Green cleaning

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Green cleaning refers to using cleaning methods and products with environmentally-friendly ingredients to preserve human health and environmental quality. (Wikipedia.org)






Conferences related to Green cleaning

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2023 Annual International Conference of the IEEE Engineering in Medicine & Biology Conference (EMBC)

The conference program will consist of plenary lectures, symposia, workshops and invitedsessions of the latest significant findings and developments in all the major fields of biomedical engineering.Submitted full papers will be peer reviewed. Accepted high quality papers will be presented in oral and poster sessions,will appear in the Conference Proceedings and will be indexed in PubMed/MEDLINE.


2020 IEEE Energy Conversion Congress and Exposition (ECCE)

IEEE-ECCE 2020 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE-ECCE 2019 brings together practicing engineers, researchers, entrepreneurs and other professionals for interactive and multi-disciplinary discussions on the latest advances in energy conversion technologies. The Conference provides a unique platform for promoting your organization.

  • 2018 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of ECCE 2018 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energyconversion, industrial power and power electronics.

  • 2017 IEEE Energy Conversion Congress and Exposition (ECCE)

    ECCE is the premier global conference covering topics in energy conversion from electric machines, power electronics, drives, devices and applications both existing and emergent

  • 2016 IEEE Energy Conversion Congress and Exposition (ECCE)

    The Energy Conversion Congress and Exposition (ECCE) is focused on research and industrial advancements related to our sustainable energy future. ECCE began as a collaborative effort between two societies within the IEEE: The Power Electronics Society (PELS) and the Industrial Power Conversion Systems Department (IPCSD) of the Industry Application Society (IAS) and has grown to the premier conference to discuss next generation technologies.

  • 2015 IEEE Energy Conversion Congress and Exposition

    The scope of ECCE 2015 includes all technical aspects of research, design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power and power electronics.

  • 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

    Those companies who have an interest in selling to: research engineers, application engineers, strategists, policy makers, and innovators, anyone with an interest in energy conversion systems and components.

  • 2013 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the congress interests include all technical aspects of the design, manufacture, application and marketing of devices, components, circuits and systems related to energy conversion, industrial power conversion and power electronics.

  • 2012 IEEE Energy Conversion Congress and Exposition (ECCE)

    The IEEE Energy Conversion Congress and Exposition (ECCE) will be held in Raleigh, the capital of North Carolina. This will provide a forum for the exchange of information among practicing professionals in the energy conversion business. This conference will bring together users and researchers and will provide technical insight as well.

  • 2011 IEEE Energy Conversion Congress and Exposition (ECCE)

    IEEE 3rd Energy Conversion Congress and Exposition follows the inagural event held in San Jose, CA in 2009 and 2nd meeting held in Atlanta, GA in 2010 as the premier conference dedicated to all aspects of energy processing in industrial, commercial, transportation and aerospace applications. ECCE2011 has a strong empahasis on renewable energy sources and power conditioning, grid interactions, power quality, storage and reliability.

  • 2010 IEEE Energy Conversion Congress and Exposition (ECCE)

    This conference covers all areas of electrical and electromechanical energy conversion. This includes power electrics, power semiconductors, electric machines and drives, components, subsystems, and applications of energy conversion systems.

  • 2009 IEEE Energy Conversion Congress and Exposition (ECCE)

    The scope of the conference include all technical aspects of the design, manufacture, application and marketing of devices, circuits, and systems related to electrical energy conversion technology


2020 IEEE Power & Energy Society General Meeting (PESGM)

The Annual IEEE PES General Meeting will bring together over 2900 attendees for technical sessions, administrative sessions, super sessions, poster sessions, student programs, awards ceremonies, committee meetings, tutorials and more


2020 IEEE/MTT-S International Microwave Symposium (IMS)

The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2036 IEEE/MTT-S International Microwave Symposium - IMS 2036

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2031 IEEE/MTT-S International Microwave Symposium - IMS 2031

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2029 IEEE/MTT-S International Microwave Symposium - IMS 2029

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2026 IEEE/MTT-S International Microwave Symposium - IMS 2026

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025

    The IEEE International Microwave Symposium (IMS) is the world s foremost conferencecovering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies;encompassing everything from basic technologies to components to systems including thelatest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulationand more. The IMS includes technical and interactive sessions, exhibits, student competitions,panels, workshops, tutorials, and networking events.

