Conferences related to Sawing

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

CVPR is the premier annual computer vision event comprising the main conference and several co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry researchers.

  • 2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premier annual computer vision event comprising the main conference and severalco-located workshops and short courses. With its high quality and low cost, it provides anexceptional value for students, academics and industry researchers.

  • 2018 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premier annual computer vision event comprising the main conference and several co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry researchers.

  • 2017 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conferenceand 27co-located workshops and short courses. With its high quality and low cost, it provides anexceptional value for students,academics and industry.

  • 2016 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conference and 27 co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry.

  • 2015 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    computer, vision, pattern, cvpr, machine, learning

  • 2014 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conference and 27 co-located workshops and short courses. Main conference plus 50 workshop only attendees and approximately 50 exhibitors and volunteers.

  • 2013 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    CVPR is the premiere annual Computer Vision event comprising the main CVPR conference and 27 co-located workshops and short courses. With its high quality and low cost, it provides an exceptional value for students, academics and industry.

  • 2012 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Topics of interest include all aspects of computer vision and pattern recognition including motion and tracking,stereo, object recognition, object detection, color detection plus many more

  • 2011 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Sensors Early and Biologically-Biologically-inspired Vision, Color and Texture, Segmentation and Grouping, Computational Photography and Video

  • 2010 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Concerned with all aspects of computer vision and pattern recognition. Issues of interest include pattern, analysis, image, and video libraries, vision and graphics, motion analysis and physics-based vision.

  • 2009 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

    Concerned with all aspects of computer vision and pattern recognition. Issues of interest include pattern, analysis, image, and video libraries, vision and graphics,motion analysis and physics-based vision.

  • 2008 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

  • 2007 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

  • 2006 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)

  • 2005 IEEE Conference on Computer Vision and Pattern Recognition (CVPR)


2020 IEEE International Conference on Plasma Science (ICOPS)

IEEE International Conference on Plasma Science (ICOPS) is an annual conference coordinated by the Plasma Science and Application Committee (PSAC) of the IEEE Nuclear & Plasma Sciences Society.


2020 IEEE International Conference on Robotics and Automation (ICRA)

The International Conference on Robotics and Automation (ICRA) is the IEEE Robotics and Automation Society’s biggest conference and one of the leading international forums for robotics researchers to present their work.


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Periodicals related to Sawing

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Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Automatic Control, IEEE Transactions on

The theory, design and application of Control Systems. It shall encompass components, and the integration of these components, as are necessary for the construction of such systems. The word `systems' as used herein shall be interpreted to include physical, biological, organizational and other entities and combinations thereof, which can be represented through a mathematical symbolism. The Field of Interest: shall ...


Biomedical Engineering, IEEE Reviews in

The IEEE Reviews in Biomedical Engineering will review the state-of-the-art and trends in the emerging field of biomedical engineering. This includes scholarly works, ranging from historic and modern development in biomedical engineering to the life sciences and medicine enabled by technologies covered by the various IEEE societies.


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Most published Xplore authors for Sawing

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Xplore Articles related to Sawing

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Influence of machine configuration on EOS damage during wafer cleaning process

2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2016

An investigation was carried out on the charging voltage of deionized (DI) water during wafer cleaning at wafer sawing process, since it was supposed to be the root cause for EOS damages during semiconductor production. The charging voltage was measured using a non-contact electrostatic field meter. It was found that the positioning of the water filter influenced the amount of ...


Research on drive dynamics of hydraulic band sawing machine

2011 IEEE Power Engineering and Automation Conference, 2011

In order to investigate sawing dynamics on band sawing machine, a general dynamic model is proposed to represent the actual system with the dynamics of strain of band saw, mechanism of hydraulic motor with proportional valve and load of sawing. Firstly, an element strain model of band saw along the arc coordinate is established with the elastic deformation theory of ...


Investigation and elimination of discolored bondpads on microchip

ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575), 2002

In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.


"Non-piercing" — A must for flip chips!

2015 European Microelectronics Packaging Conference (EMPC), 2015

Compared to the COB process (wire bonding) the flip-chip process is significantly more intolerant to pre-existing mechanical die damage. This can be caused by the mechanical pretreatment of the dies, the thinning and sawing of the wafers, but above all by the cutting out of the dies during the assembly process. The pre-existing damage constitutes a reliability risk, as thermal ...


Superhigh electromechanical coupling for acoustic plate waves in potassium niobate

1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027), 1999

The characteristics of acoustic waves propagating in thin plates of single crystal potassium niobate are theoretically investigated. It is found that acoustic plate waves can provide extremely high values of electromechanical coupling. For example, values of Δv/v, the fractional velocity change produced by electrical shorting of the surface, as high as 0.5 can be obtained with the shear horizontal (SH0) ...


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Educational Resources on Sawing

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IEEE.tv Videos

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IEEE-USA E-Books

  • Influence of machine configuration on EOS damage during wafer cleaning process

    An investigation was carried out on the charging voltage of deionized (DI) water during wafer cleaning at wafer sawing process, since it was supposed to be the root cause for EOS damages during semiconductor production. The charging voltage was measured using a non-contact electrostatic field meter. It was found that the positioning of the water filter influenced the amount of charging voltage of DI water.

  • Research on drive dynamics of hydraulic band sawing machine

    In order to investigate sawing dynamics on band sawing machine, a general dynamic model is proposed to represent the actual system with the dynamics of strain of band saw, mechanism of hydraulic motor with proportional valve and load of sawing. Firstly, an element strain model of band saw along the arc coordinate is established with the elastic deformation theory of closed band saw, momentum theorem of band sawing element and sawing load. Then, the relationship between control input, sawing load and band saw tension is addressed with the dynamics of hydraulic motor with proportional valve. The results of dynamic simulations and experiments show the proposed model can effectively describe dynamics of band sawing process. This model provides a useful way to improve dynamics of band sawing.

