Green cleaning

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Green cleaning refers to using cleaning methods and products with environmentally-friendly ingredients to preserve human health and environmental quality. (Wikipedia.org)






Conferences related to Green cleaning

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2020 IEEE/PES Transmission and Distribution Conference and Exposition (T&D)

Bi-Annual IEEE PES T&D conference. Largest T&D conference in North America.


2019 14th IEEE Conference on Industrial Electronics and Applications (ICIEA)

Artificial Intelligence, Control and Systems, Cyber-physical Systems, Energy and Environment, Industrial Informatics and Computational Intelligence, Robotics, Network and Communication Technologies, Power Electronics, Signal and Information Processing


2019 16th International Conference on the European Energy Market (EEM)

The EEM is a well-established conference in Europe, which brings together international representatives from science, industry and politics from different fields to discuss a wide range of issues related to energy markets. These include not only topics concerning methodological aspects of modelling, such as mathematical formulations and solution approaches, but also those related to market design, regulatory and climate policies. Additionally, the conference offers a platform for engaging discussions related to policies and challenges in the energy sector. The conference is following the energy trends and will include new developments in the fields od Local Energy Communites and Energy Efficiency.

  • 2018 15th International Conference on the European Energy Market (EEM)

    The European Energy Market is the international conference dealing with energy markets and operation of power systems in the competitive environment. The scope of the conference includes:electricity market design, regulation and monitoring;technical aspects of electricity market operation, operation, modelling, forecasting and simulation of commodity, technical and financial markets;implementation of the European energy and climate policy;infrastructure development and asset management;presence and future of gas and coal markets;Operation, modeling, forecasting and simulation of commodity;Technical and financial markets

  • 2017 14th International Conference on the European Energy Market (EEM)

    European Energy Markets

  • 2016 13th International Conference on the European Energy Market (EEM)

    Following the editions in Leuven in 2009, in Madrid in 2010, in Zagreb in 2011, in Florence in 2012, in Stockholm in 2013, in Krakow in 2014 and in Lisbon in 2015, EEM Conferences have already established a strong tradition in Europe and in the world in terms of building a forum to exchange ideas and to discuss a wide range of issues related with energy markets, not only associated with different types of mathematical formulations and solution approaches, but also directed to market design, regulatory policies, integration of DER and climate change as well as foresee and debate changes and challenges that this sector will most likely go through in the near and longer terms.

  • 2015 12th International Conference on the European Energy Market (EEM)

    Energy markets

  • 2014 11th International Conference on the European Energy Market (EEM)

    The conference is devoted to the design process and operation of the electricity market, gas market and carbon market, as well as related financial market related to the European and world power sector.

  • 2013 10th International Conference on the European Energy Market (EEM 2013)

    The International Conference on the European Energy Market is a premier forum for the exchange of ideas, open and direct discussion on the development of the energy markets in Europe. It has achieved a considerable success during the past nine editions covering the electricity and gas markets policies and experiences, climate change impacts on the sector and developments at the European level.

  • 2012 9th International Conference on the European Energy Market (EEM 2012)

    The focus os this conference is to bring high-level personalities, experts, researchers together to share information and to discuss the development of the energy sector in a market environment and the creation of the common European Energy Market.

  • 2011 European Energy Market (EEM)

    The International Conference on the European Energy Market (EEM) is a premier forum to discuss the development of the energy sector in a market environment and the creation of the common European Energy Market.

  • 2010 7th International Conference on the European Energy Market (EEM 2010)

    The International Conference on the European Energy Market (EEM) is a premier forum to discuss the development of the energy sector in a market environment and the creation of the common European Energy Market. It has achieved a considerable success during the past six editions covering the electricity and gas markets policies and experiences, climate change impacts on the sector and developments at the European level.

  • 2009 6th International Conference on the European Energy Market (EEM 2009)

    Electricity market policies, structures and rules; Transmission and distribution systems; Renewable energies and distributed generation (DG); Towards a fully functioning IEM; Gas, carbon and financial markets.

  • 2008 5th International Conference on the European Electricity Market (EEM 2008)

    The International Conference on the European Electricity Market - EEM is a premier forum for sharing information about the role of policy makers, the view of market players, the new technological developments and contribution from the latest academic research on the electricity and gas markets policies and experiences, climate change impact on the sector, new technologies and trends.


2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

ASMC is the leading international technical conferences for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing has been a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results.


2019 41st Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)

The conference program will consist of plenary lectures, symposia, workshops andinvitedsessions of the latest significant findings and developments in all the major fields ofbiomedical engineering.Submitted papers will be peer reviewed. Accepted high quality paperswill be presented in oral and postersessions, will appear in the Conference Proceedings and willbe indexed in PubMed/MEDLINE & IEEE Xplore


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Periodicals related to Green cleaning

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Antennas and Wireless Propagation Letters, IEEE

IEEE Antennas and Wireless Propagation Letters (AWP Letters) will be devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation.


