Conferences related to Molding equipment

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2021 IEEE International Conference on Mechatronics (ICM)

CM focuses on recent developments and future prospects related to the synergetic integration of mechanics, electronics, and information processing.


2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted papers will be peer reviewed. Accepted high quality papers will be presented in oral and postersessions, will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE


Oceans 2020 MTS/IEEE GULF COAST

To promote awareness, understanding, advancement and application of ocean engineering and marine technology. This includes all aspects of science, engineering, and technology that address research, development, and operations pertaining to all bodies of water. This includes the creation of new capabilities and technologies from concept design through prototypes, testing, and operational systems to sense, explore, understand, develop, use, and responsibly manage natural resources.

  • OCEANS '96

  • OCEANS '97

  • OCEANS '98

  • OCEANS '99

  • OCEANS 2000

  • OCEANS 2001

  • OCEANS 2002

  • OCEANS 2003

  • OCEANS 2004

  • OCEANS 2005

  • OCEANS 2006

  • OCEANS 2007

  • OCEANS 2008

    The Marine Technology Society (MTS) and the Oceanic Engineering Society (OES) of the Institute of Electrical and Electronic Engineers (IEEE) cosponsor a joint conference and exposition on ocean science, engineering, education, and policy. Held annually in the fall, it has become a focal point for the ocean and marine community to meet, learn, and exhibit products and services. The conference includes technical sessions, workshops, student poster sessions, job fairs, tutorials and a large exhibit.

  • OCEANS 2009

  • OCEANS 2010

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2011

    The Marine Technology Society and the Oceanic Engineering Scociety of the IEEE cosponsor a joint annual conference and exposition on ocean science engineering, and policy.

  • OCEANS 2012

    Ocean related technology. Tutorials and three days of technical sessions and exhibits. 8-12 parallel technical tracks.

  • OCEANS 2013

    Three days of 8-10 tracks of technical sessions (400-450 papers) and concurent exhibition (150-250 exhibitors)

  • OCEANS 2014

    The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2015

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 450 technical papers and 150-200 exhibits.

  • OCEANS 2016

    The Marine Technology Scociety and the Oceanic Engineering Society of the IEEE cosponor a joint annual conference and exposition on ocean science, engineering, and policy. The OCEANS conference covers four days. One day for tutorials and three for approx. 500 technical papers and 150 -200 exhibits.

  • OCEANS 2017 - Anchorage

    Papers on ocean technology, exhibits from ocean equipment and service suppliers, student posters and student poster competition, tutorials on ocean technology, workshops and town meetings on policy and governmental process.

  • OCEANS 2018 MTS/IEEE Charleston

    Ocean, coastal, and atmospheric science and technology advances and applications


2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)

ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.


2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF)

Ferroelectric materials and applications



Periodicals related to Molding equipment

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Biomedical Engineering, IEEE Transactions on

Broad coverage of concepts and methods of the physical and engineering sciences applied in biology and medicine, ranging from formalized mathematical theory through experimental science and technological development to practical clinical applications.


Components and Packaging Technologies, IEEE Transactions on

Component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.


Computer Graphics and Applications, IEEE

IEEE Computer Graphics and Applications (CG&A) bridges the theory and practice of computer graphics. From specific algorithms to full system implementations, CG&A offers a strong combination of peer-reviewed feature articles and refereed departments, including news and product announcements. Special Applications sidebars relate research stories to commercial development. Cover stories focus on creative applications of the technology by an artist or ...


Consumer Electronics, IEEE Transactions on

The design and manufacture of consumer electronics products, components, and related activities, particularly those used for entertainment, leisure, and educational purposes



Most published Xplore authors for Molding equipment

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Xplore Articles related to Molding equipment

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Design and Manufacture of Powder Molding Equipment Based on Motion Simulation

2010 Second International Conference on Computer Modeling and Simulation, 2010

A new compaction powder metallurgy equipment integrated with the mould and the frame is introduced to substitute the traditional powder metallurgy equipment (P/M). During the design and manufacture, finite element method is used to analyze the motion of the equipment. The Lagrange equation and modal synthesis method for flexible body are constructed, and then the cooperative simulation method using ADAMS ...