  • 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2021 IEEE/MTT-S International Microwave Symposium - IMS 2021

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2019 IEEE/MTT-S International Microwave Symposium - IMS 2019

    Comprehensive symposium on microwave theory and techniques including active and passive circuit components, theory and microwave systems.

  • 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018

    Microwave theory and techniques, RF/microwave/millimeter-wave/terahertz circuit design and fabrication technology, radio/wireless communication.

  • 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.

  • 2016 IEEE/MTT-S International Microwave Symposium - IMS 2016

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2015 IEEE/MTT-S International Microwave Symposium - MTT 2015

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter-wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics. The IMS includes technical sessions, both oral and interactive, worksh

  • 2014 IEEE/MTT-S International Microwave Symposium - MTT 2014

    IMS2014 will cover developments in microwave technology from nano devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered.

  • 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013

    The IEEE MTT-S International Microwave Symposium (IMS) is the premier conference covering basic technologies, to passives and actives components to system over a wide range of frequencies including VHF, UHF, RF, microwave, millimeter -wave, terahertz, and optical. The conference will encompass the latest in RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation, wireless systems, RFID and related topics.The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2011 IEEE/MTT-S International Microwave Symposium - MTT 2011

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2010 IEEE/MTT-S International Microwave Symposium - MTT 2010

    Reports of research and development at the state-of-the-art of the theory and techniques related to the technology and applications of devices, components, circuits, modules and systems in the RF, microwave, millimeter-wave, submillimeter-wave and Terahertz ranges of the electromagnetic spectrum.

  • 2009 IEEE/MTT-S International Microwave Symposium - MTT 2009

    The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events.

  • 2008 IEEE/MTT-S International Microwave Symposium - MTT 2008

  • 2007 IEEE/MTT-S International Microwave Symposium - MTT 2007

  • 2006 IEEE/MTT-S International Microwave Symposium - MTT 2006

  • 2005 IEEE/MTT-S International Microwave Symposium - MTT 2005

  • 2004 IEEE/MTT-S International Microwave Symposium - MTT 2004

  • 2003 IEEE/MTT-S International Microwave Symposium - MTT 2003

  • 2002 IEEE/MTT-S International Microwave Symposium - MTT 2002

  • 2001 IEEE/MTT-S International Microwave Symposium - MTT 2001

  • 2000 IEEE/MTT-S International Microwave Symposium - MTT 2000

  • 1999 IEEE/MTT-S International Microwave Symposium - MTT '99

  • 1998 IEEE/MTT-S International Microwave Symposium - MTT '98

  • 1997 IEEE/MTT-S International Microwave Symposium - MTT '97

  • 1996 IEEE/MTT-S International Microwave Symposium - MTT '96


2020 IEEE/PES Transmission and Distribution Conference and Exposition (T&D)

Bi-Annual IEEE PES T&D conference. Largest T&D conference in North America.


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Periodicals related to Green cleaning

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Green cleaning

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Xplore Articles related to Green cleaning

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The Practice of Digital City Management System in Hangzhou

2009 International Conference on Management and Service Science, 2009

During City Regeneration Program of Hangzhou, a digital city management system was created in order to improve the effective of city management. The system is a significant part in regeneration program. The system realized the digital-object, digital-subject and digital-component. It is a public participateble system, which integrated and distributed city resource in an equal way. It is a system guided ...


Surface modification by cathode spots of a vacuum arc

IEEE Transactions on Plasma Science, 2001

Cathode spots of a vacuum arc have the efficient property to remove oxide on the metal surface selectively. Analyses of the surface treated by vacuum arc revealed that various interesting surface modifications occurred during the removal of oxide. We have investigated these effects to open new applications of the vacuum arc. The cathode spots can remove inclusions, which often cause ...