  • Investigation and elimination of discolored bondpads on microchip

    In this paper, a case of discolored bondpad is discussed. Failure analysis results showed the discoloration of bondpads was due to pinholes and Si dust around the pinholes. which were introduced during the wafer die sawing process caused by galvanic corrosion. Failure mechanism and characteristics of galvanic corrosion on Aluminium bondpads have been studied in this paper.

  • "Non-piercing" — A must for flip chips!

    Compared to the COB process (wire bonding) the flip-chip process is significantly more intolerant to pre-existing mechanical die damage. This can be caused by the mechanical pretreatment of the dies, the thinning and sawing of the wafers, but above all by the cutting out of the dies during the assembly process. The pre-existing damage constitutes a reliability risk, as thermal shock testing demonstrates. The international standards MIL-STD 883G, JESD22-B118, ESCC 2049000 currently give too little consideration to these aspects. AEMtec GmbH, as a service specialist for the assembly of unhoused chips, has many years of experience in COB and flip-chip processes. The following article describes pre-existing die damage and proposes measures to minimise it.

  • Superhigh electromechanical coupling for acoustic plate waves in potassium niobate

    The characteristics of acoustic waves propagating in thin plates of single crystal potassium niobate are theoretically investigated. It is found that acoustic plate waves can provide extremely high values of electromechanical coupling. For example, values of Δv/v, the fractional velocity change produced by electrical shorting of the surface, as high as 0.5 can be obtained with the shear horizontal (SH0) wave. The influence of a thin conducting layer on the velocity and attenuation of plate waves is investigated. It is shown that variations in these parameters as high as 50% and 30 dB per wavelength can be achieved for change in layer sheet conductance from 10-7to 10-5S.

  • The design, development and use of pipe cutting tools for remote handling in JET

    The authors report on remote handling tools which have been specifically designed to meet requirements for pipe cutting at JET (Joint European Torus). The principal requirements were the quality of cut necessary for rewelding, effective swarf removal, and compactness for remote handling. The designs of tools had to be compatible with the severe access restrictions imposed by the JET machine. The processes used by the tools are sawing from the inside and outside of pipes, and orbital lathe for larger pipes. Special features were created on the pipes to facilitate tool location. The blade and toolbit designs have evolved to optimize cutting forces and tool durability. Satisfactory reliability has been achieved by performing 200 h of cutting during the two year period of development. Subsequently, over 100 'hands-on' cutting operations have been made on the JET machine since 1988 and a further 150 cuts are planned for 1992. Using a programmable controller the feed rate can be changed throughout the cutting operation into a predetermined way, thereby optimizing the tools' efficiency.<<ETX>>

  • Miniature, high efficiency transducers for use in ultrasonic flow meters

    This paper describes development of a novel, high efficiency transducer for use in ultrasonic flow meters. It is based on conversion of energy between surface acoustic waves (SAWs) and bulk acoustic wave (BAWs). The transducer consists of thin plate of a suitable piezoelectric material whose SAW velocity is greater than velocity of BAW in the fluid. Under these conditions a surface wave traveling on the substrate radiates a bulk acoustic wave in the fluid. We show that with proper design efficient conversion of energy from SAW to BAW and vice versa can be obtained. For example. using lead zirconate titanate (PZT) as the piezoelectric material and water as the fluid, total conversion loss (SAW to BAW and back from BAW to SAW) of less than 3 dB has been obtained.

  • Evaluation of Scattering Loss in Polycrystalline Materials by Line-Focus-Beam Acoustic Microscope

    None

  • High-efficiency cells from layer transfer: A first step towards Si thin-film/wafer hybrid technologies

    The literature describes various techniques for fabricating thin monocrystalline Si films without the need of sawing. Layer transfer using epitaxy on porous Si (PSI) and subsequent layer separation from the growth substrate is one particular attractive option. A 40 μm thick epitaxial Si cell from this so-called PSI process is capable of saving about 80 % of the Si that is consumed by a 180 μm-thick Si wafer plus 100 μm Si kerf loss. In addition, the two crystallizations of growing the poly-feedstock and of growing the ingot are replaced by a single crystallization: the epitaxial growth of a thin Si layer. Applying the PSI process, we demonstrate an independently confirmed aperture efficiency of 19.1 % for a 4 cm2-sized layer transfer cell that has a thickness of only 43 μm. This is the highest efficiency ever reported for a thin-film (<;50 μm) crystalline Si layer transfer cell. We achieve this record with a passivated emitter and rear contact (PERC) structure. The passivation layer is Al2O3from atomic layer deposition (ALD). The contacts on the rear side are formed by laser ablation using ultrashort ps pulses (LCO). The ISFH roadmap that our PSI process development is a part of is also discussed in this contribution. Our program aims at developing thin-film/wafer hybrid technologies that shall combine the high efficiency potential of thin monocrystalline Si films with the low cost per area of the Si-thin-film world. 19%-efficient and less then 50 μm-thick layer transfer cells mark a large step forward towards the realization of such thin-film/wafer hybrid technologies.

  • Correlating wafer surface to DW saw profile and wire wear

    The surface of diamond-wire sawn wafers is investigated as a function of different wires. The evolution of the pilgrim waves on the wafer surface is correlated with wire movement. Analysis of wafer surfaces indicated that some wires generate lower surface roughness than others, even using the same sawing recipe.



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