Communications Magazine, IEEE

IEEE Communications Magazine was the number three most-cited journal in telecommunications and the number eighteen cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Institute for Scientific Information. Read more at http://www.ieee.org/products/citations.html. This magazine covers all areas of communications such as lightwave telecommunications, high-speed data communications, personal communications ...


Dielectrics and Electrical Insulation, IEEE Transactions on

Electrical insulation common to the design and construction of components and equipment for use in electric and electronic circuits and distribution systems at all frequencies.


Electron Device Letters, IEEE

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronic devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


Electron Devices, IEEE Transactions on

Publishes original and significant contributions relating to the theory, design, performance and reliability of electron devices, including optoelectronics devices, nanoscale devices, solid-state devices, integrated electronic devices, energy sources, power devices, displays, sensors, electro-mechanical devices, quantum devices and electron tubes.


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Most published Xplore authors for Green cleaning

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Xplore Articles related to Green cleaning

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The Practice of Digital City Management System in Hangzhou

2009 International Conference on Management and Service Science, 2009

During City Regeneration Program of Hangzhou, a digital city management system was created in order to improve the effective of city management. The system is a significant part in regeneration program. The system realized the digital-object, digital-subject and digital-component. It is a public participateble system, which integrated and distributed city resource in an equal way. It is a system guided ...


Surface modification by cathode spots of a vacuum arc

IEEE Transactions on Plasma Science, 2001

Cathode spots of a vacuum arc have the efficient property to remove oxide on the metal surface selectively. Analyses of the surface treated by vacuum arc revealed that various interesting surface modifications occurred during the removal of oxide. We have investigated these effects to open new applications of the vacuum arc. The cathode spots can remove inclusions, which often cause ...


Tooling for wafer and photomask cleaning and surface preparation using a dry, laser-assisted technology

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1996

The semiconductor industry is entering into an era of global competitiveness that needs to factor in the economics of capital and operational costs along with environmental compliance to operate profitable fabricators. Innovative manufacturing technologies will be required to meet the technological and cost requirements. This paper introduces a new technology for cleaning and surface preparation called the Radiance Process. It ...


Environmentally Friendly Single-Wafer Spin Cleaning Using Ultra-diluted HF/Nitrogen Jet Spray without Causing Structural Damage and Material Loss

2006 IEEE International Symposium on Semiconductor Manufacturing, 2006

We have developed an ultra-diluted HF/nitrogen jet spray cleaning procedure for single-wafer spin cleaning, which can efficiently remove particulate and metallic contaminants in a short period of time from both silicon and silicon- dioxide surfaces without causing damage to fragile 45 nm polysilicon gate structures. The use of a very low HF concentration makes the silicon and oxide losses negligible. ...


Laser removal of particles using tunable wavelength

Conference Digest. 2000 Conference on Lasers and Electro-Optics Europe (Cat. No.00TH8505), 2000

Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possible environmental problems as well as introducing possible changes in surface profile. Therefore steps have been taken to introduce new techniques that ...


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Educational Resources on Green cleaning

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IEEE-USA E-Books

  • The Practice of Digital City Management System in Hangzhou

    During City Regeneration Program of Hangzhou, a digital city management system was created in order to improve the effective of city management. The system is a significant part in regeneration program. The system realized the digital-object, digital-subject and digital-component. It is a public participateble system, which integrated and distributed city resource in an equal way. It is a system guided by city governance concept. The practice will help the complex city create a new harmonious management mechanism.

  • Surface modification by cathode spots of a vacuum arc

    Cathode spots of a vacuum arc have the efficient property to remove oxide on the metal surface selectively. Analyses of the surface treated by vacuum arc revealed that various interesting surface modifications occurred during the removal of oxide. We have investigated these effects to open new applications of the vacuum arc. The cathode spots can remove inclusions, which often cause surface defects. They attack not only oxide but also carbide inclusions and eliminate them from the surface by evaporation. Removal of organic compounds is also possible. Degreasing (removal of grease) proceeds in parallel to the removal of oxide. The vacuum arc treatment results in the remarkable increase of hardness in the surface layer due to the rapid heating and quenching.

  • Tooling for wafer and photomask cleaning and surface preparation using a dry, laser-assisted technology

    The semiconductor industry is entering into an era of global competitiveness that needs to factor in the economics of capital and operational costs along with environmental compliance to operate profitable fabricators. Innovative manufacturing technologies will be required to meet the technological and cost requirements. This paper introduces a new technology for cleaning and surface preparation called the Radiance Process. It operates under quantum mechanical principles using only photons of light and a laminar flowing inert gas, which makes it environmentally friendly. The technology has been demonstrated to remove the following types of contamination in a one-step process that does not damage the underlying surface: Particles (organic, inorganic and metallic), metallic ions, oxides, and thin films (organic and inorganic). With its inherent simplicity, flexibility, and modular tool design, the technology can accommodate stand-alone and cluster modules as well as multiple substrate dimensions. Projected cost-of-ownership figures indicate that this technology is significantly less expensive than current wet-chemical-based processes because infrastructure for water and chemical usage and disposal is not required. This paper describes our technology, its developmental results, tool design and projected cost-of-ownership figures.