Tooling for wafer and photomask cleaning and surface preparation using a dry, laser-assisted technology

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1996

The semiconductor industry is entering into an era of global competitiveness that needs to factor in the economics of capital and operational costs along with environmental compliance to operate profitable fabricators. Innovative manufacturing technologies will be required to meet the technological and cost requirements. This paper introduces a new technology for cleaning and surface preparation called the Radiance Process. It ...


Environmentally Friendly Single-Wafer Spin Cleaning Using Ultra-diluted HF/Nitrogen Jet Spray without Causing Structural Damage and Material Loss

2006 IEEE International Symposium on Semiconductor Manufacturing, 2006

We have developed an ultra-diluted HF/nitrogen jet spray cleaning procedure for single-wafer spin cleaning, which can efficiently remove particulate and metallic contaminants in a short period of time from both silicon and silicon- dioxide surfaces without causing damage to fragile 45 nm polysilicon gate structures. The use of a very low HF concentration makes the silicon and oxide losses negligible. ...


Laser removal of particles using tunable wavelength

Conference Digest. 2000 Conference on Lasers and Electro-Optics Europe (Cat. No.00TH8505), 2000

Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possible environmental problems as well as introducing possible changes in surface profile. Therefore steps have been taken to introduce new techniques that ...


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Educational Resources on Green cleaning

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IEEE-USA E-Books

  • The Practice of Digital City Management System in Hangzhou

    During City Regeneration Program of Hangzhou, a digital city management system was created in order to improve the effective of city management. The system is a significant part in regeneration program. The system realized the digital-object, digital-subject and digital-component. It is a public participateble system, which integrated and distributed city resource in an equal way. It is a system guided by city governance concept. The practice will help the complex city create a new harmonious management mechanism.

  • Surface modification by cathode spots of a vacuum arc

    Cathode spots of a vacuum arc have the efficient property to remove oxide on the metal surface selectively. Analyses of the surface treated by vacuum arc revealed that various interesting surface modifications occurred during the removal of oxide. We have investigated these effects to open new applications of the vacuum arc. The cathode spots can remove inclusions, which often cause surface defects. They attack not only oxide but also carbide inclusions and eliminate them from the surface by evaporation. Removal of organic compounds is also possible. Degreasing (removal of grease) proceeds in parallel to the removal of oxide. The vacuum arc treatment results in the remarkable increase of hardness in the surface layer due to the rapid heating and quenching.

  • Tooling for wafer and photomask cleaning and surface preparation using a dry, laser-assisted technology

    The semiconductor industry is entering into an era of global competitiveness that needs to factor in the economics of capital and operational costs along with environmental compliance to operate profitable fabricators. Innovative manufacturing technologies will be required to meet the technological and cost requirements. This paper introduces a new technology for cleaning and surface preparation called the Radiance Process. It operates under quantum mechanical principles using only photons of light and a laminar flowing inert gas, which makes it environmentally friendly. The technology has been demonstrated to remove the following types of contamination in a one-step process that does not damage the underlying surface: Particles (organic, inorganic and metallic), metallic ions, oxides, and thin films (organic and inorganic). With its inherent simplicity, flexibility, and modular tool design, the technology can accommodate stand-alone and cluster modules as well as multiple substrate dimensions. Projected cost-of-ownership figures indicate that this technology is significantly less expensive than current wet-chemical-based processes because infrastructure for water and chemical usage and disposal is not required. This paper describes our technology, its developmental results, tool design and projected cost-of-ownership figures.

  • Environmentally Friendly Single-Wafer Spin Cleaning Using Ultra-diluted HF/Nitrogen Jet Spray without Causing Structural Damage and Material Loss

    We have developed an ultra-diluted HF/nitrogen jet spray cleaning procedure for single-wafer spin cleaning, which can efficiently remove particulate and metallic contaminants in a short period of time from both silicon and silicon- dioxide surfaces without causing damage to fragile 45 nm polysilicon gate structures. The use of a very low HF concentration makes the silicon and oxide losses negligible. This very simple single-step cleaning procedure drastically reduces the chemical and water consumption as well as electrical energy per wafer due to the short spraying time with the ultra-diluted HF at room temperature. HF wastewater, the only effluent of this cleaning, is recycled by forming CaF<sub>2</sub>, which can be a raw material for HF or Portland cement, so this cleaning meets the requirements with respect to the environmental control.