Cost-effective high-field magnets for future accelerators

PACS2001. Proceedings of the 2001 Particle Accelerator Conference (Cat. No.01CH37268), 2001

We describe a modification of the traditional cos/spl theta/ accelerator magnet design that substantially reduces the cost of manufacture of accelerator magnets. Instead of the Rutherford type cable, a round multi- strand cable is used. This cable is placed in precisely formed grooves in cylindrical surfaces or flat plates that are then nested together to form the coil assembly. Cost ...


Challenge of vacuum molded flip chip packaging technology

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599), 2002

To be the solution of higher throughput, uniform outline and level up reliability performance of mature capillary underfill packaging, molded underfill technology is studied by assembly houses, equipment vendors and material manufactures for years and is expected to be the major assembly method of flip chip package in the future. Vacuum molding flip chip packaging technology is one developed by ...


IEEE Draft Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

IEEE P1458/D6.1 May, 2017, 2017

A recommended procedure for the selection, application, and determination of the remaining life in molded-case circuit breaker is provided.



Educational Resources on Molding equipment

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IEEE-USA E-Books

  • Design and Manufacture of Powder Molding Equipment Based on Motion Simulation

    A new compaction powder metallurgy equipment integrated with the mould and the frame is introduced to substitute the traditional powder metallurgy equipment (P/M). During the design and manufacture, finite element method is used to analyze the motion of the equipment. The Lagrange equation and modal synthesis method for flexible body are constructed, and then the cooperative simulation method using ADAMS and MARC is present for solving flexible multibody dynamics of flexible body. Results show that the design of the structure of the powder metallurgy equipment is feasible and the low cost and the simple structure are its merits compared to the traditional equipment.

  • Cost-effective high-field magnets for future accelerators

    We describe a modification of the traditional cos/spl theta/ accelerator magnet design that substantially reduces the cost of manufacture of accelerator magnets. Instead of the Rutherford type cable, a round multi- strand cable is used. This cable is placed in precisely formed grooves in cylindrical surfaces or flat plates that are then nested together to form the coil assembly. Cost reductions are achieved by the elimination of expensive coil end parts, coil wedges and spacers, collars, and coil molding equipment. Also, conductor stress management is obtained by having each conductor supported in its own groove and thus there is no need for application of azimuthal pre-stress to the coil. Thus, coil sizing measurements and collaring press operations are eliminated. We describe an example design for such a magnet to operate at 6.6 T and show a performance and cost comparison to the 6.6 T dipole that was developed for use in the SSC.

  • Challenge of vacuum molded flip chip packaging technology

    To be the solution of higher throughput, uniform outline and level up reliability performance of mature capillary underfill packaging, molded underfill technology is studied by assembly houses, equipment vendors and material manufactures for years and is expected to be the major assembly method of flip chip package in the future. Vacuum molding flip chip packaging technology is one developed by lots of molding equipment vendors from various molded underfill theories, and the key issues are the uncompleted fill under the die and the flush at vacuum position(s). Finer filler (less than 10 /spl mu/m particle size) compound is used for the small gap between chip and substrate & the clearance of flip chip bumps, but we still need to ensure that there is no air be trapped under the die during molding process. Vacuum parameter and position are also very important to avoid the uncompleted fill and material flush from air vent areas. Siliconware is now developing such technology as an alternative solution of capillary underfill flip chip packaging. The test vehicle and vacuum processing technology development by tuning the parameters and modifying the mold chase design will be simply introduced here, and the reliability test is going to confirm the package performance.

  • IEEE Draft Recommended Practice for the Selection, Field Testing, and Life Expectancy of Molded Case Circuit Breakers for Industrial Applications

    A recommended procedure for the selection, application, and determination of the remaining life in molded-case circuit breaker is provided.



Standards related to Molding equipment

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No standards are currently tagged "Molding equipment"