Conferences related to Inductance measurement

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2021 IEEE Pulsed Power Conference (PPC)

The Pulsed Power Conference is held on a biannual basis and serves as the principal forum forthe exchange of information on pulsed power technology and engineering.


2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting

The joint meeting is intended to provide an international forum for the exchange of information on state of the art research in the area of antennas and propagation, electromagnetic engineering and radio science


2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for smarter grid, energy efficiency,technologies for sustainable energy systems, converters and power supplies


2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)

ISIE focuses on advancements in knowledge, new methods, and technologies relevant to industrial electronics, along with their applications and future developments.


2020 IEEE Applied Power Electronics Conference and Exposition (APEC)

APEC focuses on the practical and applied aspects of the power electronics business. Not just a power designer’s conference, APEC has something of interest for anyone involved in power electronics including:- Equipment OEMs that use power supplies and converters in their equipment- Designers of power supplies, dc-dc converters, motor drives, uninterruptable power supplies, inverters and any other power electronic circuits, equipments and systems- Manufacturers and suppliers of components and assemblies used in power electronics- Manufacturing, quality and test engineers involved with power electronics equipment- Marketing, sales and anyone involved in the business of power electronic- Compliance engineers testing and qualifying power electronics equipment or equipment that uses power electronics


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Periodicals related to Inductance measurement

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Advanced Packaging, IEEE Transactions on

The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic, photonic, sensors, and MEMS packaging.


Antennas and Propagation, IEEE Transactions on

Experimental and theoretical advances in antennas including design and development, and in the propagation of electromagnetic waves including scattering, diffraction and interaction with continuous media; and applications pertinent to antennas and propagation, such as remote sensing, applied optics, and millimeter and submillimeter wave techniques.


Applied Superconductivity, IEEE Transactions on

Contains articles on the applications and other relevant technology. Electronic applications include analog and digital circuits employing thin films and active devices such as Josephson junctions. Power applications include magnet design as well asmotors, generators, and power transmission


Biomedical Circuits and Systems, IEEE Transactions on

The Transactions on Biomedical Circuits and Systems addresses areas at the crossroads of Circuits and Systems and Life Sciences. The main emphasis is on microelectronic issues in a wide range of applications found in life sciences, physical sciences and engineering. The primary goal of the journal is to bridge the unique scientific and technical activities of the Circuits and Systems ...


Communications, IEEE Transactions on

Telephone, telegraphy, facsimile, and point-to-point television, by electromagnetic propagation, including radio; wire; aerial, underground, coaxial, and submarine cables; waveguides, communication satellites, and lasers; in marine, aeronautical, space and fixed station services; repeaters, radio relaying, signal storage, and regeneration; telecommunication error detection and correction; multiplexing and carrier techniques; communication switching systems; data communications; and communication theory. In addition to the above, ...


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Most published Xplore authors for Inductance measurement

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Xplore Articles related to Inductance measurement

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Standard measuring device for thickness of silicon wafer based on laser compensation system

2017 4th International Conference on Systems and Informatics (ICSAI), 2017

Standard silicon wafer, which is standard instruments for semiconductors, large scale integrated circuits and photovoltaic industries, is the internationally accepted physical standard. The thickness of silicon wafer is directly related to the performance of integrated devices or performance of photoelectric conversion. In this paper, a standard measuring device for thickness of silicon wafer based on double-layer embedded table is introduced. ...


Determining the inductance of a through-substrate via using multiple on-wafer test approaches

ICMTS 2001. Proceedings of the 2001 International Conference on Microelectronic Test Structures (Cat. No.01CH37153), 2001

Four on-wafer measurement approaches for determining the inductance, L/sub via/, of through-substrate vias used in gallium arsenide (GaAs) monolithic microwave integrated circuits (MMICs) have been implemented and compared. All of the approaches yielded similar results, enabling an accurate estimate for L/sub via/. The implementations, advantages, and disadvantages of each approach are compared.


Automatic setup for inductance measurement at IEN

Conference on Precision Electromagnetic Measurements. Conference Digest. CPEM 2000 (Cat. No.00CH37031), 2000

A measurement system that compares an unknown inductor to a standard AC resistor, based on the three-voltmeter method, is presented. The main features of the system are: a two-phase generator for energizing the standards, the four-terminal pair definition of both standards with automatic techniques, a switching unit to employ a single voltmeter, optical links for the distribution of frequency references. ...