  • Laser removal of particles using tunable wavelength

    Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possible environmental problems as well as introducing possible changes in surface profile. Therefore steps have been taken to introduce new techniques that do not pose any of these problems, one such technique is to use lasers. Laser cleaning is versatile, controllable, selective and environmentally friendly.

  • Effect of pressure on the behavior of cathode spots in oxide removal by are discharge

    The cathode spots of a vacuum arc have smart properties such as preferential attack against oxides and their selective removal. Recently cathode spots have been used for cleaning metal surface before the application of coating or prior to surface modification. The effects of pressure on the cleaning action of the cathode spots were investigated in a wide pressure range from 10 to 2000 Pa of insert atmosphere. Experiments were carried out by using hot rolled steel plates, the surfaces of which were covered with thick oxide of 5-10 μm. Experimental observation revealed the following results: (1) The vacuum arc phenomenon of cathode spots is confirmed even under a pressure as high as 20000 Pa. (2) The number of cathode spots on the oxide surface increased with the increase of pressure in the range of 10 ˜2000 Pa. (3) The removal rate of oxide decreased with the increase of pressure. AI pressures higher than 10000 Pa, the cleaning action (oxide removal) by the cathode spots was only negligibly observed. (4) The cathode spot energy density may possibly decrease with an increase in pressure. (5) The higher the pressure increase, the smaller area the movement of the cathode spots was restricted to. The cleaning area decreased with the increase of pressure.

  • Overcoming the barriers to cleaning with bubble-free ozonated de-ionized water

    The need for significant reductions in water consumption as 300 mm wafer processes are commercialized is driving the development of revolutionary new wet cleaning processes. Most of these new processes incorporate ozonated de- ionized water as a key processing step. The use of membrane contactors to infuse ozone into water uniquely enables the production of bubble-free de- ionized water. Bubble-free ozonated fluids are the critical enabling technology for the next generation of critical cleaning.

  • Novel photo resist stripping for single wafer environmentally friendly process

    We have developed the resist stripping method having an extremely high stripping performance by single wafer process (SHARK Cleaning). In this study, we tried the improvement of the running cost that was the disadvantage of the SHARK cleaning. As a result, we drastically improved the chemical consumption maintaining the resist stripping performance by heating H/sub 2/SO/sub 4/ and optimizing the mixture ratio of the chemicals. Therefore, a cost reduction and environmentally friendly process with a high stripping performance were possible.

  • An approach to cleaning of dry etching residues with supercritical carbon dioxide

    This work demonstrates that surfactant aided supercritical CO<sub>2</sub> cleaning can effectively apply to the removal of dry etching residues. A benefit of this process is from an environmental as well as technological perspective. It allows dramatic reduction in water and chemical consumptions while enabling the construction of tiny features in semiconductors and weak microstructures in MEMS devices.

  • Challenges and solutions of post etch post ash residue removal

    Wet cleaning technology plays a critical role in IC industry, and takes up around 30% of whole process. With the critical dimension continuous shrinking, there are many additional requirements exposed. Among BEOL (back end of line) post etch post ash residue removal technology, galvanic corrosion elimination, low geometry via cleaning, pad crystal defect reduction and environment friendly are the major requirements. But the conventional cleaning technologies are challenging to meet them. In this paper, we will share our studies of key aspects in post etch post ash residue removal system, such as: surface energy reduction, substrate materials protection and being environmental conscientious. By those studies, the challenges are addressed, and improved performance for both organic and inorganic residues removal is achieved. Further more, environmental distress caused by chemistry is reduced.



Standards related to Green cleaning

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No standards are currently tagged "Green cleaning"


Jobs related to Green cleaning

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