Conferences related to Molding equipment

Back to Top

2021 IEEE International Conference on Mechatronics (ICM)

CM focuses on recent developments and future prospects related to the synergetic integration of mechanics, electronics, and information processing.


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


2020 IEEE 16th International Workshop on Advanced Motion Control (AMC)

AMC2020 is the 16th in a series of biennial international workshops on Advanced Motion Control which aims to bring together researchers from both academia and industry and to promote omnipresent motion control technologies and applications.


2020 IEEE 18th International Conference on Industrial Informatics (INDIN)

INDIN focuses on recent developments, deployments, technology trends, and research results in Industrial Informatics-related fields from both industry and academia


2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)

ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.


More Conferences

Periodicals related to Molding equipment

Back to Top

Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes


More Periodicals

Most published Xplore authors for Molding equipment

Back to Top

Xplore Articles related to Molding equipment

Back to Top

Design and Manufacture of Powder Molding Equipment Based on Motion Simulation

2010 Second International Conference on Computer Modeling and Simulation, 2010

A new compaction powder metallurgy equipment integrated with the mould and the frame is introduced to substitute the traditional powder metallurgy equipment (P/M). During the design and manufacture, finite element method is used to analyze the motion of the equipment. The Lagrange equation and modal synthesis method for flexible body are constructed, and then the cooperative simulation method using ADAMS ...


Cost-effective high-field magnets for future accelerators

PACS2001. Proceedings of the 2001 Particle Accelerator Conference (Cat. No.01CH37268), 2001

We describe a modification of the traditional cos/spl theta/ accelerator magnet design that substantially reduces the cost of manufacture of accelerator magnets. Instead of the Rutherford type cable, a round multi- strand cable is used. This cable is placed in precisely formed grooves in cylindrical surfaces or flat plates that are then nested together to form the coil assembly. Cost ...


Challenge of vacuum molded flip chip packaging technology

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599), 2002

To be the solution of higher throughput, uniform outline and level up reliability performance of mature capillary underfill packaging, molded underfill technology is studied by assembly houses, equipment vendors and material manufactures for years and is expected to be the major assembly method of flip chip package in the future. Vacuum molding flip chip packaging technology is one developed by ...


IEEE Draft Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

IEEE P1458/D6.1 May, 2017, 2017

A recommended procedure for the selection, application, and determination of the remaining life in molded-case circuit breaker is provided.



Educational Resources on Molding equipment

Back to Top

IEEE-USA E-Books

  • Design and Manufacture of Powder Molding Equipment Based on Motion Simulation

    A new compaction powder metallurgy equipment integrated with the mould and the frame is introduced to substitute the traditional powder metallurgy equipment (P/M). During the design and manufacture, finite element method is used to analyze the motion of the equipment. The Lagrange equation and modal synthesis method for flexible body are constructed, and then the cooperative simulation method using ADAMS and MARC is present for solving flexible multibody dynamics of flexible body. Results show that the design of the structure of the powder metallurgy equipment is feasible and the low cost and the simple structure are its merits compared to the traditional equipment.

  • Cost-effective high-field magnets for future accelerators

    We describe a modification of the traditional cos/spl theta/ accelerator magnet design that substantially reduces the cost of manufacture of accelerator magnets. Instead of the Rutherford type cable, a round multi- strand cable is used. This cable is placed in precisely formed grooves in cylindrical surfaces or flat plates that are then nested together to form the coil assembly. Cost reductions are achieved by the elimination of expensive coil end parts, coil wedges and spacers, collars, and coil molding equipment. Also, conductor stress management is obtained by having each conductor supported in its own groove and thus there is no need for application of azimuthal pre-stress to the coil. Thus, coil sizing measurements and collaring press operations are eliminated. We describe an example design for such a magnet to operate at 6.6 T and show a performance and cost comparison to the 6.6 T dipole that was developed for use in the SSC.

  • Challenge of vacuum molded flip chip packaging technology

    To be the solution of higher throughput, uniform outline and level up reliability performance of mature capillary underfill packaging, molded underfill technology is studied by assembly houses, equipment vendors and material manufactures for years and is expected to be the major assembly method of flip chip package in the future. Vacuum molding flip chip packaging technology is one developed by lots of molding equipment vendors from various molded underfill theories, and the key issues are the uncompleted fill under the die and the flush at vacuum position(s). Finer filler (less than 10 /spl mu/m particle size) compound is used for the small gap between chip and substrate & the clearance of flip chip bumps, but we still need to ensure that there is no air be trapped under the die during molding process. Vacuum parameter and position are also very important to avoid the uncompleted fill and material flush from air vent areas. Siliconware is now developing such technology as an alternative solution of capillary underfill flip chip packaging. The test vehicle and vacuum processing technology development by tuning the parameters and modifying the mold chase design will be simply introduced here, and the reliability test is going to confirm the package performance.

  • IEEE Draft Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

    A recommended procedure for the selection, application, and determination of the remaining life in molded-case circuit breaker is provided.



Standards related to Molding equipment

Back to Top

No standards are currently tagged "Molding equipment"


Jobs related to Molding equipment

Back to Top