Conferences related to Meeting planning

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

All topics related to engineering and technology management, including applicable analytical methods and economical/social/human issues to be considered in making engineering decisions.


2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

The 2020 IEEE International Conference on Systems, Man, and Cybernetics (SMC 2020) will be held in Metro Toronto Convention Centre (MTCC), Toronto, Ontario, Canada. SMC 2020 is the flagship conference of the IEEE Systems, Man, and Cybernetics Society. It provides an international forum for researchers and practitioners to report most recent innovations and developments, summarize state-of-the-art, and exchange ideas and advances in all aspects of systems science and engineering, human machine systems, and cybernetics. Advances in these fields have increasing importance in the creation of intelligent environments involving technologies interacting with humans to provide an enriching experience and thereby improve quality of life. Papers related to the conference theme are solicited, including theories, methodologies, and emerging applications. Contributions to theory and practice, including but not limited to the following technical areas, are invited.


2020 IEEE Power & Energy Society General Meeting (PESGM)

The Annual IEEE PES General Meeting will bring together over 2900 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more


2020 IEEE/PES Transmission and Distribution Conference and Exposition (T&D)

Bi-Annual IEEE PES T&D conference. Largest T&D conference in North America.


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Periodicals related to Meeting planning

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Aerospace and Electronic Systems Magazine, IEEE

The IEEE Aerospace and Electronic Systems Magazine publishes articles concerned with the various aspects of systems for space, air, ocean, or ground environments.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Circuits and Systems for Video Technology, IEEE Transactions on

Video A/D and D/A, display technology, image analysis and processing, video signal characterization and representation, video compression techniques and signal processing, multidimensional filters and transforms, analog video signal processing, neural networks for video applications, nonlinear video signal processing, video storage and retrieval, computer vision, packet video, high-speed real-time circuits, VLSI architecture and implementation for video technology, multiprocessor systems--hardware and software-- ...


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


Control Systems Technology, IEEE Transactions on

Serves as a compendium for papers on the technological advances in control engineering and as an archival publication which will bridge the gap between theory and practice. Papers will highlight the latest knowledge, exploratory developments, and practical applications in all aspects of the technology needed to implement control systems from analysis and design through simulation and hardware.


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Most published Xplore authors for Meeting planning

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Xplore Articles related to Meeting planning

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Cost_Effectiveness of Landsat TM Classification by Operations Staff

12th Canadian Symposium on Remote Sensing Geoscience and Remote Sensing Symposium,, 1989

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Energizing China: first itself, next the world

IEEE Spectrum, 1989

In the past eight years, China has begun to update its power industry, not only to satisfy its own great needs, but also with an eye to becoming a supplier to the rest of the developing world. A description is given of China's power system, which, in terms of generating capacity, is now the fourth largest in the world (behind ...


Standards Corner

IEEE Power Engineering Review, 1990

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A 25-Ns read access bipolar 1k/bit-TTL RAM

1974 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 1974

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An Executive Scrum Team

2009 Agile Conference, 2009

Scrum, like most of the agile processes, was created with the software projects world pains in mind. However, more and more itpsilas getting clearer that those pains are not exclusive to the software world, and they are present in whatever projects where change is a constant. In the executive business world today, change is a constant, and be prepared to ...


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Educational Resources on Meeting planning

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IEEE-USA E-Books

  • Cost_Effectiveness of Landsat TM Classification by Operations Staff

    None

  • Energizing China: first itself, next the world

    In the past eight years, China has begun to update its power industry, not only to satisfy its own great needs, but also with an eye to becoming a supplier to the rest of the developing world. A description is given of China's power system, which, in terms of generating capacity, is now the fourth largest in the world (behind the US, the Soviet Union, and Japan), and of China's plans for further development. Prospects for China in the world market are examined.<<ETX>>