  • Environmentally Friendly Single-Wafer Spin Cleaning Using Ultra-diluted HF/Nitrogen Jet Spray without Causing Structural Damage and Material Loss

    We have developed an ultra-diluted HF/nitrogen jet spray cleaning procedure for single-wafer spin cleaning, which can efficiently remove particulate and metallic contaminants in a short period of time from both silicon and silicon- dioxide surfaces without causing damage to fragile 45 nm polysilicon gate structures. The use of a very low HF concentration makes the silicon and oxide losses negligible. This very simple single-step cleaning procedure drastically reduces the chemical and water consumption as well as electrical energy per wafer due to the short spraying time with the ultra-diluted HF at room temperature. HF wastewater, the only effluent of this cleaning, is recycled by forming CaF<sub>2</sub>, which can be a raw material for HF or Portland cement, so this cleaning meets the requirements with respect to the environmental control.

  • Laser removal of particles using tunable wavelength

    Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possible environmental problems as well as introducing possible changes in surface profile. Therefore steps have been taken to introduce new techniques that do not pose any of these problems, one such technique is to use lasers. Laser cleaning is versatile, controllable, selective and environmentally friendly.

  • Effect of pressure on the behavior of cathode spots in oxide removal by are discharge

    The cathode spots of a vacuum arc have smart properties such as preferential attack against oxides and their selective removal. Recently cathode spots have been used for cleaning metal surface before the application of coating or prior to surface modification. The effects of pressure on the cleaning action of the cathode spots were investigated in a wide pressure range from 10 to 2000 Pa of insert atmosphere. Experiments were carried out by using hot rolled steel plates, the surfaces of which were covered with thick oxide of 5-10 μm. Experimental observation revealed the following results: (1) The vacuum arc phenomenon of cathode spots is confirmed even under a pressure as high as 20000 Pa. (2) The number of cathode spots on the oxide surface increased with the increase of pressure in the range of 10 ˜2000 Pa. (3) The removal rate of oxide decreased with the increase of pressure. AI pressures higher than 10000 Pa, the cleaning action (oxide removal) by the cathode spots was only negligibly observed. (4) The cathode spot energy density may possibly decrease with an increase in pressure. (5) The higher the pressure increase, the smaller area the movement of the cathode spots was restricted to. The cleaning area decreased with the increase of pressure.

  • Overcoming the barriers to cleaning with bubble-free ozonated de-ionized water

    The need for significant reductions in water consumption as 300 mm wafer processes are commercialized is driving the development of revolutionary new wet cleaning processes. Most of these new processes incorporate ozonated de- ionized water as a key processing step. The use of membrane contactors to infuse ozone into water uniquely enables the production of bubble-free de- ionized water. Bubble-free ozonated fluids are the critical enabling technology for the next generation of critical cleaning.

  • Novel photo resist stripping for single wafer environmentally friendly process

    We have developed the resist stripping method having an extremely high stripping performance by single wafer process (SHARK Cleaning). In this study, we tried the improvement of the running cost that was the disadvantage of the SHARK cleaning. As a result, we drastically improved the chemical consumption maintaining the resist stripping performance by heating H/sub 2/SO/sub 4/ and optimizing the mixture ratio of the chemicals. Therefore, a cost reduction and environmentally friendly process with a high stripping performance were possible.

  • An approach to cleaning of dry etching residues with supercritical carbon dioxide

    This work demonstrates that surfactant aided supercritical CO<sub>2</sub> cleaning can effectively apply to the removal of dry etching residues. A benefit of this process is from an environmental as well as technological perspective. It allows dramatic reduction in water and chemical consumptions while enabling the construction of tiny features in semiconductors and weak microstructures in MEMS devices.

  • Challenges and solutions of post etch post ash residue removal

    Wet cleaning technology plays a critical role in IC industry, and takes up around 30% of whole process. With the critical dimension continuous shrinking, there are many additional requirements exposed. Among BEOL (back end of line) post etch post ash residue removal technology, galvanic corrosion elimination, low geometry via cleaning, pad crystal defect reduction and environment friendly are the major requirements. But the conventional cleaning technologies are challenging to meet them. In this paper, we will share our studies of key aspects in post etch post ash residue removal system, such as: surface energy reduction, substrate materials protection and being environmental conscientious. By those studies, the challenges are addressed, and improved performance for both organic and inorganic residues removal is achieved. Further more, environmental distress caused by chemistry is reduced.



Standards related to Green cleaning

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No standards are currently tagged "Green cleaning"


Jobs related to Green cleaning

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