A review of electro-magnetic tomography at UMIST

IEE Colloquium on Innovations in Instrumentation for Electrical Tomography, 1995

This paper describes the principle of operation of electromagnetic inductance tomography and a parallel field EMT system. Some recent research activities are also discussed.


A new inductance measurement method for permanent magnet synchronous linear motor

2014 17th International Conference on Electrical Machines and Systems (ICEMS), 2014

A new inductance measurement method for permanent magnet synchronous linear motor is proposed in this paper. Through the theoretical analysis, the relational expression between d- and q-axis inductance and the line voltage is derived. Therefore, we can obtain the accurate inductance value only by measuring the basic electrical parameters at two special mover positions. Compared with conventional inductance measurement methods, ...


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Educational Resources on Inductance measurement

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IEEE.tv Videos

IMS 2011 Microapps - A Comparison of Noise Parameter Measurement Techniques
IMS 2011 Microapps - Ultra Low Phase Noise Measurement Technique Using Innovative Optical Delay Lines
IMS 2011 Microapps - Waveguide Characteristics and Measurement Errors
IMS 2011 Microapps - Vector-Receiver Load Pull - Measurement Accuracy at its Best
I2MTC 2014 Conference Preview
IMS 2012 Microapps - Passive Intermodulation (PIM) measurement using vector network analyzer Osamu Kusano, Agilent CTD-Kobe
APEC 2012 - Thomas S. Buzak Plenary
The Josephson Effect: The Original SQUIDs
5G Wireless A Measurement and Metrology Perspective: MicroApps 2015 - Keysight Technologies
MicroApps: Recent Improvement on Y-Factor Noise Figure Measurement Uncertainty (Agilent Technologies)
Micro-Apps Keynote 2013: Modern RF Measurements and How They Drive Spectrum Analyzer Digital IF Processor Design
MicroApps: Measurement Advances for Differential and I/Q Devices (Agilent Technologies)
Innovative Transmission Line Measurement and Characterization Reduce Time to Repair for Complex Communication Systems: MicroApps 2015 - Keysight Technologies
Voltage Metrology with Superconductive Electronics
Inspiring Brilliance: Maxwell, field theory and the road to relativity and quantum theory
Brooklyn 5G Summit 2014: Channel Measurement and Modeling with Dr. Andy Nix and Dr. Mark Beach
The Josephson Effect: SQUIDs Then and Now: From SLUGS to Axions
National Strategic Computing Initiative - Carl Williams: 2016 International Conference on Rebooting Computing
IMS 2014: Wideband mmWave Channels: Implications for Design and Implementation of Adaptive Beam Antennas
Generating Stochastic Bits Using Tunable Quantum Systems - Erik Blair at INC 2019

IEEE-USA E-Books

  • Standard measuring device for thickness of silicon wafer based on laser compensation system

    Standard silicon wafer, which is standard instruments for semiconductors, large scale integrated circuits and photovoltaic industries, is the internationally accepted physical standard. The thickness of silicon wafer is directly related to the performance of integrated devices or performance of photoelectric conversion. In this paper, a standard measuring device for thickness of silicon wafer based on double-layer embedded table is introduced. With sensor compensation technology based on laser compensation principle, the inductance used in measurement is linearly compensated, resulting in improving the accuracy of standard silicon wafer thickness measurement. By measuring the standard silicon wafers with different diameter and thickness, the effectiveness of the method is verified.

  • Determining the inductance of a through-substrate via using multiple on-wafer test approaches

    Four on-wafer measurement approaches for determining the inductance, L/sub via/, of through-substrate vias used in gallium arsenide (GaAs) monolithic microwave integrated circuits (MMICs) have been implemented and compared. All of the approaches yielded similar results, enabling an accurate estimate for L/sub via/. The implementations, advantages, and disadvantages of each approach are compared.

  • Automatic setup for inductance measurement at IEN

    A measurement system that compares an unknown inductor to a standard AC resistor, based on the three-voltmeter method, is presented. The main features of the system are: a two-phase generator for energizing the standards, the four-terminal pair definition of both standards with automatic techniques, a switching unit to employ a single voltmeter, optical links for the distribution of frequency references. Measurements at metrological level have been performed at 1 kHz with inductors in the range 10 mH-1 H.

