probability of detection (POD) and more reliable characterization of each defect. This can be gained by using several techniques combined into one. A borescope and eddy current integrative nondestructive testing system was presented. A dual probe containing an eddy current probe and a borescope was designed. This dual probe can in situ detect defects in aeroengine simultaneously, which can reduce the need for costly teardown. In this integrative system information fusion for the techniques is needful and possible. A method of borescope and eddy current information fusion was proposed using the Dempster-Shafer (D-S) theory of evidence. The primary experimental results show that the high reliable characterization of defect is gained using the information fusion.
Weak or sensitive surfaces like pigment lacquer, finishing varnish, art paintings or plastics are much more precarious to clean due to the danger of a partial or complete damage of the layer which may have a protective function or artistic merit. So it is essential only to remove the contamination itself or, if necessary, the contamination together with some very thin coating without affecting or destroying the underlying structure. For such kind of gentle laser applications we set up a prototype machine based on a KrF-excimer laser. An easy and rapid adaptation of the pulse energy is achieved by passing the radiation through a computer controlled variable attenuator followed by a beam forming system to ensure homogeneous irradiation at the target with intensity variations smaller 5%. The device is preferentially designed to operate with plane objects like electrical circuits, wavers or paintings. In combination with an improved handling system, however, also three-dimensional surfaces can be treated. Actually the laser cleaning unit is set up as a mobile system, allowing wide applications for cleaning of sensitive surfaces in industrial fabrication, for the restoration of antiques or the sterilization of biological and medical instruments.
Natural quartz crystal spheres were etched in various etchants at room temperature and at 80/spl deg/C. Ten 12-mm-diameter polished natural quartz spheres were placed into each of several etchants, including 40% HF:60% NH/sub 4/F, saturated NH/sub 4/F-HF and lattice etch, at each of two nominal temperatures: 20/spl deg/C and 80/spl deg/C. The resulting quartz pieces were scanning electron micrographed normal to the resulting major plane and at right angles to the plane for the purpose of illustrating the anisotropy of the etch rate of quartz as a function of etchant and etchant temperature. The micrographs are presented and evaluated. All the etchants exhibit distinctly different figures at room temperature versus 80/spl deg/C. This is consistent with earlier reports that crystal blanks etched at room temperature are generally "smoother" (i.e., different) than similar blanks etched in the same etchant at elevated temperatures.<<ETX>>
Large vessels such as tankers, LNG gas carriers and container ships have traditionally used steel wire ropes for mooring. These ropes are heavy, rust if not properly maintained and also suffer broken wires which make them difficult and hazardous to handle. Synthetic fibre ropes such as high modulus polyethylene (HMPE) offer a lightweight alternative to steel wire. When properly cared for they can long outlast steel wire ropes. They are lighter than wires, and they are easier and safer to handle by the ship's crew and by the berth mooring personnel. A problem which hinders the wide adoption of fibre rope mooring lines is their relatively poor resistance to external abuse and abrasion. They are particularly vulnerable to damage as they run through the ship's fairleads. This paper describes the development and use of a low- friction, low-abrasion nylon liner for use in ship fairleads. They can easily be retrofitted into existing fairleads onboard the vessel. They essentially eliminate wear on fibre mooring lines. This technology now enables the use of fibre mooring lines, with their significant safety advantages. This paper will be of interest to ship designers, owners and operators, especially for use on large tankers, gas carriers, container ships, and navy vessels.
Techniques are developed for determining ruled surface that represent the best possible approximation to a given surface. A combined theoretical and experimental investigation of this technique applied to the design and manufacture of long-lead extruder screws is reported. The results show that it is possible, in some cases, to produce accurate surface geometries by treating the screw as an approximate ruled warped surface with a linear variation in the orientation of the generatrix as it moves along the directrices. It is believed that the proposed approach can be extended to the design and manufacture of other curved surfaces.<<ETX>>
The key processes of Silicon-Wafer Direct Bonding (SDB), hydrophilic surface formation and optimum two-step heat treatment have been developed. However, there are still many unknown factors, such as native oxide, defects etc., influencing the characteristics of the bonded interface of Si/Si. The additional wafer treatment in diluted HF solution after hydrophilic surface formation can not only etch off native oxide but also form hydrophilic surface, and provide a voidless Si/Si bonding interface. The electrical characteristics of both N/sup +//P and N/P junction mesa diodes prepared by this novel SDB process were examined. Both of them have excellent electrical characteristics and their breakdown voltages are all over 280 V.<<ETX>>
Electric components and devices have become high density more and more because of demands for high performance. Nowadays, electroless surface plating is often applied to the surface finish of substrate land patterns for soldering and interconnections due to the enhancement of the wiring design on the mounting hoard, which leads to the shrinkage of the devices. In some cases, though, electroless plating causes weak solder joints on the external terminals of electric devices and packages. The key issue on the developed organic FC-BGA (Flip-chip Ball Grid Array) packaging process is to achieve the ball attach strength on the substrate lands with electroless nickel and immersion gold plating. It was confirmed that the root cause of the weak strength was the existence of the phosphoric enrichment layer with the detailed analysis. Additionally, regarding with the new approach to solve the weak solder joint, the DCNP (double-layered constructed nickel plating) was effective in preventing the progress of the phosphoric enrichment layer.
The control of diamond turning is usually achieved through a laser- interferometer feedback of slide position. The limitation of this control scheme is that the feedback signal does not account for additional dynamics of the tool post and the material removal process. If the tool post is rigid and the material removal process is relatively static, then such a non-collocated position feedback control scheme may suffice. However, as the accuracy requirement gets tighter and the desired surface contours become more complex, the need for a direct tool-tip sensing becomes inevitable. The physical constraints of the machining process prohibit any reasonable implementation of a tool-tip motion measurement. It is proposed that the measured force normal to the face of the workpiece can be filtered through an appropriate admittance transfer function to result in the estimated depth of cut. This can be compared to the desired depth of cut to generate the adjustment control action in addition to position feedback control. In this work, the design methodology on the admittance modelbased control with a conventional controller is presented. Based on the empirical data of the cutting dynamics, simulation results are shown. In addition, the recursive least-squares algorithm with forgetting factor is proposed to identify the parameters and update the admittance model in real time.
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