  • Standards Corner

    None

  • A 25-Ns read access bipolar 1k/bit-TTL RAM

    None

  • An Executive Scrum Team

    Scrum, like most of the agile processes, was created with the software projects world pains in mind. However, more and more itpsilas getting clearer that those pains are not exclusive to the software world, and they are present in whatever projects where change is a constant. In the executive business world today, change is a constant, and be prepared to them is a must. This way, Scrum reveals to be an appropriate framework to be used in executive business teams once they start to work focused on ROI (Return On Investment) and in the business goals, acquire teamwork spirit, making strategy and execution nearer, improve continuously and deliver value quickly. In this work the author will talk about his experience on using Scrum with senior management and how the results supported Scrum promotion for other projects inside the company.

  • Scaling agile methods

    Using agile methods to develop large systems presents a thorny set of issues. If large teams are to produce lots of software functionality quickly, the agile methods involved must scale to meet the task. After all, a small team could create the software if the functionality to be delivered was small and, conversely, could be delivered given we had the time. Scaling agile teams thus becomes an issue if the only option for meeting a system delivery deadline is to have many developers working concurrently.

  • Optimal Energy Transactions in Interconnected Electric Systems

    None

  • A four-layer depth of interaction detector block for small animal PET

    We are now planning to develop a positron emission tomograph dedicated to small animals such as rats and mice which meets the demand for higher sensitivity. We propose a new depth of interaction (DOI) detector arrangement to obtain DOI information by using a four-layer detector with all the same crystal elements. In this DOI detector, we control the behavior of scintillation photons by inserting the reflectors between crystal elements so that the DOI information of four layers can be extracted from one two- dimensional (2D) position histogram made by Anger-type calculation. As a preliminary experiment, we measured crystal identification performance of the DOI detector which consists of four layers of a 16 /spl times/ 16 crystal array using Gd/sub 2/SiO/sub 5/ crystals with Ce concentration of 0.5 mol %. Each crystal is 1.42 mm /spl times/ 1.42 mm /spl times/ 4.5 mm. A crystal block is optically coupled to a 256-channel flat panel position sensitive photomultiplier tube whose opening area is 52.0 mm /spl times/ 52.0 mm. We obtained sufficient positioning performance for this four-layer DOI detector on the 2D position histogram. We concluded it would be a promising device to realize a small animal positron emission tomography scanner with high sensitivity and high resolution.

  • Bumping wafers via ultrasonically enhanced stencil printing

    Traditional solder paste stencil printing is widely used and a well understood process in surface mount board assembly. But when applied to solder bumping wafers, stencil printing faces several challenges such as meeting bump height, co-planarity and voiding requirements. There are physical limitations within stencil printing that limits solder paste deposits at extremely tight pitches. Recent work has demonstrated that stencil printing can produce greater and more reliable material transfers at tighter pitches when high frequency vibrations are applied to the stencil at the time of stencil/substrate separation. This paper examines the feasibility of using conventional stencil printing coupled with an innovative ultrasonically enhanced procedure to offer a cost effective, flexible technique for solder wafer bumping. The effects of applying a high frequency vibration to a variety of stencil designs will be examined for wafer bumping applications. Paste development, reflow and process optimization will be discussed. Work will focus on bumping wafers with 250 /spl mu/m pitch and 100 /spl mu/m bump height. Bump height distribution, co- planarity performance and die yield per wafer are examined to determine the viability of the technique.

  • On the large-scale deployment of a distributed embedded firewall

    We were recently challenged to deploy a scalable network of host based defenses using the 3com embedded firewall (EFW). The goal was to test EFW scalability in a fully operational environment. A host-based, distributed firewall like EFW requires a different perspective on policy configuration and management than a conventional perimeter firewall. They can improve overall network security by pushing protection to the network endpoints. We implemented the following workaround: protecting first the critical mission assets; restrict access to a host but relax access from the host; leverage other available countermeasures. We also instrumented the internal network with a freeware intrusion detection system (IDS) to monitor the link between the enclave and the satellite connection leading to the perimeter firewall and the extranet.



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