  • A review of electro-magnetic tomography at UMIST

    This paper describes the principle of operation of electromagnetic inductance tomography and a parallel field EMT system. Some recent research activities are also discussed.

  • A new inductance measurement method for permanent magnet synchronous linear motor

    A new inductance measurement method for permanent magnet synchronous linear motor is proposed in this paper. Through the theoretical analysis, the relational expression between d- and q-axis inductance and the line voltage is derived. Therefore, we can obtain the accurate inductance value only by measuring the basic electrical parameters at two special mover positions. Compared with conventional inductance measurement methods, the proposed method has the advantages of easy to implement, less measured parameters, high compatibility and so on. In order to verify the inductance measurement results, the finite element method is adopted as a reference model.

  • A Semianalytical Method to Determine Parasitic Elements of Quantum-Well Laser

    A parameter-extraction approach for the quantum- well laser, which combines the analytical approach and the empirical optimization procedure, is developed in this paper. The initial values of the parasitic pad capacitance and the feedline inductance are extracted by using a set of closed-form expressions derived from above-threshold mode input reflection coefficient on wafer measurement, and the extrinsic contact resistance and capacitance determined by using the analytical method are described as functions of the parasitic pad capacitance and the feedline inductance. Advanced Design System (Agilent commercial software) is then used to optimize only the parasitic pad capacitance and the feedline inductance with very small dispersions of initial values. An excellent fit between measured and simulated input reflection coefficients under cutoff and above-threshold biased conditions in the frequency range of 50 MHz-40 GHz is obtained.

  • Evaluation and comparison of mounted inductance for decoupling capacitor

    In this article, different patterns for decoupling capacitor routed on a dedicated test vehicle are compared. The aim of this study is, on one hand to confirm design rules for enhanced decoupling on printed circuit board and on the other hand, to estimate the value of the mounted inductance introduced by each pattern. Each mounting pattern and the particular parameter which is studied for each case will be described and measurement methodology as mounted inductance calculation will be presented. Then, mounted inductance calculated from measurement and results given by simulation are compared in order to see the precision reached by recent hybrid EM solver dedicated to Printed Circuit Board for parasitic elements calculation. Finally design rules and trade off for better decoupling are given as a conclusion.

  • Network representation of resonators for wireless power transfer

    We introduce a planar substrate-based resonator suitable for magnetic resonant wireless power transfer (WPT) applications. Its advantages are: flatness, limited space occupation, ease of manufacture, low cost and a relatively high Q. Resonators for WPT should operate by using magnetic field coupling and by avoiding external electric fields. In the proposed structure, the electric field is primarily confined inside the substrate, which acts as a capacitor; in this way we avoid unwanted radiation effects and electric field coupling with nearby dielectrics. The paper describes the resonator structure, the field and current distribution, suitable equivalent network modeling, and the mechanism for the resonator feeding. A few resonators, with Q of the order of 250-300, have been built, simulated, and measured confirming the validity of the proposed approach. The resonator structure is easily scalable at different frequencies.

  • A Interference Measuring Method for Zero Sequence Parameters of Transmission Lines and Its Application

    Based on interference sources, an anti-interference measurement method for the zero sequence parameters of transmission lines is studied. The principle, measurement method and calculation formula of this method are explained in detail. The hardware structure of the measurement system and digital simulation results are given. Finally, an example of using the method to measure the zero sequence parameters of two 500 kV transmission lines with mutual inductance in a power grid of East China is given. The measurement results are compared with the increment measurement results. Field measurement results have proven that this method can meet the needs of accurately measuring the zero sequence impedances of transmission lines.

  • Progress on BEV foil shunts for AC-DC current transfer

    Ten years ago the international community started the expansion of the measurement range for ac-dc current transfer from 20 A to a present level of 100 A at frequencies up to 100 kHz with uncertainties of around 100 μA/A. At BEV coaxial current shunts based on resistive foils as well as low inductance tee connectors suitable to compare the shunts were fabricated [1]. This paper describes progress in the theory and practice of these shunts and tees within the last decade.



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